{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,14]],"date-time":"2026-10-14T13:45:31Z","timestamp":1791985531247,"version":"4.4.0"},"reference-count":42,"publisher":"American Chemical Society (ACS)","issue":"40","license":[{"start":{"date-parts":[[2026,9,29]],"date-time":"2026-09-29T00:00:00Z","timestamp":1790640000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,9,29]],"date-time":"2026-09-29T00:00:00Z","timestamp":1790640000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"},{"start":{"date-parts":[[2026,9,29]],"date-time":"2026-09-29T00:00:00Z","timestamp":1790640000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-045"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52375327"],"award-info":[{"award-number":["52375327"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,10,14]]},"abstract":"<jats:title>Abstract<\/jats:title>\n                  <jats:p>Oxidation susceptibility and insufficient service reliability remain major limitations for Cu-based conductive inks in flexible electronics. Here, size-tunable Cu@Ag core\u2013shell nanoparticles were processed by millisecond intense pulsed light (IPL) sintering to establish a rapid route toward conductive and durable flexible electrodes. Comparative finite-element thermal analysis and electrical measurements establish a practical IPL processing window, while electron microscopy and complementary diffraction analysis support energy-dependent interparticle connection and localized Cu\u2013Ag interfacial reconstruction without assuming homogeneous alloying throughout the film. The sheet resistance reaches a minimum of 0.06 \u03a9\/sq at 5.0 J\/cm2, whereas 4.5 J\/cm2 is selected as the practical baseline because it provides a more favorable balance among conductivity, film integrity, environmental stability, flexibility, adhesion, and limited cumulative substrate heating. Films processed within this window maintain low resistance during damp-heat and cryogenic exposure and exhibit stable electrical behavior during repeated bending. At the device level, the 4.5 J\/cm2 electrode enables a contact-separation triboelectric nanogenerators (TENG) with an open-circuit voltage of 275.45 V and a peak power density of 0.71 W\/m2. In otherwise identical alternating-current electroluminescent (ACEL) devices, increasing the electrode-processing energy from 1.5 to 4.5 J\/cm2 markedly increases luminance, directly linking the IPL-defined electrode state to device performance. The integrated patterned platform further enables tactile-position visual feedback. These results establish an evidence-based processing-thermal response-structure-reliability-device relationship for IPL-sintered Cu@Ag NPs flexible electrodes.<\/jats:p>","DOI":"10.1021\/acsami.6c16213","type":"journal-article","created":{"date-parts":[[2026,9,29]],"date-time":"2026-09-29T19:02:16Z","timestamp":1790708536000},"page":"55371-55384","source":"Crossref","is-referenced-by-count":0,"title":["Intense Pulsed Light Sintering of Cu@Ag Core-Shell Nanoparticles: Durable Flexible Electrodes and Electroluminescent Visual Feedback"],"prefix":"10.1021","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0510-4525","authenticated-orcid":true,"given":"Zhenfeng","family":"Li","sequence":"first","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yifan","family":"Zhao","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zixu","family":"Wang","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinyang","family":"Li","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenglong","family":"Zhou","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Peng","family":"He","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0170-3835","authenticated-orcid":true,"given":"Shuye","family":"Zhang","sequence":"additional","affiliation":[{"name":"Harbin Institute of Technology , , ,","place":["Harbin, China, 150001"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"316","published-online":{"date-parts":[[2026,9,29]]},"reference":[{"key":"2026101408081261700_cit1","doi-asserted-by":"publisher","first-page":"327","DOI":"10.1007\/s40684-020-00193-8","article-title":"A review on intense pulsed light sintering technologies for conductive electrodes in printed electronics","volume":"8","author":"Jang","year":"2021","journal-title":"Int. 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