{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,2,15]],"date-time":"2023-02-15T05:22:40Z","timestamp":1676438560735},"reference-count":0,"publisher":"Oxford University Press (OUP)","issue":"S3","license":[{"start":{"date-parts":[[2008,10,3]],"date-time":"2008-10-03T00:00:00Z","timestamp":1222992000000},"content-version":"unspecified","delay-in-days":32,"URL":"https:\/\/www.cambridge.org\/core\/terms"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microsc Microanal"],"published-print":{"date-parts":[[2008,9]]},"abstract":"<jats:p>Continuously miniaturization of electronic components using PCB's technology for the manufacturing of SDRAM's uses a solder ball attach process, producing a joint which robustness and electrical response are crucial factors to success. At present, near-eutectic Sn-Ag-Cu alloys are the leading candidates for Pb-free solders. According to Chun et al., the rapid formation of Cu-Sn intermetallic compounds at the interface affects the reliability of this solder joint and represents a major concern. In this study we characterize the interface of an attachment between the copper layer conductors of a memory and a solder ball which allows further bonding to printed circuit modules, see figure 1.a.<\/jats:p>","DOI":"10.1017\/s1431927608089253","type":"journal-article","created":{"date-parts":[[2008,10,3]],"date-time":"2008-10-03T11:24:08Z","timestamp":1223033048000},"page":"17-18","source":"Crossref","is-referenced-by-count":0,"title":["Characterizing the intermetallic formed during ball attach process"],"prefix":"10.1093","volume":"14","author":[{"given":"Paulo","family":"Pereira","sequence":"first","affiliation":[]},{"given":"R\u00faben","family":"Santos","sequence":"additional","affiliation":[]},{"given":"Maria M.","family":"Barbosa","sequence":"additional","affiliation":[]},{"given":"C\u00e1tia","family":"Almeida","sequence":"additional","affiliation":[]}],"member":"286","published-online":{"date-parts":[[2008,10,3]]},"container-title":["Microscopy and Microanalysis"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.cambridge.org\/core\/services\/aop-cambridge-core\/content\/view\/S1431927608089253","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,2,14]],"date-time":"2023-02-14T20:58:58Z","timestamp":1676408338000},"score":1,"resource":{"primary":{"URL":"https:\/\/academic.oup.com\/mam\/article\/14\/S3\/17\/6919793"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,9]]},"references-count":0,"journal-issue":{"issue":"S3","published-print":{"date-parts":[[2008,9]]}},"alternative-id":["S1431927608089253"],"URL":"https:\/\/doi.org\/10.1017\/s1431927608089253","relation":{},"ISSN":["1431-9276","1435-8115"],"issn-type":[{"value":"1431-9276","type":"print"},{"value":"1435-8115","type":"electronic"}],"subject":[],"published":{"date-parts":[[2008,9]]}}}