{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,1,16]],"date-time":"2024-01-16T06:02:25Z","timestamp":1705384945946},"reference-count":19,"publisher":"Elsevier BV","issue":"7","license":[{"start":{"date-parts":[[2003,7,1]],"date-time":"2003-07-01T00:00:00Z","timestamp":1057017600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,7]]},"DOI":"10.1016\/s0026-2714(03)00099-4","type":"journal-article","created":{"date-parts":[[2003,5,28]],"date-time":"2003-05-28T00:59:59Z","timestamp":1054083599000},"page":"1125-1136","source":"Crossref","is-referenced-by-count":10,"title":["Three-dimensional FEM simulations of thermomechanical stresses in 1.55 \u03bcm Laser modules"],"prefix":"10.1016","volume":"43","author":[{"given":"Y.","family":"Deshayes","sequence":"first","affiliation":[]},{"given":"L.","family":"Bechou","sequence":"additional","affiliation":[]},{"given":"J.Y.","family":"Deletage","sequence":"additional","affiliation":[]},{"given":"F.","family":"Verdier","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Danto","sequence":"additional","affiliation":[]},{"given":"D.","family":"Laffitte","sequence":"additional","affiliation":[]},{"given":"J.L.","family":"Goudard","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(03)00099-4_BIB1","doi-asserted-by":"crossref","unstructured":"Sherry WM, Gaebe C, Miller TJ, Schweizer RC. High performance optoelectronic packaging for 2.5 and 10 Gb\/s Laser modules. In: Electronic Components and Technology Conference, 1996. p. 620\u20137","DOI":"10.1109\/ECTC.1996.517449"},{"key":"10.1016\/S0026-2714(03)00099-4_BIB2","doi-asserted-by":"crossref","unstructured":"Breedis JB. Monte Carlo tolerance analysis of a passively aligned silicon waferboard package. In: Electronic Components and Technology Conference, 2001. p. 247\u201354","DOI":"10.1109\/ECTC.2001.927731"},{"key":"10.1016\/S0026-2714(03)00099-4_BIB3","doi-asserted-by":"crossref","unstructured":"Jang S. Packaging of photonic devices using Laser welding. In: Proc SPIE, 1996. p. 138\u201349","DOI":"10.1117\/12.230077"},{"key":"10.1016\/S0026-2714(03)00099-4_BIB4","doi-asserted-by":"crossref","first-page":"1701","DOI":"10.1016\/S0026-2714(00)00162-1","article-title":"Reliability of optoelectronic components for telecommunications","volume":"40","author":"Sauvage","year":"2000","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB5","doi-asserted-by":"crossref","first-page":"293","DOI":"10.1023\/A:1006966021861","article-title":"Thermal stresses in box-type Laser packages","volume":"31","author":"Cheng","year":"1999","journal-title":"Opt. Quant. Electron."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB6","doi-asserted-by":"crossref","first-page":"1307","DOI":"10.1016\/S0026-2714(02)00140-3","article-title":"New qualification approach for optoelectronic components","volume":"42","author":"Goudard","year":"2002","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB7","doi-asserted-by":"crossref","unstructured":"McLeod R, Wolkin M, Morozov V, Sawyer K. Packaging of micro-optics component to meet Telcordia standards. In: Proc OFC, Anaheim, CA, USA, March 2002","DOI":"10.1109\/OFC.2002.1036393"},{"key":"10.1016\/S0026-2714(03)00099-4_BIB8","first-page":"139","article-title":"Numerical weld modeling-method for calculating weld-induced residual stresses","volume":"206","author":"Fricke","year":"2001","journal-title":"Numer. Eng. Des."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB9","doi-asserted-by":"crossref","unstructured":"Hayashi T, Tsunetsugu H. Optical module with MU connector interface using self-alignment technique by solder-bump chip bonding. In: Proc 46th Electronic Components and Technology Conference, 1996. p. 13\u20139","DOI":"10.1109\/ECTC.1996.517369"},{"issue":"April","key":"10.1016\/S0026-2714(03)00099-4_BIB10","first-page":"63","article-title":"Die-attach materials and methods","author":"Trigwell","year":"1995","journal-title":"Solid State Technol."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB11","unstructured":"Perichaud MG, Deletage JY, Tregon B, N\u2019Kaoua G, Fremont H, Danto Y, et al. Optimisation of an assembling process of passive components connected with conductive adhesives. In: 12th European Passive Components Symposium, CARTS-EUROPE \u201998, 1998. p. 50\u20135"},{"key":"10.1016\/S0026-2714(03)00099-4_BIB12","doi-asserted-by":"crossref","first-page":"99","DOI":"10.1016\/S0167-8442(98)00021-4","article-title":"Relaxation mechanism of rotational type in fracture of weld joints for austenic steels","volume":"29","author":"Panin","year":"1998","journal-title":"Theoret. Appl. Fract. Mech."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB13","doi-asserted-by":"crossref","first-page":"3215","DOI":"10.1016\/S0020-7683(96)00208-9","article-title":"Relaxation of thermal stresses in dissimilar materials (approach based on stress intensity)","volume":"34","author":"Inoue","year":"1997","journal-title":"Int. J. Solids Struct."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB14","doi-asserted-by":"crossref","first-page":"383","DOI":"10.1016\/1359-6454(95)00160-1","article-title":"Deformation behavior of a rapidly solidified fine grained Al\u20138.5% Fe\u20131.2% V\u20131.7% Si alloy","volume":"44","author":"Hariprasad","year":"1996","journal-title":"Acta Mater."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB15","doi-asserted-by":"crossref","first-page":"764","DOI":"10.1109\/96.544368","article-title":"Defect formation mechanisms in Laser welding techniques for semiconductor Laser packaging","volume":"19","author":"Cheng","year":"1996","journal-title":"IEEE Trans. Compon. Pack. Manuf. Technol."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB16","doi-asserted-by":"crossref","first-page":"25","DOI":"10.1016\/S0029-5493(99)00275-7","article-title":"Creep-fatigue evaluation of stainless steel welded joints in FBR class 1 components","volume":"198","author":"Asayama","year":"2000","journal-title":"Nucl. Eng. Des."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB17","doi-asserted-by":"crossref","first-page":"214","DOI":"10.1016\/S0168-583X(97)00654-X","article-title":"Relaxation of metals: a model based on MD calculations","volume":"135","author":"Dominguez-Vazquez","year":"1998","journal-title":"Nucl. Instru. Meth. Phys. Res."},{"key":"10.1016\/S0026-2714(03)00099-4_BIB18","series-title":"Thermal stress and strain in microelectronics packaging","author":"Lau","year":"1993"},{"key":"10.1016\/S0026-2714(03)00099-4_BIB19","unstructured":"Experimental validation of thermomechanical simulations on 1550 nm Laser modules. Internal Report, ALCATEL Optronics-IXL, September 2001"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403000994?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403000994?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2020,3,20]],"date-time":"2020-03-20T09:19:50Z","timestamp":1584695990000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271403000994"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,7]]},"references-count":19,"journal-issue":{"issue":"7","published-print":{"date-parts":[[2003,7]]}},"alternative-id":["S0026271403000994"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(03)00099-4","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,7]]}}}