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Ultrasonic vibration-assisted grinding has been shown to enhance grinding efficiency beyond conventional methods, but several of its atomic-level mechanisms remain incompletely understood. The interaction among the following was investigated in this study: mean abrasive grain spacing, grinding penetration depth, and abrasive grain physical properties. Atomic interactions and behaviors of the grinding process were modeled using molecular dynamics. An equilibration of 10\u00a0ns was first set up, during which extrinsic variables were manipulated to produce an equivalent environment, allowing the sample to evolve independently. This equilibration step was essential to achieve stabilization, since the potential and kinetic energies were\u2009\u2212\u20094.69\u00a0eV and 0.02\u00a0eV, respectively. It was observed that changing the grinding penetration depth from 10\u00a0\u00c5 to 16\u00a0\u00c5 significantly affected important atomic parameters: the number of detached atoms increased from 2231 to 2495, whereas the maximum stress rose from 10.26 to 12.27 GPa. This result was remarkable because it indicated strong stress localization and enhanced atomic bond breakage at deeper penetration depths, revealing the onset of severe atomic deformation. The highest force of the system increased from 606.67 to 725.05 GPa\u00b7nm\n                    <jats:sup>2<\/jats:sup>\n                    . Increasing the mean abrasive grain spacing between abrasive grains from 31 to 45\u00a0\u00c5 resulted in a lower number of dissociative atoms (2231\u2009\u2192\u20092154) and a shallower penetration depth (10.75\u2009\u2192\u200910.29\u00a0\u00c5). The maximum stress and, in turn, the force were found to decrease uniformly from 10.26 to 9.89 GPa and from 584.80 GPa\u00b7nm\n                    <jats:sup>2<\/jats:sup>\n                    to 560.80 GPa\u00b7nm\n                    <jats:sup>2<\/jats:sup>\n                    , respectively.\n                  <\/jats:p>","DOI":"10.1038\/s41598-026-61096-3","type":"journal-article","created":{"date-parts":[[2026,7,19]],"date-time":"2026-07-19T01:05:12Z","timestamp":1784423112000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Effects of grinding penetration depth and abrasive grain spacing on atomic interactions and material removal mechanisms in silicon during ultrasonic vibration-assisted grinding: a molecular dynamics study"],"prefix":"10.1038","volume":"16","author":[{"given":"Narinderjit Singh Sawaran","family":"Singh","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Waqed H.","family":"Hassan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Waleed","family":"Alaloosi","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Watfaa Khayri","family":"Younis","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Banaz Shahab","family":"Haji","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mahmut","family":"Taner","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Soheil","family":"Salahshour","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"S. 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