{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,21]],"date-time":"2026-09-21T02:25:09Z","timestamp":1789957509210,"version":"4.0.1"},"reference-count":25,"publisher":"Springer Science and Business Media LLC","issue":"1","license":[{"start":{"date-parts":[[2018,10,12]],"date-time":"2018-10-12T00:00:00Z","timestamp":1539302400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"},{"start":{"date-parts":[[2018,10,12]],"date-time":"2018-10-12T00:00:00Z","timestamp":1539302400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["Sci Rep"],"abstract":"<jats:title>Abstract<\/jats:title><jats:p>The continuous Ti-Cu compound layer produced in brazing of graphite to copper with Ti foil is found to be seriously detrimental to joint properties due to its brittleness. In this work, a transient liquid phase (TLP) bonding method with a diffusion process below melting point is developed to realize a Ti-Cu compound layer free joint. The degradation of Ti-Cu compound layer depends on two simultaneously occurring processes, namely flow of titanium atoms to copper substrate and that to TiC layer on graphite. The latter is determined by growth kinetics of TiC layer based on carbon diffusion process. A degradation model is proposed and applied to optimize the TLP bonding. The improved graphite\/copper joints without Ti-Cu compound layer show 20.8% higher in shear strength compared with that of brazing joints.<\/jats:p>","DOI":"10.1038\/s41598-018-33446-3","type":"journal-article","created":{"date-parts":[[2018,10,8]],"date-time":"2018-10-08T14:25:37Z","timestamp":1539008737000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":14,"title":["Degradation kinetics of Ti-Cu compound layer in transient liquid phase bonded graphite\/copper joints"],"prefix":"10.1038","volume":"8","author":[{"given":"Jincheng","family":"Lin","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mei","family":"Huang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weiqi","family":"Yang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lili","family":"Xing","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2018,10,12]]},"reference":[{"key":"33446_CR1","doi-asserted-by":"publisher","first-page":"409","DOI":"10.1016\/j.jmst.2017.03.001","volume":"34","author":"M Zhang","year":"2018","unstructured":"Zhang, M. et al. Influence of cryogenic thermal cycling treatment on the thermophysical properties of carbon\/carbon composites between room temperature and 1900\u2009\u00b0C. J. Mater. Sci. Technol. 34, 409\u2013415 (2018).","journal-title":"J. Mater. Sci. Technol."},{"key":"33446_CR2","doi-asserted-by":"publisher","first-page":"142","DOI":"10.1016\/j.jpowsour.2006.02.064","volume":"156","author":"M Wissler","year":"2006","unstructured":"Wissler, M. Graphite and carbon powders for electrochemical applications. J. Power Sources 156, 142\u2013150 (2006).","journal-title":"J. Power Sources"},{"key":"33446_CR3","doi-asserted-by":"publisher","first-page":"641","DOI":"10.1016\/S0008-6223(01)00195-6","volume":"40","author":"P Delhaes","year":"2002","unstructured":"Delhaes, P. Chemical vapor deposition and infiltration processes of carbon materials. Carbon 40, 641\u2013657 (2002).","journal-title":"Carbon"},{"key":"33446_CR4","doi-asserted-by":"publisher","first-page":"117","DOI":"10.1016\/j.jmst.2016.08.004","volume":"33","author":"S Tang","year":"2017","unstructured":"Tang, S. & Hu, C. Design, preparation and properties of carbon fiber reinforced ultra-high temperature ceramic composites for aerospace applications: A review. J. Mater. Sci. Technol. 33, 117\u2013130 (2017).","journal-title":"J. Mater. Sci. Technol."},{"key":"33446_CR5","doi-asserted-by":"publisher","first-page":"192","DOI":"10.1016\/j.jmst.2017.10.019","volume":"34","author":"L Wu","year":"2018","unstructured":"Wu, L., Nagatsuka, K. & Nakata, K. Direct joining of oxygen-free copper and carbon-fiber-reinforced plastic by friction lap joining. J. Mater. Sci. Technol. 34, 192\u2013197 (2018).","journal-title":"J. Mater. Sci. Technol."},{"key":"33446_CR6","doi-asserted-by":"publisher","first-page":"225","DOI":"10.1016\/S0920-3796(03)00218-7","volume":"66-68","author":"P Appendino","year":"2003","unstructured":"Appendino, P. et al. Joining of C\/C composites to copper. Fusion Eng. Des. 66-68, 225\u2013229 (2003).","journal-title":"Fusion Eng. Des."