{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,23]],"date-time":"2026-10-23T19:44:06Z","timestamp":1792784646283,"version":"4.5.0"},"reference-count":65,"publisher":"American Chemical Society (ACS)","issue":"36","license":[{"start":{"date-parts":[[2026,9,4]],"date-time":"2026-09-04T00:00:00Z","timestamp":1788480000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,9,4]],"date-time":"2026-09-04T00:00:00Z","timestamp":1788480000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,9,4]],"date-time":"2026-09-04T00:00:00Z","timestamp":1788480000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-045"}],"funder":[{"DOI":"10.13039\/501100003845","name":"Indian Institute of Technology Madras","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003845","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001843","name":"Science and Engineering Research Board","doi-asserted-by":"publisher","award":["CRD\/2024\/000912"],"award-info":[{"award-number":["CRD\/2024\/000912"]}],"id":[{"id":"10.13039\/501100001843","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001843","name":"Science and Engineering Research Board","doi-asserted-by":"publisher","award":["SRG\/2023\/002282"],"award-info":[{"award-number":["SRG\/2023\/002282"]}],"id":[{"id":"10.13039\/501100001843","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2023M742723"],"award-info":[{"award-number":["2023M742723"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100018583","name":"Wuhan Science and Technology Project","doi-asserted-by":"publisher","award":["2023020302020572-04-03"],"award-info":[{"award-number":["2023020302020572-04-03"]}],"id":[{"id":"10.13039\/501100018583","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003819","name":"Natural Science Foundation of Hubei Province","doi-asserted-by":"publisher","award":["2026AFC0646"],"award-info":[{"award-number":["2026AFC0646"]}],"id":[{"id":"10.13039\/501100003819","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004543","name":"China Scholarship Council","doi-asserted-by":"publisher","award":["202310720002"],"award-info":[{"award-number":["202310720002"]}],"id":[{"id":"10.13039\/501100004543","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Ezhou\u2019s High-Level Innovation and Entrepreneurship Talent Plan \u201cWutong Project\u201d"},{"name":"Postdoctoral Innovative Research Position of Hubei Province"},{"name":"Ezhou\u2019s Optics Valley Science and Technology Innovation Corridor Special Program"},{"name":"High Value Intellectual Property Cultivation Project in Wuhan University of Science and Technology","id":[{"id":"https:\/\/ror.org\/00e4hrk88","id-type":"ROR","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,9,16]]},"abstract":"<jats:title>Abstract<\/jats:title>\n                  <jats:p>Premature cracking during free hot deformation (FHD) of n-type Bi2Te2.7Se0.3 limits the attainable strain, thereby interrupting dynamic recrystallization (DRX) and capping (0001) basal-texture development. Here, we identify this crack-limited DRX bottleneck through thermomechanical compression and interrupted-deformation evidence, and then eliminate it using hot extrusion (HE), where the inherently triaxial compressive stress state suppresses crack initiation and propagation. Crack-free extrusion enables near-complete DRX and a near-ideal (0001) basal texture, while retaining \u223c10 nm amorphous nanodomains, which contribute to reducing lattice thermal conductivity without degrading electrical transport. The optimized alloy is tougher\u201495.8 MPa in bending and 138.4 MPa in compression (+62%\/+48% vs FHD)\u2014and reaches zT \u2248 1.20 at 343 K. Importantly, under strictly identical single-stage micro-TEC assembly and test boundaries (identical p-legs; only n-legs varied), the extruded n-legs increase \u0394Tmax to an outstanding 75.8 K at Th \u2248 300 K, which is among the highest values reported for Bi2Te3-based TECs under comparable testing conditions. These results establish crack-free hot extrusion as a scalable route to remove the fracture-imposed DRX ceiling in layered brittle thermoelectrics and to translate microstructural gains into device-level cooling performance.