{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,8]],"date-time":"2025-09-08T05:33:31Z","timestamp":1757309611982},"reference-count":15,"publisher":"Elsevier BV","issue":"7","license":[{"start":{"date-parts":[[2003,7,1]],"date-time":"2003-07-01T00:00:00Z","timestamp":1057017600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,7]]},"DOI":"10.1016\/s0026-2714(03)00127-6","type":"journal-article","created":{"date-parts":[[2003,6,30]],"date-time":"2003-06-30T14:43:56Z","timestamp":1056984236000},"page":"1117-1123","source":"Crossref","is-referenced-by-count":69,"title":["Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications"],"prefix":"10.1016","volume":"43","author":[{"given":"Tong Yan","family":"Tee","sequence":"first","affiliation":[]},{"given":"Hun Shen","family":"Ng","sequence":"additional","affiliation":[]},{"given":"Daniel","family":"Yap","sequence":"additional","affiliation":[]},{"given":"Xavier","family":"Baraton","sequence":"additional","affiliation":[]},{"given":"Zhaowei","family":"Zhong","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(03)00127-6_BIB1","series-title":"Ball grid array technology","first-page":"379","article-title":"Reliability of plastic ball grid array assembly","author":"Darveaux","year":"1995"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB2","unstructured":"Darveaux R. Solder joint fatigue life model. In: Proceedings of TMS Annual Meeting, Orlando, FL, 1997. p. 213\u201318"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB3","doi-asserted-by":"crossref","unstructured":"Johnson Z. Implementation of and extensions to Darveaux\u2019s approach to finite-element simulation of BGA solder joint reliability. In: Proceedings of 49th Electronic Components and Technology Conference, ECTC, USA, 1999. p. 1190\u20135","DOI":"10.1109\/ECTC.1999.776357"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB4","doi-asserted-by":"crossref","unstructured":"Mawer A, Vo N, Johnson Z, Lindsay W. Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications. In: Proceedings of 49th Electronic Components and Technology Conference, ECTC, USA, 1999","DOI":"10.1109\/ECTC.1999.776159"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB5","doi-asserted-by":"crossref","unstructured":"Darveaux R. Effect of simulation methodology on solder joint crack growth correlation. In: Proceedings of 50th Electronic Components and Technology Conference, ECTC, Las Vegas, NE, 2000. p. 1048\u201358","DOI":"10.1109\/ECTC.2000.853299"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB6","unstructured":"Tee TY, Sivakumar K, Do-Bento-Vieira A. Board level solder joint reliability modeling of LFBGA package. In: Proceedings of 2nd EMAP Conference, Hong Kong, 2000. p. 51\u20134"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB7","unstructured":"Tee TY, Ng HS, Pan S. Board level solder joint reliability modeling of TFBGA package. In: Proceedings of ICEP Conference, Tokyo, Japan, 2002. p. 491\u20137"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB8","unstructured":"Tee TY, Ng HS, Diot J, Frezza G, Tiziani R, Santospirito G. Comprehensive design analysis of QFN and PowerQFN packages for enhanced board level solder joint reliability. In: Proceedings of 52nd Electronic Components and Technology Conference, ECTC, San Diego, CA, 2002. p. 985\u201391"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB9","doi-asserted-by":"crossref","unstructured":"Uegai Y, Kawazu A, Wu Q, Matsushima H, Yasunaga M, Shimamoto H. New thermal fatigue life prediction method for BGA\/FBGA solder joints with basic crack propagation study. In: Proceedings of 52nd Electronic Components and Technology Conference, ECTC, San Diego, CA, 2002","DOI":"10.1109\/ECTC.2002.1008272"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB10","unstructured":"Vandevelde B, Beyne E, Zhang GQ, Caers J. Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method. In: Proceedings of 51st Electronic Components and Technology Conference, ECTC, USA, 2001"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB11","doi-asserted-by":"crossref","unstructured":"Hung SC, Zheng PJ, Ho SH, Lee SC, Wu JD. The comparison of solder joint reliability between BCC++ and QFN. In: Proceedings of 51st Electronic Components and Technology Conference, ECTC, USA, 2001","DOI":"10.1109\/ECTC.2001.927946"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB12","doi-asserted-by":"crossref","unstructured":"Syed A. Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy. In: Proceedings of 51st Electronic Components and Technology Conference, ECTC, USA, 2001","DOI":"10.1109\/ECTC.2001.927732"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB13","doi-asserted-by":"crossref","first-page":"231","DOI":"10.1016\/S0026-2714(99)00061-X","article-title":"Solder joint fatigue models: review and applicability to chip scale packages","volume":"40","author":"Lee","year":"2000","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/S0026-2714(03)00127-6_BIB14","unstructured":"Murty KL, Turlik I. Deformation mechanisms in lead\u2013tin alloys, application to solder reliability in electronic packages. In: Proceedings of ASME\/JSME, 1992. p. 309\u201318"},{"key":"10.1016\/S0026-2714(03)00127-6_BIB15","unstructured":"ANSYS User\u2019s Manual. Swanson Analysis Systems, 1994, vol. IV. p. 4.23\u201325"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403001276?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403001276?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,3,18]],"date-time":"2019-03-18T18:27:42Z","timestamp":1552933662000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271403001276"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,7]]},"references-count":15,"journal-issue":{"issue":"7","published-print":{"date-parts":[[2003,7]]}},"alternative-id":["S0026271403001276"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(03)00127-6","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,7]]}}}