{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,25]],"date-time":"2026-07-25T10:45:17Z","timestamp":1784976317094,"version":"3.55.0"},"reference-count":17,"publisher":"Elsevier BV","issue":"9","license":[{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"},{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/legal\/tdmrep-license"},{"start":{"date-parts":[[2024,4,22]],"date-time":"2024-04-22T00:00:00Z","timestamp":1713744000000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"content-domain":{"domain":["cell.com","elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Heliyon"],"published-print":{"date-parts":[[2024,5]]},"DOI":"10.1016\/j.heliyon.2024.e30232","type":"journal-article","created":{"date-parts":[[2024,4,25]],"date-time":"2024-04-25T07:52:48Z","timestamp":1714031568000},"page":"e30232","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":3,"title":["Defect-free grinding of silicon nitride at high material removal rate"],"prefix":"10.1016","volume":"10","author":[{"given":"Craig","family":"Seidelson","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Manigandan","family":"Kannan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"78","reference":[{"key":"10.1016\/j.heliyon.2024.e30232_bib1","doi-asserted-by":"crossref","DOI":"10.1007\/s00170-022-10793-0","article-title":"Investigation of material removal mechanisms of laser-structured Si3N4 via single diamond grit scratching","volume":"125","author":"Paknejad","year":"2023","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"10.1016\/j.heliyon.2024.e30232_bib2","series-title":"Handbook of Ceramics Grinding and Polishing","author":"Marinescu","year":"2014"},{"key":"10.1016\/j.heliyon.2024.e30232_bib3","series-title":"Size Effect for Specific Energy in Grinding of Silicon Nitride. T W. Hwang, Christopher J. Evans, S Malkin","first-page":"225","year":"1999"},{"key":"10.1016\/j.heliyon.2024.e30232_bib4","doi-asserted-by":"crossref","first-page":"707","DOI":"10.3390\/mi12060707","article-title":"Scratch Behaviour of Bulk Silicon Nitride Ceramics 6, s.l. : micromachines","volume":"12","author":"Xiao","year":"2021","journal-title":"Micromachines"},{"issue":"12","key":"10.1016\/j.heliyon.2024.e30232_bib5","doi-asserted-by":"crossref","first-page":"3093","DOI":"10.1111\/j.1151-2916.1993.tb06614.x","article-title":"Stress-enhanced oxidation of silicon nitride ceramics","volume":"76","year":"1993","journal-title":"J. Am. Ceram. Soc."},{"key":"10.1016\/j.heliyon.2024.e30232_bib7","first-page":"394","article-title":"Laser-assisted micro-grinding of Si3N4","volume":"vol. 60","author":"Kadivar","year":"2019"},{"key":"10.1016\/j.heliyon.2024.e30232_bib8","first-page":"3397","article-title":"Laser-assisted machining of damage-free silicon nitride parts with complex geometric features via in-process control of laser power","volume":"vol. 89","year":"2006"},{"issue":"4","key":"10.1016\/j.heliyon.2024.e30232_bib9","doi-asserted-by":"crossref","first-page":"639","DOI":"10.1115\/1.1380382","article-title":"Experimental Investigation of Thermo-Mechanical Characteristics in Laser-Assisted Machining of Silicon Nitride Ceramics","volume":"123","author":"Lei","year":"2001","journal-title":"J. Manuf. Sci. Eng."},{"issue":"375","key":"10.1016\/j.heliyon.2024.e30232_bib10","doi-asserted-by":"crossref","first-page":"90","DOI":"10.1016\/j.apsusc.2016.03.022","article-title":"Laser thermal effect on silicon nitride ceramic based on thermo-chemical reaction with temperature-dependent thermo-physical parameters","author":"Pan","year":"2016","journal-title":"Appl. Surf. Sci."},{"key":"10.1016\/j.heliyon.2024.e30232_bib11","doi-asserted-by":"crossref","first-page":"55","DOI":"10.1111\/j.1151-2916.1982.tb09923.x","article-title":"Residual Stresses in Hot-Pressed Si3N4 Grooved by Single-Point Grinding","volume":"65","author":"Kirchner","year":"2006","journal-title":"J. Am. Ceram. Soc."},{"key":"10.1016\/j.heliyon.2024.e30232_bib12","doi-asserted-by":"crossref","first-page":"307","DOI":"10.1016\/j.prostr.2017.11.093","article-title":"In-situ observation of crack propagation in silicon nitride ceramics","volume":"7","author":"Kadin","year":"2017","journal-title":"Procedia Struct. Integr."},{"key":"10.1016\/j.heliyon.2024.e30232_bib13","doi-asserted-by":"crossref","first-page":"666","DOI":"10.3390\/mi14030666","article-title":"Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics Hongjie chang and huli niu","volume":"14","author":"Yan","year":"2023","journal-title":"Micromachines"},{"key":"10.1016\/j.heliyon.2024.e30232_bib14","first-page":"119","article-title":"Laser ablation mechanism of silicon nitride with nanosecond and picosecond lasers","author":"Soltani","year":"2019","journal-title":"Opt. Laser Technol."},{"key":"10.1016\/j.heliyon.2024.e30232_bib15","article-title":"Corrosion characteristics of silicon carbide and silicon nitride","volume":"98","author":"Dapkunas","year":"1993","journal-title":"S. J. 5, s.l. : Journal of Research of the National Institute of Standards and Technology"},{"key":"10.1016\/j.heliyon.2024.e30232_bib16","series-title":"Dye Penetrant Crack Detectability in External Corners in Presence of Fillet Radius. s.L","author":"Koshti","year":"2016"},{"key":"10.1016\/j.heliyon.2024.e30232_bib17","series-title":"Processing and Properties of Silicon Nitride Ceramics","author":"Nel","year":"1993"},{"key":"10.1016\/j.heliyon.2024.e30232_bib18","article-title":"Numerical Analysis of Thermal Shock Cracking Behaviors of Ceramics Based on the Force-Heat Equivalence Energy Density Principle","volume":"8","author":"Li","year":"2021","journal-title":"Frontiers in Materials"}],"container-title":["Heliyon"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S2405844024062637?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S2405844024062637?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2025,6,25]],"date-time":"2025-06-25T22:59:55Z","timestamp":1750892395000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S2405844024062637"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5]]},"references-count":17,"journal-issue":{"issue":"9","published-print":{"date-parts":[[2024,5]]}},"alternative-id":["S2405844024062637"],"URL":"https:\/\/doi.org\/10.1016\/j.heliyon.2024.e30232","relation":{},"ISSN":["2405-8440"],"issn-type":[{"value":"2405-8440","type":"print"}],"subject":[],"published":{"date-parts":[[2024,5]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Defect-free grinding of silicon nitride at high material removal rate","name":"articletitle","label":"Article Title"},{"value":"Heliyon","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.heliyon.2024.e30232","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"\u00a9 2024 Published by Elsevier Ltd.","name":"copyright","label":"Copyright"}],"article-number":"e30232"}}