{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,2,15]],"date-time":"2023-02-15T05:26:30Z","timestamp":1676438790131},"reference-count":0,"publisher":"Oxford University Press (OUP)","issue":"S3","license":[{"start":{"date-parts":[[2009,8,21]],"date-time":"2009-08-21T00:00:00Z","timestamp":1250812800000},"content-version":"unspecified","delay-in-days":51,"URL":"https:\/\/www.cambridge.org\/core\/terms"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microsc Microanal"],"published-print":{"date-parts":[[2009,7]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>The development of joining processes for TiAl alloys is fundamental to integrate them into functional structures and to widen their application field. Diffusion bonding has become the most reported technique for joining TiAl alloys but have the disadvantage of requiring high temperature stages. Diffusion bonding of TiAl at the 950-1200\u00b0C temperature range has been reported to produce defect-free bonds. \u00c7am et al., successfully joined TiAl at 950 \u00b0C\/30 MPa\/3 h and 1000 \u00b0C\/30 MPa\/1 h, however, the bond interfaces were clearly visible.<\/jats:p>","DOI":"10.1017\/s1431927609990821","type":"journal-article","created":{"date-parts":[[2009,8,21]],"date-time":"2009-08-21T07:39:11Z","timestamp":1250840351000},"page":"73-74","source":"Crossref","is-referenced-by-count":0,"title":["Joining of TiAl alloys using Ni\/Al multilayers"],"prefix":"10.1093","volume":"15","author":[{"given":"S.","family":"Sim\u00f5es","sequence":"first","affiliation":[]},{"given":"F.","family":"Viana","sequence":"additional","affiliation":[]},{"given":"V.","family":"Ventzke","sequence":"additional","affiliation":[]},{"given":"M.","family":"Ko\u00e7ak","sequence":"additional","affiliation":[]},{"given":"A. S.","family":"Ramos","sequence":"additional","affiliation":[]},{"given":"M. T.","family":"Vieira","sequence":"additional","affiliation":[]},{"given":"M. F.","family":"Vieira","sequence":"additional","affiliation":[]}],"member":"286","published-online":{"date-parts":[[2009,8,21]]},"container-title":["Microscopy and Microanalysis"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.cambridge.org\/core\/services\/aop-cambridge-core\/content\/view\/S1431927609990821","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,2,14]],"date-time":"2023-02-14T21:05:40Z","timestamp":1676408740000},"score":1,"resource":{"primary":{"URL":"https:\/\/academic.oup.com\/mam\/article\/15\/S3\/73\/6920065"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,7]]},"references-count":0,"journal-issue":{"issue":"S3","published-print":{"date-parts":[[2009,7]]}},"alternative-id":["S1431927609990821"],"URL":"https:\/\/doi.org\/10.1017\/s1431927609990821","relation":{},"ISSN":["1431-9276","1435-8115"],"issn-type":[{"value":"1431-9276","type":"print"},{"value":"1435-8115","type":"electronic"}],"subject":[],"published":{"date-parts":[[2009,7]]}}}