{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T10:40:06Z","timestamp":1749206406902,"version":"3.41.0"},"reference-count":14,"publisher":"Springer Science and Business Media LLC","issue":"5","license":[{"start":{"date-parts":[[2000,10,1]],"date-time":"2000-10-01T00:00:00Z","timestamp":970358400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2000,10,1]],"date-time":"2000-10-01T00:00:00Z","timestamp":970358400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Journal of Electronic Testing"],"published-print":{"date-parts":[[2000,10]]},"DOI":"10.1023\/a:1008364515030","type":"journal-article","created":{"date-parts":[[2002,12,22]],"date-time":"2002-12-22T14:41:38Z","timestamp":1040568098000},"page":"453-461","source":"Crossref","is-referenced-by-count":3,"title":["IDDQ Testing of Submicron CMOS\u2014by Cooling?"],"prefix":"10.1007","volume":"16","author":[{"given":"M.","family":"Rencz","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"V.","family":"Sz\u00e9kely","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"T\u00f6r\u00f6k","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.","family":"Torki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"B.","family":"Courtois","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","reference":[{"key":"270872_CR1","unstructured":"V. Sz\u00e9kely, M. Rencz, S. T\u00f6r\u00f6k, and B. Courtois, \u201cIDDQ Testing of Submicron CMOS by Cooling,\u201d Seventh Asian Test Symposium (ATS'98), Singapore, Dec. 2-4, 1998."},{"issue":"25","key":"270872_CR2","doi-asserted-by":"crossref","first-page":"2117","DOI":"10.1049\/el:19971406","volume":"33","author":"V. Sz\u00e9kely","year":"1997","unstructured":"V. Sz\u00e9kely, M. Rencz, S. T\u00f6r\u00f6k, and B. Courtois, \u201cCooling is a Possible Way to Extend the Usability of IDDQ Testing,\u201d Electronics Letters, Vol. 33, No. 25, pp. 2117-2118, Dec. 1997.","journal-title":"Electronics Letters"},{"key":"270872_CR3","doi-asserted-by":"crossref","unstructured":"T.W. Williams, R.H. Dennard, R. Kapur, M.R. Mercer, and W. Maly, \u201cIddq Testing for High Performance CMOS-The Next Ten Years,\u201d European Design & Test Conference, March 1996, pp. 578-583.","DOI":"10.1109\/EDTC.1996.494359"},{"key":"270872_CR4","doi-asserted-by":"crossref","unstructured":"T.W. Williams, R. Kapur, M.R. Mercer, R.H. Dennard, and W. Maly, \u201cIddq Test: Sensitivity Analysis of Scaling,\u201d Proceedings of IEEE International Test Conference, Washington, USA, Oct. 20-25, 1996, pp. 786-792.","DOI":"10.1109\/TEST.1996.557138"},{"key":"270872_CR5","unstructured":"M. Sachdev, \u201cDeep Sub-Micron IDDQTest Options,\u201d Proceedings of IEEE International Test Conference, Washington, USA, Oct. 20-25, 1996, pp. 786-792."},{"key":"270872_CR6","doi-asserted-by":"crossref","unstructured":"M. Sachdev, \u201cDeep Sub-Micron IDDQ Testing: Issues and Solutions,\u201d Proceeding of European Design & Test Conference, Paris, France, March 17-20, 1997, pp. 271-278.","DOI":"10.1109\/EDTC.1997.582370"},{"key":"270872_CR7","doi-asserted-by":"crossref","unstructured":"A. Keshavarzi, K. Roy, and C. Hawkins, \u201cIntrinsic Leakage in Low Power Deep Submicron CMOS ICs,\u201d Proceedings of ITC'97, Washington, USA, Nov. 1-6 1997, pp. 146-155.","DOI":"10.1109\/TEST.1997.639607"},{"key":"270872_CR8","first-page":"167","volume-title":"ETW98","author":"C. Hawkins","year":"1998","unstructured":"C. Hawkins, A. Keshavarzi, and K. Roy, \u201cHigh performance CMOS IC Challenges in IDDQ Testing, Compendium of Papers,\u201d ETW98, Sitges, Barcelona, Spain, May 27-29, 1998, pp. 167-170."},{"key":"270872_CR9","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-7091-9247-4","volume-title":"MOSFET Models for VLSI Circuit Simulation","author":"N. Arora","year":"1993","unstructured":"N. Arora, MOSFET Models for VLSI Circuit Simulation, Springer Verlag, New York, 1993."},{"issue":"12","key":"270872_CR10","doi-asserted-by":"crossref","first-page":"10","DOI":"10.1016\/S0924-4247(98)00165-4","volume":"71","author":"V. Sz\u00e9kely","year":"1998","unstructured":"V. Sz\u00e9kely, M. Rencz, S. T\u00f6r\u00f6k, Cs. M\u00e1rta, and L. Lipt\u00e1k-Feg\u00f3, \u201cCMOS Temperature Sensors and Built-in Test Circuitry for Thermal Testing of ICs,\u201d Sensors and Actuators, A. Physical, Vol. 71, No. 12, pp. 10-18, 1998.","journal-title":"Sensors and Actuators, A. Physical"},{"key":"270872_CR11","volume-title":"Physics of Semiconductor Devices","author":"S.M. Sze","year":"1981","unstructured":"S.M. Sze, Physics of Semiconductor Devices, John Wiley & Sons, New York, 1981."},{"key":"270872_CR12","unstructured":"E.A. Guti\u00e9rrez-D, J. De la Hidalga-W, M.J. Deen, and S.V. Koshevaya, \u201cAn Alternative Method to Monitor and Control the IC Temperature in the 4.2-77 K range,\u201d Proceedings of ESSDERC'97, Stuttgart, Germany, Sept. 22-24 1997, pp. 436-439."},{"key":"270872_CR13","doi-asserted-by":"crossref","unstructured":"A. Pfahnl, J.H. Lienhard, and A.H. Slocum, \u201cTemperature Control of a Handler Test Interface,\u201d Proceedings of IEEE International Test Conference ITC'98, Washington, DC, USA, Oct. 18-23, 1998, pp. 114-118.","DOI":"10.1109\/TEST.1998.743144"},{"key":"270872_CR14","doi-asserted-by":"crossref","unstructured":"M. Malinoski, J. Maveety, S. Knostman, and T. Jones, \u201cA Test Site Thermal Control System for At-Speed Manufacturing Testing,\u201d Proceedings of IEEE International Test Conference, ITC'98, Washington, DC, USA, Oct. 18-23, 1998, pp. 119-128.","DOI":"10.1109\/TEST.1998.743145"}],"container-title":["Journal of Electronic Testing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1023\/A:1008364515030.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1023\/A:1008364515030\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1023\/A:1008364515030.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T10:07:38Z","timestamp":1749204458000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1023\/A:1008364515030"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2000,10]]},"references-count":14,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2000,10]]}},"alternative-id":["270872"],"URL":"https:\/\/doi.org\/10.1023\/a:1008364515030","relation":{},"ISSN":["0923-8174","1573-0727"],"issn-type":[{"type":"print","value":"0923-8174"},{"type":"electronic","value":"1573-0727"}],"subject":[],"published":{"date-parts":[[2000,10]]}}}