{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,3,30]],"date-time":"2022-03-30T14:23:18Z","timestamp":1648650198353},"reference-count":37,"publisher":"Elsevier BV","issue":"12","license":[{"start":{"date-parts":[[2003,12,1]],"date-time":"2003-12-01T00:00:00Z","timestamp":1070236800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2003,12]]},"DOI":"10.1016\/s0026-2714(03)00219-1","type":"journal-article","created":{"date-parts":[[2003,9,12]],"date-time":"2003-09-12T16:10:05Z","timestamp":1063383005000},"page":"2011-2020","source":"Crossref","is-referenced-by-count":1,"title":["An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages"],"prefix":"10.1016","volume":"43","author":[{"given":"W.","family":"Dauksher","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W.S.","family":"Burton","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/S0026-2714(03)00219-1_BIB1","unstructured":"Jedec Solid State Technology Association. JESD47-A stress-test-driven qualification of integrated circuits, 2001"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB2","unstructured":"Jedec Solid State Technology Association. JESD22-A104 Temperature Cycling, 2000"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB3","series-title":"Microelectronics packaging handbook","article-title":"Chip-to-package interconnections","author":"Koopman","year":"1989"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB4","doi-asserted-by":"crossref","first-page":"1541","DOI":"10.1016\/S0026-2714(02)00186-5","article-title":"Reliability of flip chip applications with ceramic and organic chip carriers","volume":"42","author":"DiGiacomo","year":"2002","journal-title":"Microelectron. Reliab."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB5","doi-asserted-by":"crossref","first-page":"251","DOI":"10.1147\/rd.133.0251","article-title":"Geometric optimization of controlled collapse interconnections","author":"Goldman","year":"1969","journal-title":"IBM J. Res. Develop."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB6","doi-asserted-by":"crossref","first-page":"266","DOI":"10.1147\/rd.133.0266","article-title":"Reliability of controlled collapse interconnection","author":"Norris","year":"1969","journal-title":"IBM J. Res. Develop."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB7","unstructured":"Dornheim MA. Low-fatigue material saves weight on A380. Aviation Week and Space Technology, 2001"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB8","unstructured":"Jones RM. Mechanics of composite materials. WA, DC: Scripta; 1974"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB9","series-title":"Structural analysis of laminated anisotropic plates","author":"Whitney","year":"1987"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB10","doi-asserted-by":"crossref","first-page":"419","DOI":"10.1115\/1.3119742","article-title":"Computational models for high temperature multilayered composite plates and shells","volume":"10","author":"Noor","year":"1992","journal-title":"Appl. Mech. Rev."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB11","doi-asserted-by":"crossref","first-page":"3","DOI":"10.1177\/058310249002200703","article-title":"A review of refined theories of laminated composite plates","volume":"7","author":"Reddy","year":"1990","journal-title":"The Shock Vib. Digest"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB12","doi-asserted-by":"crossref","first-page":"233","DOI":"10.1364\/JOSA.11.000233","article-title":"Analysis of bimetal thermostats","author":"Timoshenko","year":"1925","journal-title":"J. Opt. Soc. Am."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB13","doi-asserted-by":"crossref","first-page":"538","DOI":"10.1177\/002199837000400409","article-title":"Interlaminar stresses in composite laminates under uniform axial extension","volume":"4","author":"Pipes","year":"1970","journal-title":"J. Compos. Mater."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB14","doi-asserted-by":"crossref","first-page":"129","DOI":"10.1016\/0020-7403(76)90062-X","article-title":"On thermal edge effects in composite laminates","volume":"18","author":"Herakovich","year":"1976","journal-title":"Int. J. Mech. Sci."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB15","doi-asserted-by":"crossref","first-page":"401","DOI":"10.1016\/0020-7683(78)90021-5","article-title":"Free edge stress fields in composite laminates","volume":"14","author":"Pagano","year":"1978","journal-title":"J. Solids Struct."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB16","doi-asserted-by":"crossref","first-page":"204","DOI":"10.1177\/002199837000400206","article-title":"Interlaminar shear in laminated composites under generalized plane stress","volume":"4","author":"Puppo","year":"1970","journal-title":"J. Compos. Mater."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB17","doi-asserted-by":"crossref","first-page":"271","DOI":"10.1016\/0961-9526(93)90061-N","article-title":"An approximate solution for interlaminar stresses in composite laminates","volume":"3","author":"Rose","year":"1993","journal-title":"Compos. Eng."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB18","series-title":"Mechanics of fiberous composites","author":"Herakovich","year":"1998"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB19","doi-asserted-by":"crossref","first-page":"97","DOI":"10.1016\/S0263-8223(00)00191-4","article-title":"The free-corner effect in thermally loaded laminates","volume":"52","author":"Becker","year":"2001","journal-title":"Compos. Struct."