{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,7]],"date-time":"2025-06-07T04:03:59Z","timestamp":1749269039602,"version":"3.41.0"},"reference-count":13,"publisher":"Springer Science and Business Media LLC","issue":"1-2","license":[{"start":{"date-parts":[[1997,2,1]],"date-time":"1997-02-01T00:00:00Z","timestamp":854755200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[1997,2,1]],"date-time":"1997-02-01T00:00:00Z","timestamp":854755200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Journal of Electronic Testing"],"published-print":{"date-parts":[[1997,2]]},"DOI":"10.1023\/a:1008218414112","type":"journal-article","created":{"date-parts":[[2002,12,22]],"date-time":"2002-12-22T13:47:34Z","timestamp":1040564854000},"page":"39-53","source":"Crossref","is-referenced-by-count":7,"title":["Smart Substrate MCMs"],"prefix":"10.1007","volume":"10","author":[{"given":"Anne E.","family":"Gattiker","sequence":"first","affiliation":[]},{"given":"Wojciech","family":"Maly","sequence":"additional","affiliation":[]}],"member":"297","reference":[{"key":"129500_CR1","doi-asserted-by":"crossref","unstructured":"J. Hagge and R. Wagner, \u201cHigh-Yield Assembly of Multichip Modules Through Known-Good IC's and Effective Test Strategies,\u201d Proceedings of the IEEE, Dec. 1992, Vol. 80, No.12, pp. 1965\u20131994.","DOI":"10.1109\/5.192076"},{"issue":"2","key":"129500_CR2","doi-asserted-by":"crossref","first-page":"64","DOI":"10.1109\/54.282446","volume":"11","author":"W. Maly","year":"1994","unstructured":"W. Maly, D. Feltham, A. Gattiker, M. Hobaugh, K. Backus, and M. Thomas,\u201cMulti-Chip Module Smart Substrate System,\u201d IEEE Design and Test of Computers, Vol. 11, No.2, pp. 64\u201373, June 1994.","journal-title":"IEEE Design and Test of Computers"},{"issue":"10","key":"129500_CR3","doi-asserted-by":"crossref","first-page":"32","DOI":"10.1109\/MSPEC.1984.6370295","volume":"21","author":"J. McDonald","year":"1984","unstructured":"J. McDonald, E. Rogers, K. Rose, and A. Steckl,\u201cThe Trials of Wafer Scale Integration,\u201d IEEE Spectrum, Vol. 21, No.10, pp. 32\u201339, Oct. 1984.","journal-title":"IEEE Spectrum"},{"key":"129500_CR4","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4613-1625-1","volume-title":"Wafer Level System Integration: Implementation Issues","author":"S. Tewksbury","year":"1989","unstructured":"S. Tewksbury, Wafer Level System Integration: Implementation Issues, Kluwer Academic Press, Norwell, Mass., 1989."},{"issue":"4","key":"129500_CR5","doi-asserted-by":"crossref","first-page":"58","DOI":"10.1109\/2.129050","volume":"25","author":"W. Maly","year":"1992","unstructured":"W. Maly,\u201cProspects for WSI: A Manufacturing Perspective,\u201d Computer, Vol. 25, No.4, pp. 58\u201365, April 1992.","journal-title":"Computer"},{"key":"129500_CR6","doi-asserted-by":"crossref","unstructured":"A. Gattiker, W. Maly, and M. Thomas,\u201cAre There Any Alternatives to Known Good Die?,\u201d Proc. IEEE Multichip Module Conference, March 1994, pp. 102\u2013107.","DOI":"10.1109\/MCMC.1994.292519"},{"key":"129500_CR7","doi-asserted-by":"crossref","unstructured":"A. Gattiker and W. Maly,\u201cFeasibility Study of Smart Substrate Multichip Modules,\u201d Proc. IEEE International Test Conference, Oct. 1994, pp. 41\u201349.","DOI":"10.1109\/TEST.1994.527934"},{"key":"129500_CR8","unstructured":"Embedded Controllers Databook, National Semiconductor Corp., Santa Clara, CA, pp. 2-307\u20132-315, 1992."},{"key":"129500_CR9","volume-title":"Standard Test Access Port and Boundary-Scan Architecture","author":"IEEE Standard 1149.1","year":"1990","unstructured":"IEEE Standard 1149.1, \u201cStandard Test Access Port and Boundary-Scan Architecture,\u201d IEEE Standards Board, Piscataway, N.J., 1990."},{"key":"129500_CR10","doi-asserted-by":"crossref","unstructured":"Y. Zorian, \u201cA Universal Testability Strategy for MultiChip Modules Based on BIST and Boundary-Scan,\u201d IEEE International Conference on Computer Design, Oct. 1992, pp. 59\u201365.","DOI":"10.1109\/ICCD.1992.276206"},{"key":"129500_CR11","unstructured":"W. McClean (ed.), \u201cMid-Term 1991 Status and Forecast of the Industry,\u201d Integrated Circuit Engineering Corporation, 1991."},{"key":"129500_CR12","doi-asserted-by":"crossref","unstructured":"I. Saadat, M. Thomas, A. Gattiker, and W. Maly,\u201cDesign of Manufacturing Strategy with Wafer Cost Estimation,\u201d Extended Abstracts of Proc. International Symposium on Semiconductor\nManufacturing, June 1994, pp. 57\u201360.","DOI":"10.1109\/ISSM.1994.729423"},{"key":"129500_CR13","doi-asserted-by":"crossref","unstructured":"W. Maly and P. Nigh, \u201cBuilt-in Current Testing: A Feasibility Study,\u201d Proc. of the 1988 ICCAD, Nov. 1988, pp. 340\u2013343.","DOI":"10.1109\/ICCAD.1988.122524"}],"container-title":["Journal of Electronic Testing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1023\/A:1008218414112.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1023\/A:1008218414112\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1023\/A:1008218414112.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T10:11:48Z","timestamp":1749204708000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1023\/A:1008218414112"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1997,2]]},"references-count":13,"journal-issue":{"issue":"1-2","published-print":{"date-parts":[[1997,2]]}},"alternative-id":["129500"],"URL":"https:\/\/doi.org\/10.1023\/a:1008218414112","relation":{},"ISSN":["0923-8174","1573-0727"],"issn-type":[{"type":"print","value":"0923-8174"},{"type":"electronic","value":"1573-0727"}],"subject":[],"published":{"date-parts":[[1997,2]]}}}