<\/jats:p>","DOI":"10.1021\/acsami.6c08009","type":"journal-article","created":{"date-parts":[[2026,9,4]],"date-time":"2026-09-04T20:02:44Z","timestamp":1788552164000},"page":"49309-49326","source":"Crossref","is-referenced-by-count":1,"title":["Amorphous Nanodomains Enable High Device-Level Cooling Performance in Crack-Free Hot-Extruded n-Type Bi2Te3 Thermoelectrics"],"prefix":"10.1021","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-9669-0138","authenticated-orcid":true,"given":"Xiaoming","family":"Hu","sequence":"first","affiliation":[{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Deakin University , , , ,","place":["Geelong, VIC, Australia, 3216"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-2442-4620","authenticated-orcid":true,"given":"Veera Prabu","family":"Kannan","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Madras (IIT-Madras) , , ,","place":["Chennai, India, 600 036"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xin","family":"Chen","sequence":"additional","affiliation":[{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiachang","family":"Shui","sequence":"additional","affiliation":[{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yawei","family":"Li","sequence":"additional","affiliation":[{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guangqiang","family":"Li","sequence":"additional","affiliation":[{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9266-1468","authenticated-orcid":true,"given":"Xi\u2019an","family":"Fan","sequence":"additional","affiliation":[{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]},{"name":"Wuhan University of Science and Technology , , ,","place":["Wuhan, China, 430081"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4472-2780","authenticated-orcid":true,"given":"Bhuvanesh","family":"Srinivasan","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Madras (IIT-Madras) , , ,","place":["Chennai, India, 600 036"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Matthew","family":"Barnett","sequence":"additional","affiliation":[{"name":"Deakin University , , , ,","place":["Geelong, VIC, Australia, 3216"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"316","published-online":{"date-parts":[[2026,9,4]]},"reference":[{"issue":"6358","key":"2026091614074207100_cit1","doi-asserted-by":"publisher","DOI":"10.1126\/science.aak9997","article-title":"Advances in thermoelectric materials research: Looking back and moving forward","volume":"357","author":"He","year":"2017","journal-title":"Science"},{"key":"2026091614074207100_cit2","doi-asserted-by":"publisher","DOI":"10.1016\/j.cej.2022.138389","article-title":"Advances in thermoelectric devices for localized cooling","volume":"450","author":"Sun","year":"2022","journal-title":"Chem. Eng. J."},{"issue":"10","key":"2026091614074207100_cit3","doi-asserted-by":"publisher","first-page":"12276","DOI":"10.1021\/acsami.1c24627","article-title":"Fabrication and excellent performances of bismuth telluride-based thermoelectric devices","volume":"14","author":"Zhu","year":"2022","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"2026091614074207100_cit4","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtcomm.2020.101121","article-title":"Evolution of microstructure and performance of n-type BiTeSe thermoelectric materials fabricated by multi-path equal channel angular extrusion","volume":"24","author":"Hu","year":"2020","journal-title":"Mater. Today Commun."},{"issue":"5","key":"2026091614074207100_cit5","doi-asserted-by":"publisher","first-page":"719","DOI":"10.1002\/idm2.12252","article-title":"Manipulating Anti-Site Defects in \u03b1-MgAgSb for Thermoelectric Cooling Enhancement","volume":"4","author":"Li","year":"2025","journal-title":"Interdiscip. Mater."