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Thermal properties, microstructure, wettability and mechanical properties were investigated. By decreasing the degree of undercooling, microstructure improved, the eutectic structure become finer and the size of \u03b2-Sn and intermetallic compounds decreased. By the addition of bismuth to SAC257 solder, the spreading ratio increased from 80.46% to 85.97, indicating an improvement in wettability. In order to investigate the joint properties, alloy solders were bonded to copper substrate, and the structure of the interface, tensile-shear strength and the fractured surfaces were studied. It was observed that the thickness of the intermetallic compounds of Cu<jats:sub>6<\/jats:sub>Sn<jats:sub>5<\/jats:sub> at the interface decreased with the addition of bismuth, and the lowest thickness of the interfacial IMCs was found in the SAC257-1Bi solder joint, which decreased about 14% compared to the base solder. Also, the Cu\/SAC257-1Bi\/Cu bond had the highest tensile-shear strength and elongation percentage among the alloy solders, which has a tensile-shear strength of about 30% and an elongation percentage of about 38% higher than the base solder joint.<\/jats:p>","DOI":"10.1038\/s41598-019-44758-3","type":"journal-article","created":{"date-parts":[[2019,6,10]],"date-time":"2019-06-10T10:03:00Z","timestamp":1560160980000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":100,"title":["The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints"],"prefix":"10.1038","volume":"9","author":[{"given":"Reza","family":"Sayyadi","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Homam","family":"Naffakh-Moosavy","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2019,6,10]]},"reference":[{"key":"44758_CR1","doi-asserted-by":"publisher","first-page":"559","DOI":"10.1016\/j.microrel.2011.10.006","volume":"52","author":"L Zhang","year":"2012","unstructured":"Zhang, L. et al. 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