{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T01:19:37Z","timestamp":1780449577736,"version":"3.54.1"},"reference-count":43,"publisher":"Springer Science and Business Media LLC","issue":"1","license":[{"start":{"date-parts":[[2022,12,5]],"date-time":"2022-12-05T00:00:00Z","timestamp":1670198400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"},{"start":{"date-parts":[[2022,12,5]],"date-time":"2022-12-05T00:00:00Z","timestamp":1670198400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"}],"funder":[{"DOI":"10.13039\/501100003662","name":"Korea Evaluation Institute of Industrial Technology","doi-asserted-by":"publisher","award":["the Next-Generation Intelligence Semiconductor R&D Program"],"award-info":[{"award-number":["the Next-Generation Intelligence Semiconductor R&D Program"]}],"id":[{"id":"10.13039\/501100003662","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003662","name":"Korea Evaluation Institute of Industrial Technology","doi-asserted-by":"publisher","award":["the Next-Generation Intelligence Semiconductor R&D Program"],"award-info":[{"award-number":["the Next-Generation Intelligence Semiconductor R&D Program"]}],"id":[{"id":"10.13039\/501100003662","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003662","name":"Korea Evaluation Institute of Industrial Technology","doi-asserted-by":"publisher","award":["the Next-Generation Intelligence Semiconductor R&D Program"],"award-info":[{"award-number":["the Next-Generation Intelligence Semiconductor R&D Program"]}],"id":[{"id":"10.13039\/501100003662","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003662","name":"Korea Evaluation Institute of Industrial Technology","doi-asserted-by":"publisher","award":["the Next-Generation Intelligence Semiconductor R&D Program"],"award-info":[{"award-number":["the Next-Generation Intelligence Semiconductor R&D Program"]}],"id":[{"id":"10.13039\/501100003662","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003662","name":"Korea Evaluation Institute of Industrial Technology","doi-asserted-by":"publisher","award":["the Next-Generation Intelligence Semiconductor R&D Program"],"award-info":[{"award-number":["the Next-Generation Intelligence Semiconductor R&D Program"]}],"id":[{"id":"10.13039\/501100003662","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003662","name":"Korea Evaluation Institute of Industrial Technology","doi-asserted-by":"publisher","award":["the Next-Generation Intelligence Semiconductor R&D Program"],"award-info":[{"award-number":["the Next-Generation Intelligence Semiconductor R&D Program"]}],"id":[{"id":"10.13039\/501100003662","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007053","name":"Korea Institute of Energy Technology Evaluation and Planning","doi-asserted-by":"publisher","award":["20202010100020"],"award-info":[{"award-number":["20202010100020"]}],"id":[{"id":"10.13039\/501100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007053","name":"Korea Institute of Energy Technology Evaluation and Planning","doi-asserted-by":"publisher","award":["20202010100020"],"award-info":[{"award-number":["20202010100020"]}],"id":[{"id":"10.13039\/501100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007053","name":"Korea Institute of Energy Technology Evaluation and Planning","doi-asserted-by":"publisher","award":["20202010100020"],"award-info":[{"award-number":["20202010100020"]}],"id":[{"id":"10.13039\/501100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007053","name":"Korea Institute of Energy Technology Evaluation and Planning","doi-asserted-by":"publisher","award":["20202010100020"],"award-info":[{"award-number":["20202010100020"]}],"id":[{"id":"10.13039\/501100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007053","name":"Korea Institute of Energy Technology Evaluation and Planning","doi-asserted-by":"publisher","award":["20202010100020"],"award-info":[{"award-number":["20202010100020"]}],"id":[{"id":"10.13039\/501100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100007053","name":"Korea