{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T10:40:04Z","timestamp":1749206404665,"version":"3.41.0"},"reference-count":27,"publisher":"Springer Science and Business Media LLC","issue":"1-2","license":[{"start":{"date-parts":[[1999,2,1]],"date-time":"1999-02-01T00:00:00Z","timestamp":917827200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[1999,2,1]],"date-time":"1999-02-01T00:00:00Z","timestamp":917827200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Journal of Electronic Testing"],"published-print":{"date-parts":[[1999,2]]},"DOI":"10.1023\/a:1008397205559","type":"journal-article","created":{"date-parts":[[2002,12,22]],"date-time":"2002-12-22T14:41:38Z","timestamp":1040568098000},"page":"57-66","source":"Crossref","is-referenced-by-count":6,"title":["Differential Thermal Testing: An Approach to its Feasibility"],"prefix":"10.1007","volume":"14","author":[{"given":"J.","family":"Altet","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Rubio","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W.","family":"Claeys","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.","family":"Dilhaire","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"E.","family":"Schaub","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Tamamoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","reference":[{"key":"195550_CR1","unstructured":"E. Korczynski, \u201cMorre' Law Extended: The Return of Cleverness,\u201d Solid State Technology, July 1997."},{"issue":"4","key":"195550_CR2","doi-asserted-by":"crossref","first-page":"61","DOI":"10.1109\/54.544537","volume":"13","author":"J.M. Soden","year":"1996","unstructured":"J.M. Soden and C.F. Hawkins, \u201cIddq Testing: Issues Present and Future,\u201d IEEE Design & Test of Computers, Vol. 13, No. 4, pp. 61\u201365, Winter 1996.","journal-title":"IEEE Design & Test of Computers"},{"key":"195550_CR3","doi-asserted-by":"crossref","unstructured":"A. Rubio, E. Janssens, H. Casier, J. Figueras, D. Mateo, P. De Pauw, and J. Segura, \u201cA Built-in Quiescent Current Monitor for CMOS VLSI Circuits,\u201d Proceedings of the European Design and Test Conference ED&TC, 1995, pp. 581\u2013585.","DOI":"10.1109\/EDTC.1995.470341"},{"key":"195550_CR4","doi-asserted-by":"crossref","unstructured":"J.A. Segura, M. Roca, D. Mateo, and A. Rubio, \u201cAn Approach to Dynamic Power Consumption Current Testing of CMOS ICs,\u201d Proceedings of the VLSI Test Symposium, 1995, pp. 95\u2013100.","DOI":"10.1109\/VTEST.1995.512623"},{"key":"195550_CR5","doi-asserted-by":"crossref","unstructured":"W.T. Matzen, R.A. Meadows, J.D. Merryman, and S.P. Emmons, \u201cThermal Techniques as Applied to Functional Electronic Blocks,\u201d Proceedings IEEE, Dec. 1964, pp. 1496\u20131501.","DOI":"10.1109\/PROC.1964.3438"},{"issue":"1","key":"195550_CR6","doi-asserted-by":"crossref","first-page":"8","DOI":"10.1109\/JSSC.1971.1050152","volume":"sc-6","author":"P.R. Gray","year":"1971","unstructured":"P.R. Gray and D.J. Hamilton, \u201cAnalysis of Electrothermal Integrated Circuits,\u201d IEEE Journal of Solid-State Circuits, Vol. sc-6, No. 1, pp. 8\u201314, Feb. 1971.","journal-title":"IEEE Journal of Solid-State Circuits"},{"issue":"2","key":"195550_CR7","doi-asserted-by":"crossref","first-page":"61","DOI":"10.1109\/JSSC.1974.1050463","volume":"sc-9","author":"P.R. Gray","year":"1974","unstructured":"P.R. Gray, D.J. Hamilton, and J.D. Lieux, \u201cAnalysis and Design of Temperature Stabilized Substrate Integrated Circuits,\u201d IEEE Journal of Solid-State Circuits,Vol. sc-9, No. 2, pp. 61\u201369, April 1974.","journal-title":"IEEE Journal of Solid-State Circuits"},{"key":"195550_CR8","doi-asserted-by":"crossref","first-page":"157","DOI":"10.1016\/0026-2692(94)90008-6","volume":"25","author":"V. Sz\u00e9kely","year":"1994","unstructured":"V. Sz\u00e9kely, \u201cThermal Monitoring of Microelectronic Structures,\u201d Microelectronics Journal, Vol. 