},{"key":"2026091614074207100_cit6","doi-asserted-by":"publisher","first-page":"5","DOI":"10.1016\/j.mattod.2023.03.021","article-title":"Highly efficient thermoelectric cooling performance of ultrafine-grained and nanoporous materials","volume":"65","author":"Xie","year":"2023","journal-title":"Mater. Today"},{"issue":"5876","key":"2026091614074207100_cit7","doi-asserted-by":"publisher","first-page":"634","DOI":"10.1126\/science.1156446","article-title":"High-thermoelectric performance of nanostructured bismuth antimony telluride bulk alloys","volume":"320","author":"Poudel","year":"2008","journal-title":"Science"},{"issue":"49","key":"2026091614074207100_cit8","doi-asserted-by":"publisher","first-page":"58974","DOI":"10.1021\/acsami.1c19172","article-title":"Enhancing the thermoelectric and mechanical properties of Bi0.5Sb1.5Te3 modulated by the texture and dense dislocation networks","volume":"13","author":"Qiu","year":"2021","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"2026091614074207100_cit9","doi-asserted-by":"publisher","first-page":"203","DOI":"10.1016\/j.nanoen.2017.05.031","article-title":"Simultaneous optimization of electrical and thermal transport properties of Bi0.5Sb1.5Te3 thermoelectric alloy by twin boundary engineering","volume":"37","author":"Yu","year":"2017","journal-title":"Nano Energy"},{"issue":"12","key":"2026091614074207100_cit10","doi-asserted-by":"publisher","first-page":"1559","DOI":"10.1016\/S0025-5408(96)00149-3","article-title":"Thermoelectric properties of p-type antimony bismuth telluride alloys prepared by cold pressing","volume":"31","author":"Navratil","year":"1996","journal-title":"Mater. Res. Bull."},{"issue":"8","key":"2026091614074207100_cit11","doi-asserted-by":"publisher","first-page":"2443","DOI":"10.1063\/1.1728990","article-title":"Effects of heavy deformation and annealing on the electrical properties of Bi2Te3","volume":"33","author":"Schultz","year":"1962","journal-title":"J. Appl. Phys."},{"issue":"50","key":"2026091614074207100_cit12","doi-asserted-by":"publisher","first-page":"60216","DOI":"10.1021\/acsami.1c19357","article-title":"Removing the oxygen-induced donor-like effect for high thermoelectric performance in n-type Bi2Te3-based compounds","volume":"13","author":"Tao","year":"2021","journal-title":"ACS Appl. Mater. Interfaces"},{"issue":"16","key":"2026091614074207100_cit13","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.84.165208","article-title":"Electronic structure and transport anisotropy of Bi2Te3 and Sb2Te3","volume":"84","author":"Yavorsky","year":"2011","journal-title":"Phys. Rev. B"},{"key":"2026091614074207100_cit14","doi-asserted-by":"publisher","first-page":"75","DOI":"10.1016\/j.mseb.2015.03.011","article-title":"Mechanically enhanced p-and n-type Bi2Te3-based thermoelectric materials reprocessed from commercial ingots by ball milling and spark plasma sintering","volume":"197","author":"Pan","year":"2015","journal-title":"Mater. Sci. Eng. B"},{"key":"2026091614074207100_cit15","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtnano.2023.100340","article-title":"Multi-scale hierarchical microstructure modulation towards high room temperature thermoelectric performance in n-type Bi2Te3-based alloys","volume":"22","author":"Li","year":"2023","journal-title":"Mater. Today Nano"},{"issue":"3","key":"2026091614074207100_cit16","doi-asserted-by":"publisher","first-page":"920","DOI":"10.1007\/s40843-024-3058-7","article-title":"High-performance near-room-temperature n-type Bi2Te3-based thermoelectric alloys with superior mechanical properties","volume":"68","author":"Liu","year":"2025","journal-title":"Sci. China Mater."},{"issue":"12","key":"2026091614074207100_cit17","doi-asserted-by":"publisher","first-page":"1856","DOI":"10.1093\/nsr\/nwaa259","article-title":"Bi2Te3-based applied thermoelectric materials: research advances and new challenges","volume":"7","author":"Pei","year":"2020","journal-title":"Natl. Sci. Rev."