Institute of Energy Technology Evaluation and Planning","doi-asserted-by":"publisher","award":["20202010100020"],"award-info":[{"award-number":["20202010100020"]}],"id":[{"id":"10.13039\/501100007053","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20009818, 20010420, 20019500, 20019473"],"award-info":[{"award-number":["20009818, 20010420, 20019500, 20019473"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20009818, 20010420, 20019500, 20019473"],"award-info":[{"award-number":["20009818, 20010420, 20019500, 20019473"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20009818, 20010420, 20019500, 20019473"],"award-info":[{"award-number":["20009818, 20010420, 20019500, 20019473"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20009818, 20010420, 20019500, 20019473"],"award-info":[{"award-number":["20009818, 20010420, 20019500, 20019473"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20009818, 20010420, 20019500, 20019473"],"award-info":[{"award-number":["20009818, 20010420, 20019500, 20019473"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003052","name":"Ministry of Trade, Industry and Energy","doi-asserted-by":"publisher","award":["20009818, 20010420, 20019500, 20019473"],"award-info":[{"award-number":["20009818, 20010420, 20019500, 20019473"]}],"id":[{"id":"10.13039\/501100003052","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0008458, HRD Program for Industrial Innovation"],"award-info":[{"award-number":["P0008458, HRD Program for Industrial Innovation"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0008458, HRD Program for Industrial Innovation"],"award-info":[{"award-number":["P0008458, HRD Program for Industrial Innovation"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0008458, HRD Program for Industrial Innovation"],"award-info":[{"award-number":["P0008458, HRD Program for Industrial Innovation"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0008458, HRD Program for Industrial Innovation"],"award-info":[{"award-number":["P0008458, HRD Program for Industrial Innovation"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0008458, HRD Program for Industrial Innovation"],"award-info":[{"award-number":["P0008458, HRD Program for Industrial Innovation"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology","doi-asserted-by":"publisher","award":["P0008458, HRD Program for Industrial Innovation"],"award-info":[{"award-number":["P0008458, HRD Program for Industrial Innovation"]}],"id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2020R1A6A1A03047771"],"award-info":[{"award-number":["NRF-2020R1A6A1A03047771"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2020R1A6A1A03047771"],"award-info":[{"award-number":["NRF-2020R1A6A1A03047771"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2020R1A6A1A03047771"],"award-info":[{"award-number":["NRF-2020R1A6A1A03047771"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2020R1A6A1A03047771"],"award-info":[{"award-number":["NRF-2020R1A6A1A03047771"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2020R1A6A1A03047771"],"award-info":[{"award-number":["NRF-2020R1A6A1A03047771"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2020R1A6A1A03047771"],"award-info":[{"award-number":["NRF-2020R1A6A1A03047771"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"KIMM Institutional Program","award":["NK236F"],"award-info":[{"award-number":["NK236F"]}]},{"name":"National Research Council of Science and Technology,South Korea","award":["CRF-20-01-NFRI"],"award-info":[{"award-number":["CRF-20-01-NFRI"]}]},{"name":"National Research Council of Science and Technology,South Korea","award":["CRF-20-01-NFRI"],"award-info":[{"award-number":["CRF-20-01-NFRI"]}]},{"name":"National Research Council of Science and Technology,South Korea","award":["CRF-20-01-NFRI"],"award-info":[{"award-number":["CRF-20-01-NFRI"]}]},{"name":"National Research Council of Science and Technology,South Korea","award":["CRF-20-01-NFRI"],"award-info":[{"award-number":["CRF-20-01-NFRI"]}]},{"name":"National