{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,20]],"date-time":"2026-10-20T21:31:12Z","timestamp":1792531872755,"version":"4.5.0"},"reference-count":16,"publisher":"Elsevier BV","issue":"10","license":[{"start":{"date-parts":[[2012,10,1]],"date-time":"2012-10-01T00:00:00Z","timestamp":1349049600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Waste Management"],"published-print":{"date-parts":[[2012,10]]},"DOI":"10.1016\/j.wasman.2012.05.006","type":"journal-article","created":{"date-parts":[[2012,5,28]],"date-time":"2012-05-28T15:05:03Z","timestamp":1338217503000},"page":"1919-1925","source":"Crossref","is-referenced-by-count":52,"title":["Leaching studies for tin recovery from waste e-scrap"],"prefix":"10.1016","volume":"32","author":[{"given":"Manis Kumar","family":"Jha","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pankaj Kumar","family":"Choubey","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Amrita Kumari","family":"Jha","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Archana","family":"Kumari","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jae-chun","family":"Lee","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vinay","family":"Kumar","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinki","family":"Jeong","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"78","reference":[{"key":"10.1016\/j.wasman.2012.05.006_b0005","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1016\/S0304-386X(98)00003-6","article-title":"Recovery of lead, tin and indium from alloy wire scrap","volume":"49","author":"Barakat","year":"1998","journal-title":"Hydrometallurgy"},{"key":"10.1016\/j.wasman.2012.05.006_b0010","doi-asserted-by":"crossref","first-page":"649","DOI":"10.1590\/S0104-66322009000400003","article-title":"Recovery of tin and copper by recycling of printed circuit boards from obsolete computers","volume":"26","author":"Castro","year":"2009","journal-title":"Brazilian Journal of Chemical Engineering"},{"key":"10.1016\/j.wasman.2012.05.006_b0015","doi-asserted-by":"crossref","first-page":"464","DOI":"10.1016\/j.resconrec.2009.03.008","article-title":"A novel flowsheet for the recovery of metal values from waste printed circuit boards","volume":"53","author":"Das","year":"2009","journal-title":"Resources, Conservation and Recycling"},{"key":"10.1016\/j.wasman.2012.05.006_b0020","doi-asserted-by":"crossref","first-page":"728","DOI":"10.1016\/j.jhazmat.2007.09.029","article-title":"Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound","volume":"153","author":"Guo","year":"2008","journal-title":"Journal of Hazardous Materials"},{"key":"10.1016\/j.wasman.2012.05.006_b0025","doi-asserted-by":"crossref","first-page":"866","DOI":"10.1016\/j.jhazmat.2010.07.107","article-title":"Leaching of copper and tin from used printed circuit boards after thermal treatment","volume":"183","author":"Havlik","year":"2010","journal-title":"Journal of Hazardous Materials"},{"key":"10.1016\/j.wasman.2012.05.006_b0030","doi-asserted-by":"crossref","first-page":"399","DOI":"10.1016\/j.jhazmat.2008.08.051","article-title":"Recycling of waste printed circuit boards: a review of current technologies and treatment status in China","volume":"154","author":"Huang","year":"2009","journal-title":"Journal of Hazardous Materials"},{"key":"10.1016\/j.wasman.2012.05.006_b0035","doi-asserted-by":"crossref","unstructured":"Jha, M.K., Kumar, A., Kumar, V., Lee, J.-c., 2011. Prospective scenario of e-waste recycling in India. In: Proceeding of Second Symposium, TMS, February 27th\u20133rd March, San Diego, California, pp. 73\u201380.","DOI":"10.1002\/9781118086391.ch10"},{"key":"10.1016\/j.wasman.2012.05.006_b0040","unstructured":"Kumari, A., Jha, M.K., Kumar, V., Jeong, J., Lee, J.c., 2010. Recovery of lead from the solder of waste PCBs. In: Proceeding of X1 International Seminar on Mineral Processing Technology, 15\u201317 December 2010, NML, Jamshedpur, India, pp. 891\u2013897."},{"issue":"1","key":"10.1016\/j.wasman.2012.05.006_b0045","doi-asserted-by":"crossref","first-page":"3","DOI":"10.1016\/j.wasman.2011.08.010","article-title":"Bio-processing of solid wastes and secondary resources for metal extraction \u2013 a review","volume":"32","author":"Lee","year":"2011","journal-title":"Waste Management"},{"key":"10.1016\/j.wasman.2012.05.006_b0050","unstructured":"Lee, J.-c., Yoo, J.M., Jeong, J., Jha, M.K., 2009, Novel pre-treatment process for liberation of metals from waste printed circuit boards using organic solution. International Patent China Application Number: WO\/2009\/064063 (dated 28.07.09)."},{"key":"10.1016\/j.wasman.2012.05.006_b0055","doi-asserted-by":"crossref","first-page":"1995","DOI":"10.1021\/es0618245","article-title":"Recycle technology for recovering resources and products from waste printed circuit boards","volume":"41","author":"Li","year":"2007","journal-title":"Environmental Science and Technology"},{"key":"10.1016\/j.wasman.2012.05.006_b0060","doi-asserted-by":"crossref","first-page":"113","DOI":"10.1016\/j.jallcom.2010.05.179","article-title":"Effect of rapid solidification on mechanical property of a lead free Sn\u20133.5Ag solder","volume":"505","author":"Shalaby","year":"2012","journal-title":"Journal of Alloys and Compounds"},{"key":"10.1016\/j.wasman.2012.05.006_b0070","series-title":"Vogel\u2019s Qualitative Inorganic Analysis","author":"Vogel","year":"1996"},{"key":"10.1016\/j.wasman.2012.05.006_b0075","doi-asserted-by":"crossref","first-page":"29","DOI":"10.1016\/j.hydromet.2008.12.011","article-title":"Factor influencing bioleaching copper from waste printed circuit boards by Acidithiobacillus ferrooxidans","volume":"97","author":"Yang","year":"2009","journal-title":"Hydrometallurgy"},{"key":"10.1016\/j.wasman.2012.05.006_b0080","doi-asserted-by":"crossref","first-page":"1132","DOI":"10.1016\/j.wasman.2008.06.035","article-title":"Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill","volume":"29","author":"Yoo","year":"2009","journal-title":"Waste Management"},{"key":"10.1016\/j.wasman.2012.05.006_b0085","doi-asserted-by":"crossref","first-page":"2299","DOI":"10.1016\/j.wasman.2010.06.012","article-title":"Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation","volume":"30","author":"Zhou","year":"2010","journal-title":"Waste Management"}],"container-title":["Waste Management"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0956053X12001961?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0956053X12001961?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2019,6,29]],"date-time":"2019-06-29T01:37:15Z","timestamp":1561772235000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0956053X12001961"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,10]]},"references-count":16,"journal-issue":{"issue":"10","published-print":{"date-parts":[[2012,10]]}},"alternative-id":["S0956053X12001961"],"URL":"https:\/\/doi.org\/10.1016\/j.wasman.2012.05.006","relation":{},"ISSN":["0956-053X"],"issn-type":[{"value":"0956-053X","type":"print"}],"subject":[],"published":{"date-parts":[[2012,10]]}}}