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB20","doi-asserted-by":"crossref","first-page":"744","DOI":"10.1115\/1.3171853","article-title":"An efficient method for the calculation of interlaminar stresses in composite materials","volume":"53","author":"Kassapoglou","year":"1986","journal-title":"Trans. ASME"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB21","doi-asserted-by":"crossref","first-page":"33","DOI":"10.1177\/073168449000900103","article-title":"Determination of interlaminar stresses in composite laminates under combined loads","volume":"9","author":"Kassapoglou","year":"1990","journal-title":"J. Reinf. Plast. Compos."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB22","doi-asserted-by":"crossref","first-page":"526","DOI":"10.1115\/1.4010553","article-title":"Stress singularities resulting from various boundary conditions in angular corners of plates in extension","volume":"19","author":"Williams","year":"1952","journal-title":"J. Appl. Mech."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB23","doi-asserted-by":"crossref","first-page":"199","DOI":"10.1785\/BSSA0490020199","article-title":"The stresses around a fault or crack in dissimilar media","volume":"49","author":"Williams","year":"1959","journal-title":"Bull. Seis. Soc. Am."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB24","doi-asserted-by":"crossref","first-page":"460","DOI":"10.1115\/1.3601236","article-title":"Edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading","author":"Bogy","year":"1968","journal-title":"Trans. ASME"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB25","doi-asserted-by":"crossref","first-page":"137","DOI":"10.1016\/S0263-8223(97)00154-2","article-title":"Three-dimensional stress singularity at bimaterial interface crack front","volume":"40","author":"Xie","year":"1998","journal-title":"Compos. Struct."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB26","doi-asserted-by":"crossref","first-page":"899","DOI":"10.1002\/nme.459","article-title":"Stress intensity factors for three-dimensional surface cracks using enriched finite elements","volume":"54","author":"Ayhan","year":"2002","journal-title":"Int. J. Numer. Methods Eng."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB27","doi-asserted-by":"crossref","first-page":"9077","DOI":"10.1016\/S0020-7683(01)00206-2","article-title":"Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading","volume":"38","author":"Barut","year":"2001","journal-title":"Int. J. Solids Struct."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB28","doi-asserted-by":"crossref","first-page":"329","DOI":"10.1016\/0022-5096(65)90035-9","article-title":"Tensile properties of fibre-reinforced metals: copper\/tungsten and copper\/molybdenum","volume":"13","author":"Kelley","year":"1965","journal-title":"J. Mech. Phys. Solids"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB29","series-title":"Metal matrix composites","author":"Taya","year":"1989"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB30","series-title":"Micromechanics of defects in solids","author":"Mura","year":"1987"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB31","doi-asserted-by":"crossref","first-page":"65","DOI":"10.1177\/002199837400800106","article-title":"On the calculation of interlaminar normal stress in composite laminate","volume":"8","author":"Pagano","year":"1973","journal-title":"J. Compos. Mater."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB32","first-page":"1663","article-title":"Influence of die size on the magnitude of thermomechanical stresses in flip chips directly attached to printed wiring board","volume":"2","author":"LeGall","year":"1997","journal-title":"Adv. Electron. Packaging"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB33","doi-asserted-by":"crossref","unstructured":"Clementi J, McCreary J, Niu TM, Palomaki J, Varcoe J, Hill G. Flip chip encapsulation on ceramic substrates. In: Proceedings of the 43rd Electronic Components and Technology Conference, 1993. p. 175\u201381","DOI":"10.1109\/ECTC.1993.346835"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB34","doi-asserted-by":"crossref","first-page":"207","DOI":"10.1115\/1.1286002","article-title":"Fatigue life analysis of solder joints in flip chip bonding","volume":"122","author":"Tsukada","year":"2000","journal-title":"J. Electron. Packaging"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB35","series-title":"Chip on board technologies for multichip modules","article-title":"Solder bumper flip chip attach on SLC board and multichip module","author":"Tsukada","year":"1994"},{"key":"10.1016\/S0026-2714(03)00219-1_BIB36","first-page":"12","article-title":"HITCE ceramics: bridging the gap between ceramics and organic packaging","volume":"1","author":"Sigilano","year":"2002","journal-title":"Adv. Microelectron."},{"key":"10.1016\/S0026-2714(03)00219-1_BIB37","unstructured":"ANSYS v5.6 is a product of Ansys Inc"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403002191?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271403002191?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2021,6,11]],"date-time":"2021-06-11T01:26:31Z","timestamp":1623374791000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271403002191"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2003,12]]},"references-count":37,"journal-issue":{"issue":"12","published-print":{"date-parts":[[2003,12]]}},"alternative-id":["S0026271403002191"],"URL":"https:\/\/doi.org\/10.1016\/s0026-2714(03)00219-1","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2003,12]]}}}