{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,10]],"date-time":"2026-10-10T13:31:12Z","timestamp":1791639072985,"version":"4.3.4"},"reference-count":30,"publisher":"Springer Science and Business Media LLC","issue":"1","license":[{"start":{"date-parts":[[2016,7,18]],"date-time":"2016-07-18T00:00:00Z","timestamp":1468800000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"},{"start":{"date-parts":[[2016,7,18]],"date-time":"2016-07-18T00:00:00Z","timestamp":1468800000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":["Sci Rep"],"abstract":"<jats:title>Abstract<\/jats:title><jats:p>Enabling unique architectures and functionalities of microsystems for numerous applications in electronics, photonics and other areas often requires microassembly of separately prepared heterogeneous materials instead of monolithic microfabrication. However, microassembly of dissimilar materials while ensuring high structural integrity has been challenging in the context of deterministic transferring and joining of materials at the microscale where surface adhesion is far more dominant than body weight. Here we present an approach to assembling microsystems with microscale building blocks of four disparate classes of device-grade materials including semiconductors, metals, dielectrics and polymers. This approach uniquely utilizes reversible adhesion-based transfer printing for material transferring and thermal processing for material joining at the microscale. The interfacial joining characteristics between materials assembled by this approach are systematically investigated upon different joining mechanisms using blister tests. The device level capabilities of this approach are further demonstrated through assembling and testing of a microtoroid resonator and a radio frequency (RF) microelectromechanical systems (MEMS) switch that involve optical and electrical functionalities with mechanical motion. This work opens up a unique route towards 3D heterogeneous material integration to fabricate microsystems.<\/jats:p>","DOI":"10.1038\/srep29925","type":"journal-article","created":{"date-parts":[[2016,7,18]],"date-time":"2016-07-18T09:17:47Z","timestamp":1468833467000},"update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":34,"title":["Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing"],"prefix":"10.1038","volume":"6","author":[{"given":"Hohyun","family":"Keum","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zining","family":"Yang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kewen","family":"Han","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Drew E.","family":"Handler","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Thong Nhu","family":"Nguyen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jose","family":"Schutt-Aine","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gaurav","family":"Bahl","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seok","family":"Kim","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2016,7,18]]},"reference":[{"key":"BFsrep29925_CR1","unstructured":"Moreau, W. M. Semiconductor lithography: principles, practices and materials (Springer Science & Business Media, 2012)."},{"key":"BFsrep29925_CR2","doi-asserted-by":"publisher","first-page":"1115","DOI":"10.1088\/0964-1726\/10\/6\/301","volume":"10","author":"J Judy","year":"2001","unstructured":"Judy, J. Microelectromechanical systems (MEMS): fabrication, design and applications. Smart Mater. Struct. 10, 1115\u20131134 (2001).","journal-title":"Smart Mater. Struct."},{"key":"BFsrep29925_CR3","doi-asserted-by":"publisher","first-page":"33","DOI":"10.1038\/nmat1532","volume":"5","author":"MA Meitl","year":"2006","unstructured":"Meitl, M. A. et al. Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp. Nat. Mater. 5, 33\u201338 (2006).","journal-title":"Nat. Mater."},{"key":"BFsrep29925_CR4","doi-asserted-by":"publisher","first-page":"17095","DOI":"10.1073\/pnas.1005828107","volume":"107","author":"S Kim","year":"2010","unstructured":"Kim S. et al. Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing. Proc. Natl. Acad. Sci. USA 107, 17095\u201317100 (2010).","journal-title":"Proc. Natl. Acad. Sci. USA"},{"key":"BFsrep29925_CR5","doi-asserted-by":"publisher","first-page":"055018","DOI":"10.1088\/0960-1317\/22\/5\/055018","volume":"22","author":"H Keum","year":"2012","unstructured":"Keum, H. et al. Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication. J. Micromech. Microeng. 22, 055018 (2012).","journal-title":"J. Micromech. Microeng."},{"key":"BFsrep29925_CR6","doi-asserted-by":"publisher","first-page":"13800","DOI":"10.1364\/OE.21.013800","volume":"21","author":"J-W Jeong","year":"2013","unstructured":"Jeong, J.-W. et al. Two-axis MEMS scanner with transfer-printed high-reflectivity, broadband monolithic silicon photonic crystal mirrors. Opt. Express 21, 13800\u201313809 (2013).","journal-title":"Opt. Express"},{"key":"BFsrep29925_CR7","doi-asserted-by":"publisher","first-page":"308","DOI":"10.1109\/JMEMS.2013.2273439","volume":"23","author":"Y Zhang","year":"2014","unstructured":"Zhang, Y., Keum, H., Park, K., Bashir, R. & Kim, S. Micro-masonry of MEMS sensors and actuators. J. Microelectromech. S . 23, 308\u2013314 (2014).","journal-title":"J. Microelectromech. S"},{"key":"BFsrep29925_CR8","doi-asserted-by":"publisher","first-page":"115012","DOI":"10.1088\/0960-1317\/24\/11\/115012","volume":"24","author":"A Bhaswara","year":"2014","unstructured":"Bhaswara, A. et al. Fabrication of nanoplate resonating structures via micro-masonry. J. Micromech. Microeng. 24, 115012 (2014).","journal-title":"J. Micromech. Microeng."},{"key":"BFsrep29925_CR9","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1016\/S0924-4247(02)00329-1","volume":"103","author":"AA Ay\u00f3n","year":"2003","unstructured":"Ay\u00f3n, A. A. et al. Characterization of silicon wafer bonding for power MEMS applications. Sensor. Actuat. A-Phys . 103, 1\u20138 (2003).","journal-title":"Sensor. Actuat. A-Phys"},{"key":"BFsrep29925_CR10","doi-asserted-by":"publisher","first-page":"341","DOI":"10.1149\/1.2085575","volume":"138","author":"WP Maszara","year":"1991","unstructured":"Maszara, W. P. Silicon\u2010On\u2010Insulator by Wafer Bonding: A Review. J. Electrochem. Soc. 138, 341\u2013347 (1991).","journal-title":"J. Electrochem. Soc."},{"key":"BFsrep29925_CR11","doi-asserted-by":"publisher","first-page":"680","DOI":"10.1016\/S0924-4247(97)01550-1","volume":"62","author":"RF Wolffenbuttel","year":"1997","unstructured":"Wolffenbuttel, R. F. Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond. Sensor. Actuat. A-Phys . 62, 680\u2013686 (1997).","journal-title":"Sensor. Actuat. A-Phys"},{"key":"BFsrep29925_CR12","doi-asserted-by":"crossref","unstructured":"Franssila, S. Introduction to microabrication 2nd editon . (Wiley, 2010).","DOI":"10.1002\/9781119990413"},{"key":"BFsrep29925_CR13","doi-asserted-by":"publisher","first-page":"303","DOI":"10.1080\/00218468808071269","volume":"25","author":"MG Allen","year":"1988","unstructured":"Allen, M. G. & Senturia, S. D. Analysis of critical debonding pressures of stressed thin films in the blister test. J. Adhesion 25, 303\u2013315 (1988).","journal-title":"J. Adhesion"},{"key":"BFsrep29925_CR14","doi-asserted-by":"publisher","first-page":"418","DOI":"10.1007\/s00542-005-0030-x","volume":"12","author":"A Doll","year":"2006","unstructured":"Doll, A., Rabold, M., Goldschmidtboing, F. & Woias, P. Versatile low temperature wafer bonding and bond strength measurement by a blister test method. Microsyst. Technol. 12, 418\u2013429 (2006).","journal-title":"Microsyst. Technol."},{"key":"BFsrep29925_CR15","doi-asserted-by":"publisher","first-page":"5","DOI":"10.1007\/s12213-008-0003-0","volume":"4","author":"Veikko Sariola","year":"2008","unstructured":"Sariola, Veikko et al. Hybrid microhandling: a unified view of robotic handling and self-assembly. J. Micro-Nano Mechatron . 4, 5\u201316 (2008).","journal-title":"J. Micro-Nano Mechatron"},{"key":"BFsrep29925_CR16","doi-asserted-by":"publisher","first-page":"4254","DOI":"10.1002\/adma.201501260","volume":"27","author":"Massimo Mastrangeli","year":"2015","unstructured":"Mastrangeli, Massimo. The Fluid Joint: The Soft Spot of Micro\u2010and Nanosystems. Adv. Mater. 27, 4254\u20134272 (2015).","journal-title":"Adv. Mater."