Research Council of Science and Technology,South Korea","award":["CRF-20-01-NFRI"],"award-info":[{"award-number":["CRF-20-01-NFRI"]}]},{"name":"National Research Council of Science and Technology,South Korea","award":["CRF-20-01-NFRI"],"award-info":[{"award-number":["CRF-20-01-NFRI"]}]}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["Sci Rep"],"abstract":"<jats:title>Abstract<\/jats:title><jats:p>Arcing is a ubiquitous phenomenon and a crucial issue in high-voltage applied systems, especially low-temperature plasma (LTP) engineering. Although arcing in LTPs has attracted interest due to the severe damage it can cause, its underlying mechanism has yet to be fully understood. To elucidate the arcing mechanism, this study investigated various signals conventionally used to analyze arcing such as light emission, arcing current and voltage, and background plasma potential. As a result, we found that light emission occurs as early as 0.56\u00a0\u03bcs before arcing current initiation, which is a significant indicator of the explosive development of arcing as well as other signals. We introduce an arcing inducing probe (AIP) designed to localize arcing on the tip edge along with multiple snapshot analysis since arcing occurs randomly in space and time. Analysis reveals that the prior light emission consists of sheath and tip glows from the whole AIP sheath and the AIP tip edge, respectively. Formation mechanisms of these emissions based on multiple snapshot image analysis are discussed. This light emission before arcing current initiation provides a significant clue to understanding the arcing formation mechanism and represents a new indicator for forecasting arcing in LTPs.<\/jats:p>","DOI":"10.1038\/s41598-022-25550-2","type":"journal-article","created":{"date-parts":[[2022,12,5]],"date-time":"2022-12-05T11:02:37Z","timestamp":1670238157000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Observation of prior light emission before arcing development in a low-temperature plasma with multiple snapshot analysis"],"prefix":"10.1038","volume":"12","author":[{"given":"Si-jun","family":"Kim","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Young-seok","family":"Lee","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chul-hee","family":"Cho","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Min-su","family":"Choi","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"In-ho","family":"Seong","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jang-jae","family":"Lee","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dae-woong","family":"Kim","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shin-jae","family":"You","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2022,12,5]]},"reference":[{"key":"25550_CR1","doi-asserted-by":"publisher","first-page":"7814","DOI":"10.1038\/s41598-019-44191-6","volume":"9","author":"S Zhou","year":"2019","unstructured":"Zhou, S. et al. Direct observation of vacuum arc evolution with nanosecond resolution. Sci. Rep. 9, 7814. https:\/\/doi.org\/10.1038\/s41598-019-44191-6 (2019).","journal-title":"Sci. Rep."},{"key":"25550_CR2","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1038\/s41598-019-41961-0","volume":"9","author":"S Li","year":"2019","unstructured":"Li, S. et al. Synergic effect of adsorbed gas and charging on surface flashover. Sci. Rep. 9, 1\u20139. https:\/\/doi.org\/10.1038\/s41598-019-41961-0 (2019).","journal-title":"Sci. Rep."},{"key":"25550_CR3","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/ab642a","volume":"53","author":"S Zhou","year":"2020","unstructured":"Zhou, S. et al. Spectroscopic study of vacuum arc plasma expansion. J. Phys. D Appl. Phys. 53, 125501. https:\/\/doi.org\/10.1088\/1361-6463\/ab642a (2020).","journal-title":"J. Phys. D Appl. Phys."},{"key":"25550_CR4","doi-asserted-by":"publisher","first-page":"125022","DOI":"10.1088\/1361-6595\/aba989","volume":"29","author":"K Orr","year":"2020","unstructured":"Orr, K., Yang, X., Gulko, I. & Adamovich, I. V. Formation and propagation of ionization waves during ns pulse breakdown in plane-to-plane geometry. Plasma Sources Sci. Technol. 