},{"issue":"21","key":"2026091614074207100_cit18","doi-asserted-by":"publisher","DOI":"10.1002\/advs.201901702","article-title":"Liquid-Phase Hot Deformation to Enhance Thermoelectric Performance of n-Type Bismuth-Telluride-Based Solid Solutions","volume":"6","author":"Wu","year":"2019","journal-title":"Adv. Sci."},{"issue":"10","key":"2026091614074207100_cit19","doi-asserted-by":"publisher","first-page":"1914","DOI":"10.2320\/matertrans.M2010065","article-title":"Equal channel angular extrusion technique for controlling the texture of n-type Bi2Te3 based thermoelectric materials","volume":"51","author":"Hayashi","year":"2010","journal-title":"Mater. Trans."},{"issue":"35","key":"2026091614074207100_cit20","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201803617","article-title":"Synergistic compositional\u2212mechanical\u2212thermal effects leading to a record high zT in n-type V2VI3 alloys through progressive hot deformation","volume":"28","author":"Hu","year":"2018","journal-title":"Adv. Funct. Mater."},{"issue":"2","key":"2026091614074207100_cit21","doi-asserted-by":"publisher","first-page":"345","DOI":"10.1016\/j.jmat.2022.09.017","article-title":"Suppressing the donor-like effect via fast extrusion engineering for high thermoelectric performance of polycrystalline Bi2Te2.79Se0.21","volume":"9","author":"Liu","year":"2023","journal-title":"J. Materiomics"},{"issue":"13","key":"2026091614074207100_cit22","doi-asserted-by":"publisher","first-page":"15429","DOI":"10.1021\/acsami.1c02417","article-title":"Achieving high thermoelectric performance of n-type Bi2Te2.79Se0.21 sintered materials by hot-stacked deformation","volume":"13","author":"Xiong","year":"2021","journal-title":"ACS Appl. Mater. Interfaces"},{"issue":"1\u22122","key":"2026091614074207100_cit23","doi-asserted-by":"publisher","first-page":"142","DOI":"10.1016\/0022-3697(58)90139-2","article-title":"Chemical bonding in bismuth telluride","volume":"5","author":"Drabble","year":"1958","journal-title":"J. Phys. Chem. Solids"},{"issue":"6","key":"2026091614074207100_cit24","doi-asserted-by":"publisher","first-page":"1668","DOI":"10.1007\/s11664-014-3510-x","article-title":"Effects of Van der Waals bonding on the compressive mechanical behavior of bulk Bi2Te3: A molecular dynamics study","volume":"44","author":"Huang","year":"2015","journal-title":"J. Electron. Mater."},{"issue":"3","key":"2026091614074207100_cit25","doi-asserted-by":"publisher","first-page":"235","DOI":"10.1134\/S002016852003005X","article-title":"Thermoelectric and Mechanical Properties of Pb-Doped Sb2Te3\u2212Bi2Te3 Solid Solutions","volume":"56","author":"Ivanova","year":"2020","journal-title":"Inorg. Mater."},{"issue":"3","key":"2026091614074207100_cit26","doi-asserted-by":"publisher","first-page":"471","DOI":"10.1007\/s40194-018-0579-5","article-title":"Heat-affected zone crack healing in IN939 repaired joints using hot isostatic pressing","volume":"62","author":"Xie","year":"2018","journal-title":"Weld. World"},{"key":"2026091614074207100_cit27","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesa.2022.106896","article-title":"Crack healing in infusible thermoplastic composite laminates","volume":"156","author":"Khan","year":"2022","journal-title":"Composites, Part A"},{"issue":"3","key":"2026091614074207100_cit28","doi-asserted-by":"publisher","first-page":"189","DOI":"10.1007\/s12209-023-00354-1","article-title":"Texture Engineering to Boost the Thermoelectric Properties","volume":"29","author":"Saglik","year":"2023","journal-title":"Trans. Tianjin Univ."},{"issue":"8","key":"2026091614074207100_cit29","doi-asserted-by":"publisher","first-page":"2412","DOI":"10.1016\/j.joule.2024.05.006","article-title":"General design of high-performance and textured layered thermoelectric materials via stacking of mechanically exfoliated crystals","volume":"8","author":"Zhu","year":"2024","journal-title":"Joule"},{"key":"2026091614074207100_cit30","doi-asserted-by":"publisher","first-page":"25","DOI":"10.1016\/B978-0-323-89822-5.00007-4","article-title":"Linear elastic fracture mechanics","author":"Anderson","year":"2017","journal-title":"Fract. Mech.: Curr. Status, Future Prospects, Proc. Conf."