{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,3,29]],"date-time":"2022-03-29T13:51:18Z","timestamp":1648561878287},"reference-count":10,"publisher":"Elsevier BV","issue":"1","license":[{"start":{"date-parts":[[2002,2,1]],"date-time":"2002-02-01T00:00:00Z","timestamp":1012521600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microprocessors and Microsystems"],"published-print":{"date-parts":[[2002,2]]},"DOI":"10.1016\/s0141-9331(01)00145-4","type":"journal-article","created":{"date-parts":[[2002,7,25]],"date-time":"2002-07-25T09:55:45Z","timestamp":1027590945000},"page":"45-48","source":"Crossref","is-referenced-by-count":0,"title":["A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate"],"prefix":"10.1016","volume":"26","author":[{"given":"Hasan","family":"Ymeri","sequence":"first","affiliation":[]},{"given":"Bart","family":"Nauwelaers","sequence":"additional","affiliation":[]},{"given":"Karen","family":"Maex","sequence":"additional","affiliation":[]},{"given":"Servaas","family":"Vandenberghe","sequence":"additional","affiliation":[]},{"given":"David","family":"De Roest","sequence":"additional","affiliation":[]}],"member":"78","reference":[{"key":"10.1016\/S0141-9331(01)00145-4_BIB1","doi-asserted-by":"crossref","first-page":"383","DOI":"10.1147\/rd.394.0383","article-title":"VLSI on-chip interconnection performance simulations and measurements","volume":"39","author":"Edelstein","year":"1995","journal-title":"IBM J. Res. Develop."},{"key":"10.1016\/S0141-9331(01)00145-4_BIB2","doi-asserted-by":"crossref","first-page":"376","DOI":"10.1109\/96.311787","article-title":"Quasi-analytical analysis of the broad-band properties of multiconductor transmission lines on semiconducting substrates","volume":"17","author":"Groteluschen","year":"1994","journal-title":"IEEE Trans. Compos. Package Manufact. Technol. B"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB3","doi-asserted-by":"crossref","first-page":"176","DOI":"10.1109\/22.744292","article-title":"Metal\u2013insulator\u2013semiconductor transmission lines","volume":"47","author":"Williams","year":"1999","journal-title":"IEEE Trans. MTT"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB4","doi-asserted-by":"crossref","first-page":"632","DOI":"10.1109\/22.668675","article-title":"Characterization of broad-band transmission for coplanar waveguides on CMOS silicon substrates","volume":"46","author":"Milanovic","year":"1998","journal-title":"IEEE Trans. MTT"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB5","doi-asserted-by":"crossref","first-page":"1436","DOI":"10.1109\/22.721145","article-title":"Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits","volume":"46","author":"Wee","year":"1998","journal-title":"IEEE Trans. MTT"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB6","series-title":"Eddy Currents in Linear Conducting Media","author":"Tegopoulos","year":"1985"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB7","series-title":"Mathematical Analysis and Numerical Methods for Science and Technology","author":"Dautray","year":"1990"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB8","doi-asserted-by":"crossref","first-page":"1443","DOI":"10.1109\/22.868993","article-title":"CAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate","volume":"48","author":"Zheng","year":"2000","journal-title":"IEEE Trans. MTT"},{"key":"10.1016\/S0141-9331(01)00145-4_BIB9","doi-asserted-by":"crossref","first-page":"302","DOI":"10.1002\/mop.1296","article-title":"Distributed inductance and resistance per unit length formulas for VLSI interconnects on silicon substrate","volume":"30","author":"Ymeri","year":"2001","journal-title":"Microwave Opt. Technol. Lett."},{"key":"10.1016\/S0141-9331(01)00145-4_BIB10","doi-asserted-by":"crossref","first-page":"351","DOI":"10.1016\/S0026-2692(01)00003-9","article-title":"On the modelling of multiconductor multilayer systems for interconnect applications","volume":"34","author":"Ymeri","year":"2001","journal-title":"Microelectr. J."}],"container-title":["Microprocessors and Microsystems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0141933101001454?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0141933101001454?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,5,3]],"date-time":"2019-05-03T14:28:29Z","timestamp":1556893709000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0141933101001454"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002,2]]},"references-count":10,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2002,2]]}},"alternative-id":["S0141933101001454"],"URL":"https:\/\/doi.org\/10.1016\/s0141-9331(01)00145-4","relation":{},"ISSN":["0141-9331"],"issn-type":[{"value":"0141-9331","type":"print"}],"subject":[],"published":{"date-parts":[[2002,2]]}}}