25, pp. 157\u2013170, 1994.","journal-title":"Microelectronics Journal"},{"issue":"3","key":"195550_CR9","first-page":"227","volume":"sc-15","author":"P. Antognetti","year":"1980","unstructured":"P. Antognetti, G.R. Bisio, F. Curatelli, and S. Palara, \u201cThree-Dimensional Transient Thermal Simulation: Application to Delayed Short Circuit Protection in Power IC',\u201d IEEE Journal of Solid-State Circuits, Vol. sc-15, No. 3, pp. 227\u2013281, 1980.","journal-title":"IEEE Journal of Solid-State Circuits"},{"issue":"9","key":"195550_CR10","doi-asserted-by":"crossref","first-page":"1363","DOI":"10.1016\/0038-1101(88)90099-8","volume":"31","author":"V. Sz\u00e9kely","year":"1988","unstructured":"V. Sz\u00e9kely and T.V. Bien, \u201cFine Structure of Heat Flow Path in Semiconductor Devices: A Measurement and Identification Method,\u201d Solid State Electronics, Vol. 31, No. 9, pp. 1363\u20131368, 1988.","journal-title":"Solid State Electronics"},{"key":"195550_CR11","doi-asserted-by":"crossref","first-page":"157","DOI":"10.1016\/0026-2692(94)90008-6","volume":"25","author":"V. Sz\u00e9kely","year":"1994","unstructured":"V. Sz\u00e9kely, \u201cThermal Monitoring of Microelectronic Structures,\u201d Microelectronics Journal, Vol. 25, pp. 157\u2013170, 1994.","journal-title":"Microelectronics Journal"},{"key":"195550_CR12","doi-asserted-by":"crossref","first-page":"29","DOI":"10.1016\/S0924-4247(96)01246-0","volume":"55","author":"V. Sz\u00e9kely","year":"1996","unstructured":"V. Sz\u00e9kely, Cs. M\u00e1rta, M. Rencz, Zs. Benedek, and B. Courtois, \u201cDesign for Thermal Testability (DfTT) and a CMOS Realization,\u201d Sensors and Actuators A, Vol. 55, pp. 29\u201333, 1996.","journal-title":"Sensors and Actuators A"},{"key":"195550_CR13","unstructured":"V. Sz\u00e9kely, M. Rencz, J.M. Karam, M. Lubaszewski, and B. Courtois, \u201cThermal monitoring of self-checking systems,\u201d Proc. of 2nd IEEE International On-Line Testing Workshop, Biarritz, France, July 1996, pp. 6\u201312."},{"issue":"3","key":"195550_CR14","doi-asserted-by":"crossref","first-page":"270","DOI":"10.1109\/92.609869","volume":"5","author":"V. Sz\u00e9kely","year":"1997","unstructured":"V. Sz\u00e9kely, Cs. M\u00e1rta, Zs. Koh\u00e1ri, and M. Rencz, \u201cCMOS Sensors for On-Line Thermal Monitoring of VLSI Circuits,\u201d IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 5, No. 3, pp. 270\u2013276, Sept. 1997.","journal-title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems"},{"key":"195550_CR15","unstructured":"B. Courtois, V. Sz\u00e9kely, M. Rencz, A. Napieralski, V. Koval, and F. Beleznay, \u201cMain Foals and Obtained Results of the THERMINIC Project,\u201d Eurotherm 57, Nantes, Sept. 1997, pp. 122\u2013128."},{"key":"195550_CR16","unstructured":"S. Nishino and K. Ahshima, \u201cA Study on Fault Detection for MSI\/LSI Board by Thermography,\u201d Proc. of Pacific Rim International Symposium on Fault Tolerant Computing, Melbourne, Australia, Dec. 1993, pp. 198\u2013202."},{"key":"195550_CR17","unstructured":"S. Nishino and K. Ahshima, \u201cVLSI PCB Fault Detection Ability Using Thermography,\u201d The Bulletin of the Oyama National College of Technology, No. 27, March 1995."},{"key":"195550_CR18","doi-asserted-by":"crossref","unstructured":"J. Altet and A. Rubio, \u201cDifferential Sensing Strategy for Dynamic Thermal Testing of ICs,\u201d Proceedings of the 15th IEEE VLSI Test Symposium, Monterey, USA, April\/May 1997, pp. 434\u2013439, ISBN 0-8186-7810-0.","DOI":"10.1109\/VTEST.1997.600328"},{"issue":"18","key":"195550_CR19","doi-asserted-by":"crossref","first-page":"1656","DOI":"10.1049\/el:19911035","volume":"27","author":"A. Rubio","year":"1991","unstructured":"A. Rubio, J. Figueras, R. Rodriguez, and J. Segura, \u201cIddq Secondary Components in CMOS Logic Circuits Preceded by Defective Stages Affected by Analogue Type Faults,\u201d IEE Electronics Letters, Vol. 27, No. 18, pp. 