},{"issue":"11","key":"2026091614074207100_cit31","doi-asserted-by":"publisher","first-page":"817","DOI":"10.1038\/nmat3115","article-title":"The conflicts between strength and toughness","volume":"10","author":"Ritchie","year":"2011","journal-title":"Nat. Mater."},{"key":"2026091614074207100_cit32","doi-asserted-by":"publisher","first-page":"187","DOI":"10.1111\/j.1151-2916.1990.tb06493.x","article-title":"Perspective on the development of high-toughness ceramics","volume":"73","author":"Evans","year":"1990","journal-title":"J. Am. Ceram. Soc."},{"issue":"28","key":"2026091614074207100_cit33","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202301423","article-title":"High performance BiSbTe alloy for superior thermoelectric cooling","volume":"33","author":"Sun","year":"2023","journal-title":"Adv. Funct. Mater."},{"key":"2026091614074207100_cit34","doi-asserted-by":"publisher","first-page":"195","DOI":"10.1016\/j.actamat.2018.03.009","article-title":"On a novel strain indicator based on uncorrelated misorientation angles for correlating dislocation density to local strength","volume":"150","author":"Guglielmi","year":"2018","journal-title":"Acta Mater."},{"issue":"10","key":"2026091614074207100_cit35","doi-asserted-by":"publisher","first-page":"1519","DOI":"10.1039\/C0EE00012D","article-title":"Recrystallization induced in situ nanostructures in bulk bismuth antimony tellurides: a simple top down route and improved thermoelectric properties","volume":"3","author":"Shen","year":"2010","journal-title":"Energy Environ. Sci."},{"issue":"1","key":"2026091614074207100_cit36","doi-asserted-by":"publisher","first-page":"39","DOI":"10.1016\/j.matchemphys.2004.12.028","article-title":"Effect of TeI4 content on the thermoelectric properties of n-type Bi\u2212Te\u2212Se crystals prepared by zone melting","volume":"92","author":"Jiang","year":"2005","journal-title":"Mater. Chem. Phys."},{"issue":"2","key":"2026091614074207100_cit37","doi-asserted-by":"publisher","first-page":"552","DOI":"10.1039\/C2EE23549H","article-title":"Studies on the Bi2Te3\u2212Bi2Se3\u2212Bi2S3 system for mid-temperature thermoelectric energy conversion","volume":"6","author":"Liu","year":"2013","journal-title":"Energy Environ. Sci."},{"key":"2026091614074207100_cit38","doi-asserted-by":"publisher","first-page":"4431","DOI":"10.1016\/j.actamat.2012.05.008","article-title":"Improving thermoelectric properties of n-type bismuth\u2212telluride-based alloys by deformation-induced lattice defects and texture enhancement","volume":"60","author":"Hu","year":"2012","journal-title":"Acta Mater."},{"key":"2026091614074207100_cit39","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2025.121185","article-title":"Optimizing thermal-mechanical processes for high in-plane texture and thermoelectric performance of n-type Bi2Te3","volume":"295","author":"Feng","year":"2025","journal-title":"Acta Mater."},{"issue":"2","key":"2026091614074207100_cit40","doi-asserted-by":"publisher","DOI":"10.1002\/smsc.202300245","article-title":"Thermoelectric cooling performance enhancement in BiSeTe alloy by microstructure modulation via hot extrusion","volume":"4","author":"Zhang","year":"2024","journal-title":"Small Sci."},{"key":"2026091614074207100_cit41","doi-asserted-by":"publisher","first-page":"153","DOI":"10.1016\/j.actamat.2018.02.061","article-title":"Impurity-free, mechanical doping for the reproducible fabrication of the reliable n-type Bi2Te3-based thermoelectric alloys","volume":"150","author":"Jung","year":"2018","journal-title":"Acta Mater."},{"issue":"1","key":"2026091614074207100_cit42","doi-asserted-by":"publisher","DOI":"10.1093\/nsr\/nwae445","article-title":"Cooler, stronger, smaller: improving thermoelectric cooling","volume":"12","author":"Chauhan","year":"2025","journal-title":"Natl. Sci. Rev."