},{"key":"33446_CR7","doi-asserted-by":"publisher","first-page":"1199","DOI":"10.1016\/j.jallcom.2016.12.104","volume":"696","author":"X Song","year":"2017","unstructured":"Song, X. et al. A novel metallization process for soldering graphite to copper at low temperature. J. Alloy. Compd. 696, 1199\u20131204 (2017).","journal-title":"J. Alloy. Compd."},{"key":"33446_CR8","doi-asserted-by":"publisher","first-page":"26","DOI":"10.1016\/j.msea.2013.11.059","volume":"594","author":"J Zhang","year":"2014","unstructured":"Zhang, J., Wang, T. & Liu, C. Effect of brazing temperature on microstructure and mechanical properties of graphite\/copper joints. Mat. Sci. Eng. a-Struct. 594, 26\u201331 (2014).","journal-title":"Mat. Sci. Eng. a-Struct."},{"key":"33446_CR9","doi-asserted-by":"publisher","first-page":"499","DOI":"10.1016\/j.matchemphys.2010.07.001","volume":"124","author":"L Yang","year":"2010","unstructured":"Yang, L., Shen, P., Lin, Q., Qiu, F. & Jiang, Q. Wetting of porous graphite by Cu-Ti alloys at 1373 K. Mater. Chem. Phys. 124, 499\u2013503 (2010).","journal-title":"Mater. Chem. Phys."},{"key":"33446_CR10","doi-asserted-by":"publisher","first-page":"1671","DOI":"10.1007\/s10853-015-9415-0","volume":"51","author":"Y Mao","year":"2016","unstructured":"Mao, Y. et al. Brazing of graphite to Cu with Cu50TiH2+ C composite filler. J. Mater. Sci. 51, 1671\u20131679 (2016).","journal-title":"J. Mater. Sci."},{"key":"33446_CR11","doi-asserted-by":"publisher","first-page":"277","DOI":"10.1016\/j.fusengdes.2005.06.131","volume":"75-79","author":"M Bisio","year":"2005","unstructured":"Bisio, M. et al. Manufacturing and testing in reactor relevant conditions of brazed plasma facing components of the ITER divertor. Fusion Eng. Des. 75-79, 277\u2013283 (2005).","journal-title":"Fusion Eng. Des."},{"key":"33446_CR12","doi-asserted-by":"publisher","first-page":"287","DOI":"10.1016\/S1044-5803(99)00008-X","volume":"43","author":"P He","year":"1999","unstructured":"He, P., Zhang, J., Zhou, R. & Li, X. Diffusion bonding technology of a titanium alloy to a stainless steel web with an Ni interlayer. Mater. Charact. 43, 287\u2013292 (1999).","journal-title":"Mater. Charact."},{"key":"33446_CR13","doi-asserted-by":"publisher","first-page":"51","DOI":"10.1016\/j.matdes.2017.02.054","volume":"121","author":"S Guo","year":"2017","unstructured":"Guo, S. et al. Study on strengthening mechanism of Ti\/Cu electron beam welding. Mater. Design 121, 51\u201360 (2017).","journal-title":"Mater. Design"},{"key":"33446_CR14","doi-asserted-by":"publisher","first-page":"2416","DOI":"10.1016\/S1003-6326(11)61479-9","volume":"22","author":"G Chen","year":"2012","unstructured":"Chen, G., Zhang, B., Liu, W. & Feng, J. Influence of electron-beam superposition welding on intermetallic layer of Cu\/Ti joint. Trans. Nonferrous Met. Soc. China 22, 2416\u20132420 (2012).","journal-title":"Trans. Nonferrous Met. Soc. China"},{"key":"33446_CR15","doi-asserted-by":"publisher","first-page":"4799","DOI":"10.1002\/adma.200801550","volume":"20","author":"S Hong","year":"2008","unstructured":"Hong, S., Bartlow, C., Reynolds, T., McKeown, J. T. & Glaeser, A. M. Ultrarapid transient-liquid-phase bonding of Al2O3 ceramics. Adv. Mater. 20, 4799\u20134803 (2008).","journal-title":"Adv. Mater."},{"key":"33446_CR16","doi-asserted-by":"publisher","first-page":"5305","DOI":"10.1007\/s10853-011-5561-1","volume":"46","author":"GO Cook","year":"2011","unstructured":"Cook, G. O. & Sorensen, C. D. Overview of transient liquid phase and partial transient liquid phase bonding. J. Mater. Sci. 46, 5305\u20135323 (2011).","journal-title":"J. Mater. Sci."},{"key":"33446_CR17","doi-asserted-by":"publisher","first-page":"298","DOI":"10.1016\/j.jallcom.2006.11.024","volume":"452","author":"Y Liang","year":"2008","unstructured":"Liang, Y., Wang, H., Yang, Y., Wang, Y. & Jiang, Q. Evolution process of the synthesis of TiC in the Cu-Ti-C system. J. Alloy. Compd. 452, 298\u2013303 (2008).","journal-title":"J. Alloy. Compd."