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The corrosion inhibiting action of TZV for copper in 0.5 M H2SO4 solutions was assessed by potentiodynamic polarization and electrochemical impedance spectroscopy. The corroded copper surfaces were evaluated by scanning electron microscopy. Thereafter, the thermodynamics of TZV adsorption onto copper was computed and evaluated. As a result, the target TZV compound shows great corrosion inhibition performance to protect copper in sulfuric acid. Thermodynamic test results reveal that the Langmuir, Dhar\u2013Flory\u2013Huggins, and Bockris\u2013Swinkels isotherm models provide a better description for the adsorption process of TZV on the metal surface. The calculated values of \u0394Gads0 indicate a spontaneous adsorption process of TZV on the copper surface accompanied by two kinds of interactions, physical adsorption and chemisorption.<\/jats:p>","DOI":"10.1021\/acsomega.9b03475","type":"journal-article","created":{"date-parts":[[2020,2,25]],"date-time":"2020-02-25T08:35:36Z","timestamp":1582619736000},"page":"4415-4423","source":"Crossref","is-referenced-by-count":22,"title":["Electrochemical Investigation of Tetrazolium Violet\nas a Novel Copper Corrosion Inhibitor in an Acid Environment"],"prefix":"10.1021","volume":"5","author":[{"given":"Zhihua","family":"Tao","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China , , ,","place":["Chengdu, China, 610054"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guanting","family":"Liu","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China , , ,","place":["Chengdu, China, 610054"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuanxun","family":"Li","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China (UESTC) , , ,","place":["Chengdu, China, 610054"]},{"name":"Dongguan Chengqi Cichuang Innovation Materials Company, Ltd. , ,","place":["Dongguan, China, 523808"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ruoyu","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China , , ,","place":["Chengdu, China, 610054"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hua","family":"Su","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China (UESTC) , , ,","place":["Chengdu, China, 610054"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sheng","family":"Li","sequence":"additional","affiliation":[{"name":"Zhenhua Electronic Information Industry Technology Research Company, Ltd. , , ,","place":["Guiyang, Guizhou, China, 550000"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"316","published-online":{"date-parts":[[2020,2,25]]},"reference":[{"key":"2026090201515829000_cit1","doi-asserted-by":"publisher","first-page":"492","DOI":"10.1016\/j.apsusc.2019.01.291","article-title":"The influence\nof copper\non the stress corrosion cracking of 304 stainless steel","volume":"478","author":"Wang","year":"2019","journal-title":"Appl. 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