},{"key":"2026091614074207100_cit43","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtphys.2023.101035","article-title":"Synergistically enhanced thermoelectric and mechanical performance of Bi2Te3 via industrial scalable hot extrusion method for cooling and power generation applications","volume":"32","author":"Lu","year":"2023","journal-title":"Mater. Today Phys."},{"key":"2026091614074207100_cit44","unstructured":"Laird Thermal Systems\n          . Thermoelectric Coolers Catalog. https:\/\/www.mouser.com\/datasheet\/2\/988\/Laird_Thermal_Systems_Thermoelectric_Coolers_Catal-3572265.pdf (accessed 2026-08-25)."},{"issue":"5","key":"2026091614074207100_cit45","doi-asserted-by":"publisher","DOI":"10.1002\/inf2.12663","article-title":"Enhanced cryogenic thermoelectric cooling of Bi0.5Sb1.5Te3 by carrier optimization","volume":"7","author":"Wang","year":"2025","journal-title":"InfoMat"},{"issue":"11","key":"2026091614074207100_cit46","doi-asserted-by":"publisher","first-page":"1728","DOI":"10.1016\/j.scib.2024.04.034","article-title":"Realizing high-efficiency thermoelectric module by suppressing donor-like effect and improving preferred orientation in n-type Bi2(Te, Se)3","volume":"69","author":"Li","year":"2024","journal-title":"Sci. Bull."},{"issue":"6","key":"2026091614074207100_cit47","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.aar5606","article-title":"Thermal conductivity in Bi0.5Sb1.5Te3+x and the role of dense dislocation arrays at grain boundaries","volume":"4","author":"Deng","year":"2018","journal-title":"Sci. Adv."},{"key":"2026091614074207100_cit48","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2019.138454","article-title":"Influence of phosphorus on hot deformation microstructure of a Ni-Fe-Cr based alloy","volume":"768","author":"Wu","year":"2019","journal-title":"Mater. Sci. Eng. A"},{"issue":"6561","key":"2026091614074207100_cit49","doi-asserted-by":"publisher","first-page":"1363","DOI":"10.1126\/science.abe7252","article-title":"Cryoforged nanotwinned titanium with ultrahigh strength and ductility","volume":"373","author":"Zhao","year":"2021","journal-title":"Science"},{"issue":"4","key":"2026091614074207100_cit50","doi-asserted-by":"publisher","DOI":"10.1063\/1.4908244","article-title":"Characterization of Lorenz number with Seebeck coefficient measurement","volume":"3","author":"Kim","year":"2015","journal-title":"APL Mater."},{"issue":"7","key":"2026091614074207100_cit51","doi-asserted-by":"publisher","first-page":"2106","DOI":"10.1039\/D0EE01349H","article-title":"Realizing record high performance in n-type Bi2Te3-based thermoelectric materials","volume":"13","author":"Zhu","year":"2020","journal-title":"Energy Environ. Sci."},{"issue":"8","key":"2026091614074207100_cit52","doi-asserted-by":"publisher","first-page":"3171","DOI":"10.1103\/PhysRevB.5.3171","article-title":"Elastic-Moduli and Phonon Properties of Bi2Te3","volume":"5","author":"Jenkins","year":"1972","journal-title":"Phys. Rev. B"},{"issue":"20","key":"2026091614074207100_cit53","doi-asserted-by":"publisher","DOI":"10.1002\/advs.202201353","article-title":"Modulation doping enables ultrahigh power factor and thermoelectric ZT in n-type Bi2Te2.7Se0.3","volume":"9","author":"Chen","year":"2022","journal-title":"Adv. Sci."},{"issue":"25","key":"2026091614074207100_cit54","doi-asserted-by":"publisher","first-page":"21372","DOI":"10.1021\/acsami.8b06533","article-title":"Enhanced thermoelectric performance in n-type Bi2Te3-based alloys via suppressing intrinsic excitation","volume":"10","author":"Hao","year":"2018","journal-title":"ACS Appl. Mater. Interfaces"},{"issue":"1","key":"2026091614074207100_cit55","doi-asserted-by":"publisher","first-page":"5053","DOI":"10.1038\/s41467-022-32773-4","article-title":"Glassy thermal conductivity in Cs3Bi2I6Cl3 single crystal","volume":"13","author":"Acharyya","year":"2022","journal-title":"Nat. Commun."