{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T02:20:45Z","timestamp":1774664445728,"version":"3.50.1"},"reference-count":12,"publisher":"Elsevier BV","issue":"6","license":[{"start":{"date-parts":[[2003,6,1]],"date-time":"2003-06-01T00:00:00Z","timestamp":1054425600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,6]]},"DOI":"10.1016\/s0026-2714(03)00074-x","type":"journal-article","created":{"date-parts":[[2003,5,19]],"date-time":"2003-05-19T18:45:52Z","timestamp":1053369952000},"page":"913-923","source":"Crossref","is-referenced-by-count":37,"title":["Direct gold and copper wires bonding on copper"],"prefix":"10.1016","volume":"43","author":[{"given":"Hong Meng","family":"Ho","sequence":"first","affiliation":[]},{"given":"Wai","family":"Lam","sequence":"additional","affiliation":[]},{"given":"Serguei","family":"Stoukatch","sequence":"additional","affiliation":[]},{"given":"Petar","family":"Ratchev","sequence":"additional","affiliation":[]},{"suffix":"III","given":"Charles J.","family":"Vath","sequence":"additional","affiliation":[]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(03)00074-X_BIB1","unstructured":"Eda H, Arai M, Matsumoto T. IBM\u2019s famed Cu wiring ignites chip process war. Special Report, Nikkei Electronics Asia, May 2000. p. 44\u201354"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB2","series-title":"Wire bonding in microelectronics materials, processes, reliability and yield","author":"Harman","year":"1997"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB3","unstructured":"Lim LA, Castaneda J, Shirakawa S. Fine pitch copper wire bonding process and materials study. Available from: <http:\/\/www.smallprecisiontools.com\/Cu_wb.html>"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB4","unstructured":"Notzli J, Berchtold H, Van Mulken F. Copper wire ultra fine pitch bonding\u2013\u2013the natural progression in IC assembly technology. Available from: <http:\/\/www.smallprecisiontools.com\/Cu_wire_ufpb.html>"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB5","unstructured":"Eills TW, Levine L, Wicen R, Ainouz L. Copper wire bonding. Available from: <http:\/\/www.kns.com\/resources\/library\/lib-copper.asppage>"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB6","unstructured":"Harman GG, Johnson CE. Wire bonding to advanced copper-low-k integrated circuits, the metal\/dielectric stacks, and material considerations. In: Proc. 34th International Symposium on Microelectronics, IMAPS 2001, Baltimore, USA, 9\u201311 October 2001"},{"issue":"6","key":"10.1016\/S0026-2714(03)00074-X_BIB7","doi-asserted-by":"crossref","first-page":"1856","DOI":"10.1149\/1.1838567","article-title":"Protection of copper corrosion by an ultrathin two-dimensional polymer film of alkanethiol monolayer","volume":"145","author":"Haneda","year":"1998","journal-title":"J. Electrochem. Soc."},{"key":"10.1016\/S0026-2714(03)00074-X_BIB8","unstructured":"Whelan CM, Kinsella M, Carbonell L, Ho HM, Maex K. Corrosion inhibition by thiol-derived self-assembled monolayers: enhanced wire bonding on Cu surfaces. European Workshop on Materials for Advanced Metallization, MAM2003, 9\u201312 March, La Londe les Maures, France, in press"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB9","series-title":"Electron backscatter diffraction in materials science","author":"Schwartz","year":"2000"},{"issue":"1","key":"10.1016\/S0026-2714(03)00074-X_BIB10","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1016\/S0167-9317(02)00771-2","article-title":"Dry oxidation mechanism of copper in trenches","volume":"64","author":"Carbonell","year":"2002","journal-title":"Microelectron. Engng."},{"key":"10.1016\/S0026-2714(03)00074-X_BIB11","doi-asserted-by":"crossref","unstructured":"Ratchev P, Carbonell L, Ho HM, De Wolf I, Verlinden B. Orientation imaging microscopy applications in Cu-interconnect and Cu\u2013Cu wire bonding. In: Proc. 28th International Symposium for Testing and Failure Analysis, ISTFA 2002, Phoenix, Arizona, 3\u20137 November 2002. p. 61\u201366","DOI":"10.31399\/asm.cp.istfa2002p0061"},{"key":"10.1016\/S0026-2714(03)00074-X_BIB12","unstructured":"Ratchev P, Van De Peer M, Ho HM, De Wolf I, Verlinden B. Effect of recrystallization on reliability of Cu\u2013Cu wire bonds. ISTFA2003 (29th ISTFA), 3\u20137 November, Santa Clara, California USA, in press"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S002627140300074X?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S002627140300074X?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2021,6,7]],"date-time":"2021-06-07T03:52:05Z","timestamp":1623037925000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S002627140300074X"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,6]]},"references-count":12,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2003,6]]}},"alternative-id":["S002627140300074X"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(03)00074-x","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,6]]}}}