},{"key":"33446_CR18","doi-asserted-by":"publisher","first-page":"2662","DOI":"10.1016\/j.jmatprotec.2008.06.021","volume":"209","author":"Z Zhong","year":"2009","unstructured":"Zhong, Z., Zhou, Z. & Ge, C. Brazing of doped graphite to Cu using stress relief interlayers. J. Mater. Process. Tech. 209, 2662\u20132670 (2009).","journal-title":"J. Mater. Process. Tech."},{"key":"33446_CR19","doi-asserted-by":"publisher","first-page":"257","DOI":"10.1016\/j.scriptamat.2009.03.053","volume":"61","author":"R Asthana","year":"2009","unstructured":"Asthana, R. & Singh, M. Joining of ZrB2-based ultra-high-temperature ceramic composites using Pd-based braze alloys. Scr. Mater. 61, 257\u2013260 (2009).","journal-title":"Scr. Mater."},{"key":"33446_CR20","doi-asserted-by":"publisher","first-page":"2067","DOI":"10.1016\/j.jeurceramsoc.2016.02.033","volume":"36","author":"Q Qiu","year":"2016","unstructured":"Qiu, Q., Wang, Y., Yang, Z. & Wang, D. Microstructure and mechanical properties of Al2O3 ceramic and Ti6Al4V alloy joint brazed with inactive Ag-Cu and Ag-Cu+ B. J. Eur. Ceram. Soc. 36, 2067\u20132074 (2016).","journal-title":"J. Eur. Ceram. Soc."},{"key":"33446_CR21","doi-asserted-by":"publisher","first-page":"4533","DOI":"10.1023\/A:1004649624362","volume":"34","author":"AEW Jarfors","year":"1999","unstructured":"Jarfors, A. E. W. The influence of carbon on the phases in the copper-titanium system and their precipitation. J. Mater. Sci. 34, 4533\u20134544 (1999).","journal-title":"J. Mater. Sci."},{"key":"33446_CR22","doi-asserted-by":"publisher","first-page":"70","DOI":"10.1016\/j.commatsci.2016.06.015","volume":"123","author":"Y Zhu","year":"2016","unstructured":"Zhu, Y., Yan, M., Zhang, Y. & Zhang, C. First-principles investigation of structural, mechanical and electronic properties for Cu-Ti intermetallics. Comput. Mater. Sci. 123, 70\u201378 (2016).","journal-title":"Comput. Mater. Sci."},{"key":"33446_CR23","first-page":"997","volume":"8A","author":"Y Iljima","year":"1977","unstructured":"Iljima, Y., Ken-Ichi, H. & Hoshino, K. Diffusion of titanium in copper. Metall. Trans. A, Phys. Metall. Mater. Sci. 8A, 997\u20131001 (1977).","journal-title":"Metall. Trans. A, Phys. Metall. Mater. Sci."},{"key":"33446_CR24","doi-asserted-by":"publisher","first-page":"348","DOI":"10.1016\/j.actamat.2014.05.024","volume":"75","author":"A Miriyev","year":"2014","unstructured":"Miriyev, A., Sinder, M. & Frage, N. Thermal stability and growth kinetics of the interfacial TiC layer in the Ti alloy\/carbon steel system. Acta Mater. 75, 348\u2013355 (2014).","journal-title":"Acta Mater."},{"key":"33446_CR25","doi-asserted-by":"publisher","first-page":"4447","DOI":"10.1016\/j.jeurceramsoc.2012.07.005","volume":"32","author":"P He","year":"2012","unstructured":"He, P. et al. Diffusion bonding of ZrB2-SiC \/Nb with in situ synthesized TiB whiskers array. J. Eur. Ceram. Soc. 32, 4447\u20134454 (2012).","journal-title":"J. Eur. Ceram. Soc."}],"container-title":["Scientific Reports"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.nature.com\/articles\/s41598-018-33446-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/s41598-018-33446-3","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/s41598-018-33446-3.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,21]],"date-time":"2022-12-21T10:37:24Z","timestamp":1671619044000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.nature.com\/articles\/s41598-018-33446-3"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,10,12]]},"references-count":25,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2018,12]]}},"alternative-id":["33446"],"URL":"https:\/\/doi.org\/10.1038\/s41598-018-33446-3","relation":{},"ISSN":["2045-2322"],"issn-type":[{"value":"2045-2322","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,10,12]]},"assertion":[{"value":"16 April 2018","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"28 September 2018","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"12 October 2018","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"The authors declare no competing interests.","order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Competing Interests"}}],"article-number":"15190"}}