{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T02:19:11Z","timestamp":1777601951920,"version":"3.51.4"},"reference-count":6,"publisher":"Springer Science and Business Media LLC","issue":"7428","license":[{"start":{"date-parts":[[2012,12,1]],"date-time":"2012-12-01T00:00:00Z","timestamp":1354320000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Nature"],"published-print":{"date-parts":[[2012,12]]},"DOI":"10.1038\/492174a","type":"journal-article","created":{"date-parts":[[2012,12,10]],"date-time":"2012-12-10T10:22:39Z","timestamp":1355134959000},"page":"174-176","source":"Crossref","is-referenced-by-count":183,"title":["Computer engineering: Feeling the heat"],"prefix":"10.1038","volume":"492","author":[{"given":"Philip","family":"Ball","sequence":"first","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2012,12,12]]},"reference":[{"key":"BF492174a_CR1","doi-asserted-by":"publisher","first-page":"801","DOI":"10.1109\/TCAPT.2008.2001197","volume":"31","author":"SV Garimella","year":"2008","unstructured":"Garimella, S. V. et al. IEEE Trans. Components Packaging Technol. 31, 801\u2013815 (2008).","journal-title":"IEEE Trans. Components Packaging Technol."},{"key":"BF492174a_CR2","doi-asserted-by":"publisher","first-page":"568","DOI":"10.1109\/TDMR.2004.840855","volume":"4","author":"RC Chu","year":"2004","unstructured":"Chu, R. C., Simons, R. E., Ellsworth, M. J., Schmidt, R. R. & Cozzolino, V. IEEE Trans. Device Mater. Reliability 4, 568\u2013585 (2004).","journal-title":"IEEE Trans. Device Mater. Reliability"},{"key":"BF492174a_CR3","doi-asserted-by":"crossref","unstructured":"Ellsworth, M. J. et al. ITHERM 266\u2013274 (2008).","DOI":"10.1109\/ITHERM.2008.4544279"},{"key":"BF492174a_CR4","doi-asserted-by":"publisher","first-page":"5675","DOI":"10.1016\/j.ijhydene.2011.01.063","volume":"36","author":"SAM Shaegh","year":"2011","unstructured":"Shaegh, S. A. M., Nguyen, N.-T. & Chan, S. H. Int. J. Hydrogen Energ. 36, 5675\u20135694 (2011).","journal-title":"Int. J. Hydrogen Energ."},{"key":"BF492174a_CR5","unstructured":"Ruch, P. W., Rapp, T., Schmidt, T. J. & Michel, B. Studies of power density in microfluidic redox flow cells. Abstract presented at the 63rd Annual Meeting of the International Society of Electrochemistry (2012)."},{"key":"BF492174a_CR6","doi-asserted-by":"publisher","first-page":"593","DOI":"10.1147\/JRD.2011.2165677","volume":"55","author":"P Ruch","year":"2011","unstructured":"Ruch, P., Brunschwiler, T., Escher, W., Paredes, S. & Michel, B. IBM J. Res. & Dev. 55, 593\u2013605 (2011).","journal-title":"IBM J. Res. & Dev."}],"container-title":["Nature"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/www.nature.com\/articles\/492174a.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/www.nature.com\/articles\/492174a","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/www.nature.com\/articles\/492174a.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,23]],"date-time":"2025-04-23T13:13:19Z","timestamp":1745413999000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.nature.com\/articles\/492174a"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,12]]},"references-count":6,"journal-issue":{"issue":"7428","published-print":{"date-parts":[[2012,12]]}},"alternative-id":["BF492174a"],"URL":"https:\/\/doi.org\/10.1038\/492174a","relation":{},"ISSN":["0028-0836","1476-4687"],"issn-type":[{"value":"0028-0836","type":"print"},{"value":"1476-4687","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,12]]}}}