},{"issue":"19","key":"2026091614074207100_cit56","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.80.045202","article-title":"Dynamic amorphization and recrystallization of metals in kinetic spray process","volume":"92","author":"Xiong","year":"2008","journal-title":"Appl. Phys. Lett."},{"issue":"4","key":"2026091614074207100_cit57","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.80.045202","article-title":"Atomistic simulation of amorphous germanium and its solid phase epitaxial recrystallization","volume":"80","author":"Posselt","year":"2009","journal-title":"Phys. Rev. B"},{"key":"2026091614074207100_cit58","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymer.2023.126011","article-title":"Mechanism of \u03b2\u03b1 recrystallization in isotactic polypropylene","volume":"279","author":"Lyu","year":"2023","journal-title":"Polymer"},{"issue":"4","key":"2026091614074207100_cit59","doi-asserted-by":"publisher","first-page":"1046","DOI":"10.1103\/PhysRev.113.1046","article-title":"Model for lattice thermal conductivity at low temperatures","volume":"113","author":"Callaway","year":"1959","journal-title":"Phys. Rev."},{"issue":"5","key":"2026091614074207100_cit60","doi-asserted-by":"publisher","DOI":"10.1002\/aenm.201401391","article-title":"Mechanically robust BiSbTe alloys with superior thermoelectric performance: a case study of stable hierarchical nanostructured thermoelectric materials","volume":"5","author":"Zheng","year":"2015","journal-title":"Adv. Energy Mater."},{"key":"2026091614074207100_cit61","first-page":"395","article-title":"Recherches sur quelques points importants de la Th\u00e9orie de la Chaleur","volume":"10","author":"Petit","year":"1819","journal-title":"Ann. Chim. Phys."},{"key":"2026091614074207100_cit62","volume-title":"Thermal conductivity: theory, properties, and applications","author":"Tritt","year":"2005"},{"issue":"24","key":"2026091614074207100_cit63","doi-asserted-by":"publisher","first-page":"17953","DOI":"10.1103\/PhysRevB.50.17953","article-title":"Projector augmented-wave method","volume":"50","author":"Bl\u00f6chl","year":"1994","journal-title":"Phys. Rev. B"},{"issue":"16","key":"2026091614074207100_cit64","doi-asserted-by":"publisher","first-page":"11169","DOI":"10.1103\/PhysRevB.54.11169","article-title":"Efficient iterative schemes for ab initio total-energy calculations using a plane-wave basis set","volume":"54","author":"Kresse","year":"1996","journal-title":"Phys. Rev. B"},{"issue":"3","key":"2026091614074207100_cit65","doi-asserted-by":"publisher","first-page":"1758","DOI":"10.1103\/PhysRevB.59.1758","article-title":"From ultrasoft pseudopotentials to the projector augmented-wave method","volume":"59","author":"Kresse","year":"1999","journal-title":"Phys. Rev. B"}],"container-title":["ACS Applied Materials &amp; Interfaces"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/pubs.acs.org\/doi\/pdf\/10.1021\/acsami.6c08009","content-type":"application\/pdf","content-version":"vor","intended-application":"unspecified"},{"URL":"https:\/\/pubs.acs.org\/aamick\/article-pdf\/18\/36\/49309\/68392632\/am-2026-080095.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/pubs.acs.org\/aamick\/article-pdf\/18\/36\/49309\/68392632\/am-2026-080095.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,9,16]],"date-time":"2026-09-16T18:30:49Z","timestamp":1789583449000},"score":1,"resource":{"primary":{"URL":"https:\/\/pubs.acs.org\/aamick\/article\/18\/36\/49309\/5421698\/Amorphous-Nanodomains-Enable-High-Device-Level"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,9,4]]},"references-count":65,"journal-issue":{"issue":"36","published-online":{"date-parts":[[2026,9,4]]},"published-print":{"date-parts":[[2026,9,16]]}},"URL":"https:\/\/doi.org\/10.1021\/acsami.6c08009","relation":{},"ISSN":["1944-8244","1944-8252"],"issn-type":[{"value":"1944-8244","type":"print"},{"value":"1944-8252","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,9,4]]}}}