29, 125022\u2013125033. https:\/\/doi.org\/10.1088\/1361-6595\/aba989 (2020).","journal-title":"Plasma Sources Sci. Technol."},{"key":"25550_CR5","doi-asserted-by":"publisher","first-page":"57","DOI":"10.1007\/s41104-020-00059-w","volume":"5","author":"T Michler","year":"2020","unstructured":"Michler, T., Toedter, O. & Koch, T. Measurement of temporal and spatial resolved rotational temperature in ignition sparks at atmospheric pressure. Automot. Engine Technol. 5, 57\u201370. https:\/\/doi.org\/10.1007\/s41104-020-00059-w (2020).","journal-title":"Automot. Engine Technol."},{"key":"25550_CR6","doi-asserted-by":"publisher","unstructured":"Slade, P.\u00a0G. & Taylor, E.\u00a0D. Electrical breakdown in atmospheric air between closely spaced (0.2 $$\\mu$$m\u201340 $$\\mu$$m) electrical contacts. IEEE Trans. Compon. Packag. Technol.25, 390\u2013396, https:\/\/doi.org\/10.1109\/TCAPT.2002.804615 (2002).","DOI":"10.1109\/TCAPT.2002.804615"},{"key":"25550_CR7","doi-asserted-by":"publisher","first-page":"015308","DOI":"10.1088\/1361-6463\/abb38f","volume":"54","author":"C Li","year":"2021","unstructured":"Li, C. et al. Charge cluster triggers unpredictable insulation surface flashover in pressurized sf$$_{6}$$. J. Phys. D Appl. Phys. 54, 015308\u2013015313. https:\/\/doi.org\/10.1088\/1361-6463\/abb38f (2021).","journal-title":"J. Phys. D Appl. Phys."},{"key":"25550_CR8","doi-asserted-by":"publisher","first-page":"023101","DOI":"10.1103\/PhysRevAccelBeams.23.023101","volume":"23","author":"A Saressalo","year":"2020","unstructured":"Saressalo, A. et al. Classification of vacuum arc breakdowns in a pulsed dc system. Phys. Rev. Accel. Beams 23, 023101\u2013023111. https:\/\/doi.org\/10.1103\/PhysRevAccelBeams.23.023101 (2020).","journal-title":"Phys. Rev. Accel. Beams"},{"key":"25550_CR9","doi-asserted-by":"publisher","first-page":"350","DOI":"10.1109\/TSM.2013.2263295","volume":"26","author":"Y Kasashima","year":"2013","unstructured":"Kasashima, Y. et al. Detection of micro-arc discharge using esc wafer stage with built-in ae sensor. IEEE Trans. Semicond. Manuf. 26, 350\u2013354. https:\/\/doi.org\/10.1109\/TSM.2013.2263295 (2013).","journal-title":"IEEE Trans. Semicond. Manuf."},{"key":"25550_CR10","doi-asserted-by":"publisher","first-page":"581","DOI":"10.1149\/1.3096505","volume":"18","author":"E Yan","year":"2009","unstructured":"Yan, E. et al. Solving arcing issues in CVD processes. ECS Trans. 18, 581\u2013586. https:\/\/doi.org\/10.1149\/1.3096505 (2009).","journal-title":"ECS Trans."},{"key":"25550_CR11","doi-asserted-by":"publisher","first-page":"174102","DOI":"10.1109\/ASMC.2016.7491166","volume":"102","author":"Z Yang","year":"2016","unstructured":"Yang, Z. et al. Pattern dependent plasma charging effect in high aspect ratio 3D NAND architecture. IEEE ASDF 102, 174102\u2013174106. https:\/\/doi.org\/10.1109\/ASMC.2016.7491166 (2016).","journal-title":"IEEE ASDF"},{"key":"25550_CR12","doi-asserted-by":"publisher","first-page":"4199","DOI":"10.1016\/j.tsf.2011.04.103","volume":"520","author":"D Carter","year":"2012","unstructured":"Carter, D., Walde, H. & Nauman, K. Managing arcs in large area sputtering applications. Thin Solid Films 520, 4199\u20134202. https:\/\/doi.org\/10.1016\/j.tsf.2011.04.103 (2012).","journal-title":"Thin Solid Films"},{"key":"25550_CR13","doi-asserted-by":"publisher","first-page":"2361","DOI":"10.1038\/s41598-021-81947-5","volume":"11","author":"J Norem","year":"2021","unstructured":"Norem, J., Insepov, Z. & Hassanein, A. An integrated approach to understanding RF vacuum arcs. Sci. Rep. 11, 2361\u20132370. https:\/\/doi.org\/10.1038\/s41598-021-81947-5 (2021).","journal-title":"Sci. Rep."},{"key":"25550_CR14","doi-asserted-by":"publisher","first-page":"299","DOI":"10.1002\/ctpp.201400069","volume":"55","author":"H Timko","year":"2015","unstructured":"Timko, H. et al. From field emission to vacuum arc ignition: a new tool for simulating copper vacuum arcs. Contrib. Plasma Phys. 55, 299\u2013314. https:\/\/doi.org\/10.1002\/ctpp.201400069 (2015).","journal-title":"Contrib. Plasma Phys."