1656\u20131658, Aug. 1991.","journal-title":"IEE Electronics Letters"},{"key":"195550_CR20","doi-asserted-by":"crossref","first-page":"35","DOI":"10.1007\/BF00136074","volume":"8","author":"R. Rodr\u00edguez-Monta\u00f1\u00e9s","year":"1996","unstructured":"R. Rodr\u00edguez-Monta\u00f1\u00e9s, E.M.J.G. Bruls, and J. Figueras, \u201cBridging Defects Resistance in the Metal Layer of a CMOS Process,\u201d Journal of Electronic Testing: Theory and Applications, Vol. 8, pp. 35\u201346, 1996.","journal-title":"Journal of Electronic Testing: Theory and Applications"},{"key":"195550_CR21","doi-asserted-by":"crossref","first-page":"229","DOI":"10.1007\/BF00133386","volume":"8","author":"J. Segura","year":"1996","unstructured":"J. Segura, C. de Benito, A. Rubio, and C.F. Hawkins, \u201cA Detailed Analysis and Electrical Modelling of Gate Oxide Shorts in MOS Transistors,\u201d Journal of Electronic Testing: Theory and Applications, Vol. 8, pp. 229\u2013239, 1996.","journal-title":"Journal of Electronic Testing: Theory and Applications"},{"key":"195550_CR22","unstructured":"K.R. Laker and W.M.C. Sansen, Design of Analog Integrated Circuits and Systems, McGraw-Hill International Editions, 1994."},{"key":"195550_CR23","doi-asserted-by":"crossref","unstructured":"J. Altet, X. Aragon\u00e9s, J. Gonzalez, D. Mateo, and A. Rubio, \u201cBiCMOS Differential Temperature Sensor: Characterization and Bist Applications,\u201d Proceedings of 24th European Solid State Circuits Conference, The Hague, Netherland, pp. 484\u2013487.","DOI":"10.1109\/ESSCIR.1998.186314"},{"key":"195550_CR24","unstructured":"W. Claeys, S. Dilhaire, and E. Schaub, \u201cLaser Probing Techniques and Methods for the Thermal Characterization of Microelectronic Components,\u201d Eurotherm 97, Nantes, France, Sept. 1997, pp. 232\u2013242. Invited paper."},{"issue":"3","key":"195550_CR25","doi-asserted-by":"crossref","first-page":"1157","DOI":"10.1063\/1.363985","volume":"81","author":"T. Phan","year":"1997","unstructured":"T. Phan, V. Quintard, D. Lewis, S. Dilhaire, and W. Claeys, \u201cThermomechanical Study of AlCu Based Interconnect under Pulsed Thermoelectric Excitation,\u201d J. Appl. Phys, Vol. 81, No. 3, pp. 1157\u20131168, Feb. 1997.","journal-title":"J. Appl. Phys"},{"key":"195550_CR26","doi-asserted-by":"crossref","first-page":"303","DOI":"10.1088\/0957-0233\/8\/3\/013","volume":"8","author":"T. Phan","year":"1997","unstructured":"T. Phan, S. Dilhaire, V. Quintard, D. Lewis, and W. Claeys, \u201cThe Method of Dynamic Separation and its Application to Quantitative Thermal Analysis of Microelectronic Devices by Laser Interferometry and Reflectomery,\u201d Measurement Science and Technology, Vol. 8, pp. 303\u2013316, 1997.","journal-title":"Measurement Science and Technology"},{"key":"195550_CR27","unstructured":"S. Dilhaire, E. Schaub, W. Claeys, J. Altet, and A. Rubio, \u201cMicrothermal Testing: Localisation of Heat Sources upon Integrated Circuits by Laser Probing,\u201d Eurotherm Seminar 57, Poitiers, 1998, in press."}],"container-title":["Journal of Electronic Testing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1023\/A:1008397205559.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/article\/10.1023\/A:1008397205559\/fulltext.html","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1023\/A:1008397205559.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T10:14:02Z","timestamp":1749204842000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1023\/A:1008397205559"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1999,2]]},"references-count":27,"journal-issue":{"issue":"1-2","published-print":{"date-parts":[[1999,2]]}},"alternative-id":["195550"],"URL":"https:\/\/doi.org\/10.1023\/a:1008397205559","relation":{},"ISSN":["0923-8174","1573-0727"],"issn-type":[{"type":"print","value":"0923-8174"},{"type":"electronic","value":"1573-0727"}],"subject":[],"published":{"date-parts":[[1999,2]]}}}