{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,18]],"date-time":"2026-04-18T01:38:08Z","timestamp":1776476288566,"version":"3.51.2"},"reference-count":54,"publisher":"American Chemical Society (ACS)","issue":"18","license":[{"start":{"date-parts":[[2025,4,22]],"date-time":"2025-04-22T00:00:00Z","timestamp":1745280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,22]],"date-time":"2025-04-22T00:00:00Z","timestamp":1745280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2025,4,22]],"date-time":"2025-04-22T00:00:00Z","timestamp":1745280000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-045"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["21972118"],"award-info":[{"award-number":["21972118"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["22032004"],"award-info":[{"award-number":["22032004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["22132003"],"award-info":[{"award-number":["22132003"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["22288102"],"award-info":[{"award-number":["22288102"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["ACS Appl. Mater. Interfaces"],"published-print":{"date-parts":[[2025,5,7]]},"DOI":"10.1021\/acsami.5c04034","type":"journal-article","created":{"date-parts":[[2025,4,22]],"date-time":"2025-04-22T20:30:46Z","timestamp":1745353846000},"page":"27252-27263","source":"Crossref","is-referenced-by-count":6,"title":["Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling"],"prefix":"10.1021","volume":"17","author":[{"given":"Zhao-Yun","family":"Wang","sequence":"first","affiliation":[{"name":"School of Electronic Science and Engineering (National Model Microelectronics College)","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]},{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Li-Xin","family":"Yu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Qing","family":"Feng","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-3829-9449","authenticated-orcid":true,"given":"Lei","family":"Jin","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering","place":["Chongqing, China"]},{"name":"Yangtze Normal University","place":["Chongqing, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jia-Qiang","family":"Yang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yi","family":"Zhao","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tao","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2903-6683","authenticated-orcid":true,"given":"DongPing","family":"Zhan","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daquan","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Electronic Science and Engineering (National Model Microelectronics College)","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3363-0837","authenticated-orcid":true,"given":"Fang-Zu","family":"Yang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2327-4090","authenticated-orcid":true,"given":"Shi-Gang","family":"Sun","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering","place":["Xiamen, China"]},{"name":"Xiamen University","place":["Xiamen, China"]}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"316","published-online":{"date-parts":[[2025,4,22]]},"reference":[{"key":"ref1\/cit1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultsonch.2017.12.004"},{"key":"ref2\/cit2","doi-asserted-by":"crossref","unstructured":"Jayaraju, N.; Barstad, L.; Niazimbetova, Z.; Rzeznik, M.; Lin, M.; Yee, D. In  Next Generation Copper Electroplating for HDI Micro-Via Filling and Through Hole Plating, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference; IEEE, 2015; pp 161\u2013164.","DOI":"10.1109\/IMPACT.2015.7365258"},{"key":"ref3\/cit3","doi-asserted-by":"crossref","unstructured":"Beica, R.; Buisson, T.; Pizzagalli, A. In  3D Packaging Technologies and Applications, Latest Challenges and Supply Chain Activities, 2nd International Symposium on Functional Diversification of Semiconductor Electronics (More-Than-Moore) Held during the 225th Meeting of The-Electrochemical-Society, Orlando, FL, 2014; pp 11\u201316.","DOI":"10.1149\/06106.0011ecst"},{"key":"ref4\/cit4","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2022.3174604"},{"key":"ref5\/cit5","doi-asserted-by":"publisher","DOI":"10.1016\/j.jelechem.2020.114318"},{"key":"ref6\/cit6","doi-asserted-by":"crossref","unstructured":"Larsson, E.; Zadegan, F. G. In  Accessing On-Chip Instruments Through the Life-time of Systems, 17th IEEE Latin-American Test Symposium (LATS), Foz do Iguacu, Brazil; IEEE, 2016; pp 