},{"key":"25550_CR15","doi-asserted-by":"publisher","first-page":"060905","DOI":"10.1063\/5.0014485","volume":"128","author":"W Yang","year":"2020","unstructured":"Yang, W., Sun, Q. & Zhou, Q. Particle modeling of vacuum arc discharges. J. Appl. Phys. 128, 060905\u2013060924. https:\/\/doi.org\/10.1063\/5.0014485 (2020).","journal-title":"J. Appl. Phys."},{"key":"25550_CR16","doi-asserted-by":"publisher","first-page":"174102","DOI":"10.1063\/1.4803179","volume":"102","author":"A Semnani","year":"2013","unstructured":"Semnani, A., Venkattraman, A., Alexeenko, A. A. & Peroulis, D. Pre-breakdown evaluation of gas discharge mechanisms in microgaps. Appl. Phys. Lett. 102, 174102\u2013174106. https:\/\/doi.org\/10.1063\/1.4803179 (2013).","journal-title":"Appl. Phys. Lett."},{"key":"25550_CR17","doi-asserted-by":"publisher","first-page":"22","DOI":"10.1016\/j.tsf.2005.07.228","volume":"502","author":"A Anders","year":"2006","unstructured":"Anders, A. Physics of arcing, and implications to sputter deposition. Thin Solid Films 502, 22\u201328. https:\/\/doi.org\/10.1016\/j.tsf.2005.07.228 (2006).","journal-title":"Thin Solid Films"},{"key":"25550_CR18","doi-asserted-by":"publisher","first-page":"181501","DOI":"10.1063\/1.2126126","volume":"87","author":"DTK Kwok","year":"2005","unstructured":"Kwok, D. T. K., Yin, Y., Bilek, M. M. M. & McKenzie, D. Enhancement of microarcing at a grounded chamber wall by nonvanishing ion sheath in a radio-frequency capacitive discharged plasma. Appl. Phys. Lett. 87, 181501\u2013181503. https:\/\/doi.org\/10.1063\/1.2126126 (2005).","journal-title":"Appl. Phys. Lett."},{"key":"25550_CR19","doi-asserted-by":"publisher","first-page":"1652","DOI":"10.1109\/TPS.2011.2152863","volume":"39","author":"J Ling","year":"2011","unstructured":"Ling, J., Boswell, R. W., Lafleur, T. & Charles, C. Microarcing in a helicon plasma reactor. IEEE Trans. Plasma Sci. 39, 1652\u20131659. https:\/\/doi.org\/10.1109\/TPS.2011.2152863 (2011).","journal-title":"IEEE Trans. Plasma Sci."},{"key":"25550_CR20","doi-asserted-by":"publisher","first-page":"313","DOI":"10.1016\/j.cap.2014.12.021","volume":"15","author":"YH Kim","year":"2015","unstructured":"Kim, Y. H., Lee, H. S. & Chang, H. Y. Micro-arc ignition on the oily surface of capacitively-coupled plasma. Curr. Appl. Phys. 15, 313\u2013318. https:\/\/doi.org\/10.1016\/j.cap.2014.12.021 (2015).","journal-title":"Curr. Appl. Phys."},{"key":"25550_CR21","doi-asserted-by":"publisher","unstructured":"Norem, J. et\u00a0al. Dark current, breakdown, and magnetic field effects in a multicell, 805 mhz cavity. Phys. Rev. ST Accel. Beams6, 072001. https:\/\/doi.org\/10.1103\/PhysRevSTAB.6.072001 (2003).","DOI":"10.1103\/PhysRevSTAB.6.072001"},{"key":"25550_CR22","doi-asserted-by":"publisher","first-page":"2871","DOI":"10.1088\/0022-3727\/37\/20\/014","volume":"37","author":"Y Yin","year":"2004","unstructured":"Yin, Y., Bilek, M. M. M., McKenzie, D. R., Boswell, R. W. & Charles, C. Micro-arcing in radio frequency plasmas. J. Phys. D Appl. Phys. 37, 2871\u20132875. https:\/\/doi.org\/10.1088\/0022-3727\/37\/20\/014 (2004).","journal-title":"J. Phys. D Appl. Phys."},{"key":"25550_CR23","doi-asserted-by":"publisher","first-page":"191501","DOI":"10.1063\/1.2806186","volume":"91","author":"Y Yin","year":"2007","unstructured":"Yin, Y., Allan, S. Y., Bilek, M. M. M. & McKenzie, D. R. Time dependent plasma properties during microarcing in radio frequency plasmas. Appl. Phys. Lett. 91, 191501\u2013191503. https:\/\/doi.org\/10.1063\/1.2806186 (2007).","journal-title":"Appl. Phys. Lett."},{"key":"25550_CR24","doi-asserted-by":"publisher","first-page":"99","DOI":"10.1088\/0963-0252\/15\/1\/015","volume":"15","author":"Y Yin","year":"2006","unstructured":"Yin, Y., McKenzie, D. R. & Bilek, M. M. M. Analytic analysis on asymmetrical microarcing in high plasma potential RF plasma systems. Plasma Sources Sci. Technol. 