{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,12]],"date-time":"2026-10-12T21:47:51Z","timestamp":1791841671966,"version":"4.3.4"},"reference-count":42,"publisher":"American Chemical Society (ACS)","issue":"34","license":[{"start":{"date-parts":[[2026,8,20]],"date-time":"2026-08-20T00:00:00Z","timestamp":1787184000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,8,20]],"date-time":"2026-08-20T00:00:00Z","timestamp":1787184000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,8,20]],"date-time":"2026-08-20T00:00:00Z","timestamp":1787184000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-045"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52072302"],"award-info":[{"award-number":["52072302"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52472108"],"award-info":[{"award-number":["52472108"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,9,2]]},"abstract":"<jats:title>Abstract<\/jats:title>\n                  <jats:p>The rapid miniaturization of electronic devices has exponentially increased power densities, making heat accumulation and transient thermal shocks primary bottlenecks. Phase-change thermal interface materials (PC-TIMs) offer a promising solution, but their application is hindered by low intrinsic thermal conductivity and liquid leakage. Furthermore, traditional outside-in impregnation strategies suffer from a severe trade-off between thermal conductivity enhancement and latent heat preservation. In this work, a hierarchical inside-out structural engineering strategy is proposed to fabricate a core\u2013sheath phase-change graphene fiber framework (GFF@PEG). Coaxial wet-spinning densely encapsulates a polyethylene glycol (PEG) core within a graphene oxide shell. Subsequent vacuum impregnation and chemical reduction create a \u201cthermal soldering\u201d effect, bridging discrete fibers to convert resistive point-to-point contacts into surface-to-surface interconnections, establishing an unbroken 3D phonon transport highway. Thus, the GFF@PEG composite achieves an exceptional thermal conductivity of 77.67 W m\u22121 K\u22121 while preserving a latent heat capacity of \u223c90 J g\u22121. Meanwhile, the robust graphene shell ensures near-zero leakage over 600 thermal cycles. In a simulated chip cooling system (20 W cm\u22122), it delivered a dramatic 60.7 \u00b0C temperature reduction. Ultimately, this fully enveloped paradigm circumvents traditional interfacial thermal barriers, providing a highly robust dual-mode thermal management solution for high-power electronics.<\/jats:p>","DOI":"10.1021\/acsami.6c10088","type":"journal-article","created":{"date-parts":[[2026,8,20]],"date-time":"2026-08-20T13:02:01Z","timestamp":1787230921000},"page":"46483-46495","source":"Crossref","is-referenced-by-count":0,"title":["Breaking the Thermal Conductivity\u2013Latent Heat Trade-Off: Hierarchical Core\u2013Shell Phase-Change Graphene Fiber Frameworks for Advanced Thermal Management"],"prefix":"10.1021","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2597-2482","authenticated-orcid":true,"given":"Yongkang","family":"Han","sequence":"first","affiliation":[{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]},{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tiehu","family":"Li","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]},{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lizhe","family":"Li","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanying","family":"Han","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]},{"name":"Shenzhen Research Institute of Northwestern Polytechnical University , Sanhang Science & Technology Building, No. 45th, Gaoxin South 9th Road, Nanshan District , ,","place":["Shenzhen City, P. R. China, 518057"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiahe","family":"Chen","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]},{"name":"Shenzhen Research Institute of Northwestern Polytechnical University , Sanhang Science & Technology Building, No. 45th, Gaoxin South 9th Road, Nanshan District , ,","place":["Shenzhen City, P. R. China, 518057"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuhui","family":"Liu","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University , , ,","place":["Xi'an, P. R. China, 710072"]},{"name":"Shenzhen Research Institute of Northwestern Polytechnical University , Sanhang Science & Technology Building, No. 45th, Gaoxin South 9th Road, Nanshan District , ,","place":["Shenzhen City, P. R. 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