2\u20134.","DOI":"10.1109\/LATW.2016.7483327"},{"key":"ref7\/cit7","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.4c12039"},{"key":"ref8\/cit8","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.3c06567"},{"key":"ref9\/cit9","doi-asserted-by":"publisher","DOI":"10.1147\/rd.425.0567"},{"key":"ref10\/cit10","doi-asserted-by":"publisher","DOI":"10.13208\/j.electrochem.2213001"},{"key":"ref11\/cit11","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2021.137907"},{"key":"ref12\/cit12","doi-asserted-by":"publisher","DOI":"10.1007\/s13391-022-00364-6"},{"key":"ref13\/cit13","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2013.09.096"},{"key":"ref14\/cit14","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2020.137707"},{"key":"ref15\/cit15","doi-asserted-by":"publisher","DOI":"10.1149\/1945-7111\/abee5d"},{"key":"ref16\/cit16","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2022.140018"},{"key":"ref17\/cit17","doi-asserted-by":"publisher","DOI":"10.1007\/s10910-014-0320-6"},{"key":"ref18\/cit18","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.4c05683"},{"key":"ref19\/cit19","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2024.160259"},{"key":"ref20\/cit20","doi-asserted-by":"publisher","DOI":"10.1016\/j.jelechem.2018.08.042"},{"key":"ref21\/cit21","doi-asserted-by":"publisher","DOI":"10.1016\/j.colsurfa.2024.134239"},{"key":"ref22\/cit22","doi-asserted-by":"publisher","DOI":"10.1016\/j.jiec.2021.10.027"},{"key":"ref23\/cit23","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.6b15400"},{"key":"ref24\/cit24","doi-asserted-by":"publisher","DOI":"10.1016\/j.dyepig.2020.108594"},{"key":"ref25\/cit25","doi-asserted-by":"publisher","DOI":"10.1149\/1945-7111\/ab98a9"},{"key":"ref26\/cit26","doi-asserted-by":"publisher","DOI":"10.1016\/j.jelechem.2023.117373"},{"key":"ref27\/cit27","doi-asserted-by":"publisher","DOI":"10.1149\/1.1390904"},{"key":"ref28\/cit28","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2013.05.061"},{"key":"ref29\/cit29","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2022.141013"},{"key":"ref30\/cit30","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2016.04.177"},{"key":"ref31\/cit31","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2015.08.037"},{"key":"ref32\/cit32","doi-asserted-by":"publisher","DOI":"10.1149\/1.3265971"},{"key":"ref33\/cit33","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2022.154871"},{"key":"ref34\/cit34","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2018.10.141"},{"key":"ref35\/cit35","doi-asserted-by":"publisher","DOI":"10.1149\/2.0181913jes"},{"key":"ref36\/cit36","doi-asserted-by":"publisher","DOI":"10.1016\/j.jelechem.2024.118340"},{"key":"ref37\/cit37","doi-asserted-by":"publisher","DOI":"10.1149\/1.1901670"},{"key":"ref38\/cit38","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2022.156266"},{"key":"ref39\/cit39","doi-asserted-by":"publisher","DOI":"10.1016\/j.jiec.2022.10.047"},{"key":"ref40\/cit40","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmapro.2024.05.041"},{"key":"ref41\/cit41","doi-asserted-by":"publisher","DOI":"10.1149\/1.2165743"},{"key":"ref42\/cit42","doi-asserted-by":"publisher","DOI":"10.1149\/2.0102001JES"},{"key":"ref43\/cit43","doi-asserted-by":"publisher","DOI":"10.1149\/2.0341901jes"},{"key":"ref44\/cit44","doi-asserted-by":"publisher","DOI":"10.1149\/1945-7111\/abd112"},{"key":"ref45\/cit45","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2021.137925"},{"key":"ref46\/cit46","doi-asserted-by":"publisher","DOI":"10.1149\/1945-7111\/ac4845"},{"key":"ref47\/cit47","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.3c10829"},{"key":"ref48\/cit48","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.4c09328"},{"key":"ref49\/cit49","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.4c19473"},{"key":"ref50\/cit50","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.4c19632"},{"key":"ref51\/cit51","doi-asserted-by":"publisher","DOI":"10.1023\/A:1021637209564"},{"key":"ref52\/cit52","doi-asserted-by":"publisher","DOI":"10.1149\/1.1838829"},{"key":"ref53\/cit53","doi-asserted-by":"publisher","DOI":"10.1149\/2.021302jes"},{"key":"ref54\/cit54","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2024.106089"}],"container-title":["ACS Applied Materials & Interfaces"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/pubs.acs.org\/doi\/pdf\/10.1021\/acsami.5c04034","content-type":"application\/pdf","content-version":"vor","intended-application":"unspecified"},{"URL":"https:\/\/pubs.acs.org\/doi\/pdf\/10.1021\/acsami.5c04034","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,7]],"date-time":"2025-05-07T08:49:18Z","timestamp":1746607758000},"score":1,"resource":{"primary":{"URL":"https:\/\/pubs.acs.org\/doi\/10.1021\/acsami.5c04034"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,22]]},"references-count":54,"journal-issue":{"issue":"18","published-print":{"date-parts":[[2025,5,7]]}},"alternative-id":["10.1021\/acsami.5c04034"],"URL":"https:\/\/doi.org\/10.1021\/acsami.5c04034","relation":{},"ISSN":["1944-8244","1944-8252"],"issn-type":[{"value":"1944-8244","type":"print"},{"value":"1944-8252","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4,22]]}}}