15, 99\u2013104. https:\/\/doi.org\/10.1088\/0963-0252\/15\/1\/015 (2006).","journal-title":"Plasma Sources Sci. Technol."},{"key":"25550_CR25","doi-asserted-by":"crossref","unstructured":"Lieberman, M.\u00a0A. & Lichtenberg, A.\u00a0J. Principles of Plasma Discharges and Materials Processing, chap.\u00a06 (Wiley &Sons. Inc., 2005), 2nd edn.","DOI":"10.1002\/0471724254"},{"key":"25550_CR26","doi-asserted-by":"publisher","first-page":"6658","DOI":"10.1016\/j.tsf.2010.01.050","volume":"518","author":"S Pyun","year":"2010","unstructured":"Pyun, S. et al. On monitoring of gas leak in the plasma vacuum process with optical emission spectroscopy. Thin Solid Films 518, 6658\u20136662. https:\/\/doi.org\/10.1016\/j.tsf.2010.01.050 (2010).","journal-title":"Thin Solid Films"},{"key":"25550_CR27","doi-asserted-by":"publisher","unstructured":"Kasashima, Y. et\u00a0al. In-situ detection method for wafer movement and micro-arc discharge around a wafer in plasma etching process using electrostatic chuck wafer stage with built-in acoustic emission sensor. Jpn. J. Appl.Phys.53, 03DC04. https:\/\/doi.org\/10.7567\/JJAP.53.03DC04 (2014).","DOI":"10.7567\/JJAP.53.03DC04"},{"key":"25550_CR28","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6595\/ac1ee1","volume":"30","author":"K Oh","year":"2021","unstructured":"Oh, K., Kalanov, D. & Anders, A. High-resolution observation of cathode spots in a magnetically steered vacuum arc plasma source. Plasma Sources Sci. Technol. 30, 095005. https:\/\/doi.org\/10.1088\/1361-6595\/ac1ee1 (2021).","journal-title":"Plasma Sources Sci. Technol."},{"key":"25550_CR29","unstructured":"Tektronix. P5100a 500 mhz 100x high voltage probe instructions. Instruction manualhttps:\/\/www.tek.com\/ko\/high-voltage-probe-manual\/p5100a (2013)."},{"key":"25550_CR30","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevA.92.052701","volume":"92","author":"V Gedeon","year":"2015","unstructured":"Gedeon, V. et al.$$b$$-spline $$r$$-matrix-with-pseudostates calculations for electron collisions with aluminum. Phys. Rev. A 92, 052701. https:\/\/doi.org\/10.1103\/PhysRevA.92.052701 (2015).","journal-title":"Phys. Rev. A"},{"key":"25550_CR31","doi-asserted-by":"crossref","unstructured":"Lieberman, M.\u00a0A. & Lichtenberg, A.\u00a0J. Principles of Plasma Discharges and Materials Processing, chap.\u00a03 (Wiley &Sons. Inc., 2005), 2nd edn.","DOI":"10.1002\/0471724254"},{"key":"25550_CR32","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.120.124801","volume":"120","author":"EZ Engelberg","year":"2018","unstructured":"Engelberg, E. Z., Ashkenazy, Y. & Assaf, M. Stochastic model of breakdown nucleation under intense electric fields. Phys. Rev. Lett. 120, 124801. https:\/\/doi.org\/10.1103\/PhysRevLett.120.124801 (2018).","journal-title":"Phys. Rev. Lett."},{"key":"25550_CR33","doi-asserted-by":"publisher","unstructured":"Fowler, R.\u00a0H. & Nordheim, L. Electron emission in intense electric fields. Proc. R. Soc. Lond. Ser. A Contain. Pap. Math. Phys. Char.119, 173\u2013181. https:\/\/doi.org\/10.1098\/rspa.1928.0091 (1928).","DOI":"10.1098\/rspa.1928.0091"},{"key":"25550_CR34","doi-asserted-by":"publisher","unstructured":"Mitchell, E. W.\u00a0J. & Mitchell, J.\u00a0W. The work functions of copper, silver and aluminium. Proc. R. Soc. Lond. Ser. A. Math. Phys. Sci.210, 70\u201384. https:\/\/doi.org\/10.1098\/rspa.1951.0231 (1951).","DOI":"10.1098\/rspa.1951.0231"},{"key":"25550_CR35","doi-asserted-by":"publisher","first-page":"1135","DOI":"10.1088\/0022-3727\/30\/7\/011","volume":"30","author":"C Spataru","year":"1997","unstructured":"Spataru, C., Teillet-Billy, D., Gauyacq, J., Teste, P. & Chabrerie, J. Ion-assisted electron emission from a cathode in an electric arc. J. Phys. D Appl. Phys. 30, 1135. https:\/\/doi.org\/10.1088\/0022-3727\/30\/7\/011 (1997).","journal-title":"J. Phys. D Appl. Phys."},{"key":"25550_CR36","doi-asserted-by":"publisher","DOI":"10.1063\/5.0079589","volume":"131","author":"W-D Huang","year":"2022","unstructured":"Huang, W.-D. et al. Particle-in-cell simulation of vacuum arc breakdown process of tip-to-plate electrode configuration. J. Appl. Phys. 131, 103303. https:\/\/doi.org\/10.1063\/5.0079589 (2022).","journal-title":"J. Appl. Phys."},{"key":"25550_CR37","first-page":"211","volume":"10","author":"DR Lide","year":"1992","unstructured":"Lide, D. R. Ionization potentials of atoms and atomic ions. Handb. Chem. Phys. 10, 211 (1992).","journal-title":"Handb. Chem. Phys."},{"key":"25550_CR38","doi-asserted-by":"publisher","first-page":"110","DOI":"10.1103\/PhysRev.113.110","volume":"113","author":"RD Young","year":"1959","unstructured":"Young, R. D. Theoretical total-energy distribution of field-emitted electrons. Phys. Rev. 113, 110. https:\/\/doi.org\/10.1103\/PhysRev.113.110 (1959).","journal-title":"Phys. Rev."},{"key":"25550_CR39","doi-asserted-by":"publisher","DOI":"10.1063\/1.5048982","volume":"9","author":"W Yang","year":"2019","unstructured":"Yang, W., Meng, X., Zhou, Q. & Dong, Z. Boltzmann equation studies on electron swarm parameters in townsend breakdown of copper vapor plasma using independently assessed electron-collision cross sections. AIP Adv. 9, 035041. https:\/\/doi.org\/10.1063\/1.5048982 (2019).","journal-title":"AIP Adv."},{"key":"25550_CR40","doi-asserted-by":"publisher","DOI":"10.1088\/0953-4075\/45\/6\/065201","volume":"45","author":"S Loch","year":"2012","unstructured":"Loch, S., Ballance, C., Wu, D., Abdel-Naby, S. A. & Pindzola, M. Electron-impact ionization of al. J. Phys. B: At. Mol. Opt. Phys. 45, 065201. https:\/\/doi.org\/10.1088\/0953-4075\/45\/6\/065201 (2012).","journal-title":"J. Phys. B: At. Mol. Opt. Phys."},{"key":"25550_CR41","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevA.66.012707","volume":"66","author":"PL Bartlett","year":"2002","unstructured":"Bartlett, P. L. & Stelbovics, A. T. Calculation of total-ionization cross sections. Phys. Rev. A 66, 012707. https:\/\/doi.org\/10.1103\/PhysRevA.66.012707 (2002).","journal-title":"Phys. Rev. A"},{"key":"25550_CR42","doi-asserted-by":"publisher","unstructured":"Guo, J. et\u00a0al. Secondary electron emission characteristics of al2o3 coatings prepared by atomic layer deposition. AIP advances9, 095303-1\u2013095303-7, https:\/\/doi.org\/10.1063\/1.5113671 (2019).","DOI":"10.1063\/1.5113671"},{"key":"25550_CR43","doi-asserted-by":"publisher","first-page":"105008","DOI":"10.1088\/1361-6595\/ac2043","volume":"30","author":"J Jansky","year":"2021","unstructured":"Jansky, J., Bessieres, D., Brandenburg, R., Paillol, J. & Hoder, T. Electric field development in positive and negative streamers on dielectric surface. Plasma Sources Sci. Technol. 30, 105008\u2013105019. https:\/\/doi.org\/10.1088\/1361-6595\/ac2043 (2021).","journal-title":"Plasma Sources Sci. Technol."}],"container-title":["Scientific Reports"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.nature.com\/articles\/s41598-022-25550-2.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/s41598-022-25550-2","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/s41598-022-25550-2.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,8]],"date-time":"2022-12-08T18:04:08Z","timestamp":1670522648000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.nature.com\/articles\/s41598-022-25550-2"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12,5]]},"references-count":43,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2022,12]]}},"alternative-id":["25550"],"URL":"https:\/\/doi.org\/10.1038\/s41598-022-25550-2","relation":{},"ISSN":["2045-2322"],"issn-type":[{"value":"2045-2322","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,12,5]]},"assertion":[{"value":"15 September 2022","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"30 November 2022","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"5 December 2022","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"The authors declare no competing interests.","order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Competing interests"}}],"article-number":"20976"}}