},{"key":"BFsrep29925_CR17","doi-asserted-by":"publisher","first-page":"621","DOI":"10.1038\/415621a","volume":"415","author":"SM Spillane","year":"2002","unstructured":"Spillane, S. M., Kippenberg, T. J. & Vahala, K. J. Ultralow-threshold Raman laser using a spherical dielectric microcavity. Nature 415, 621\u2013623 (2002).","journal-title":"Nature"},{"key":"BFsrep29925_CR18","doi-asserted-by":"publisher","first-page":"1172","DOI":"10.1126\/science.1156032","volume":"321","author":"TJ Kippenberg","year":"2008","unstructured":"Kippenberg, T. J. & Vahala, K. J. Cavity optomechanics: back-action at the mesoscale. Science 321, 1172\u20131176 (2008).","journal-title":"Science"},{"key":"BFsrep29925_CR19","doi-asserted-by":"publisher","first-page":"061804","DOI":"10.1103\/PhysRevA.82.061804","volume":"82","author":"G Anetsberger","year":"2010","unstructured":"Anetsberger, G. et al. Measuring nanomechanical motion with an imprecision below the standard quantum limit. Phys. Rev. A 82, 061804 (2010).","journal-title":"Phys. Rev. A"},{"key":"BFsrep29925_CR20","doi-asserted-by":"publisher","first-page":"20701","DOI":"10.1073\/pnas.0808988106","volume":"105","author":"F Vollmer","year":"2008","unstructured":"Vollmer, F., Arnold, S. & Keng, D. Single virus detection from the reactive shift of a whispering-gallery mode. Proc. Natl. Acad. Sci. USA 105, 20701\u201320704 (2008).","journal-title":"Proc. Natl. Acad. Sci. USA"},{"key":"BFsrep29925_CR21","doi-asserted-by":"publisher","first-page":"925","DOI":"10.1038\/nature01371","volume":"421","author":"DK Armani","year":"2003","unstructured":"Armani, D. K., Kippenberg, T. J., Spillane, S. M. & Vahala, K. J. Ultra-high-Q toroid microcavity on a chip. Nature 421, 925\u2013928 (2003).","journal-title":"Nature"},{"key":"BFsrep29925_CR22","doi-asserted-by":"publisher","first-page":"1129","DOI":"10.1364\/OL.22.001129","volume":"22","author":"JC Knight","year":"1997","unstructured":"Knight, J. C., Cheung, G., Jacques, F. & Birks, T. A. Phase-matched excitation of whispering-gallery-mode resonances by a fiber taper. Opt. Lett. 22, 1129\u20131131 (1997).","journal-title":"Opt. Lett."},{"key":"BFsrep29925_CR23","doi-asserted-by":"publisher","first-page":"385","DOI":"10.1088\/0960-1317\/6\/4\/005","volume":"6","author":"N Tas","year":"1996","unstructured":"Tas, N., Sonnenberg, T., Jansen, H., Legtenberg, R. & Elwenspoek, M. Stiction in surface micromachining. J. Micromech. Microeng. 6, 385 (1996).","journal-title":"J. Micromech. Microeng."},{"key":"BFsrep29925_CR24","doi-asserted-by":"publisher","first-page":"108","DOI":"10.1016\/S0924-4247(99)00255-1","volume":"80","author":"KF Harsh","year":"2000","unstructured":"Harsh, K. F., Su, B., Zhang, W., Bright, V. M. & Lee, Y. C. The realization and design considerations of a flip-chip integrated MEMS tunable capacitor. Sensor. Actuat. A-Phys . 80, 108\u2013118 (2000).","journal-title":"Sensor. Actuat. A-Phys"},{"key":"BFsrep29925_CR25","doi-asserted-by":"publisher","first-page":"313","DOI":"10.1109\/75.862225","volume":"10","author":"V Milanovic","year":"2000","unstructured":"Milanovic, V., Maharbiz, M. & Pister, K. S. J. Batch transfer integration of RF microrelays. IEEE Microw. Guided Wave Lett. 10, 313\u2013315 (2000).","journal-title":"IEEE Microw. Guided Wave Lett."},{"key":"BFsrep29925_CR26","doi-asserted-by":"publisher","first-page":"218","DOI":"10.1038\/nnano.2010.4","volume":"5","author":"Y Lu","year":"2010","unstructured":"Lu, Y., Huang, J. Y., Wang, C., Sun, S. & Lou, J. Cold welding of ultrathin gold nanowires. Nat. Nanotechnol . 5, 218\u2013224 (2010).","journal-title":"Nat. Nanotechnol"},{"key":"BFsrep29925_CR27","doi-asserted-by":"publisher","first-page":"608","DOI":"10.1109\/6040.883749","volume":"23","author":"L Lin","year":"2000","unstructured":"Lin, L. MEMS post-packaging by localized heating and bonding. IEEE Trans. Adv. Packag. 23, 608\u2013616 (2000).","journal-title":"IEEE Trans. Adv. Packag."},{"key":"BFsrep29925_CR28","doi-asserted-by":"publisher","first-page":"G348","DOI":"10.1149\/1.1477209","volume":"149(6)","author":"T Suni","year":"2002","unstructured":"Suni, T., Henttinen, K., Suni, I. & Makinen, J. Effects of plasma activation on hydrophilic bonding of Si and SiO2 . J. Electrochem. Soc . 149(6), G348\u2013G351 (2002).","journal-title":"J. Electrochem. Soc"},{"key":"BFsrep29925_CR29","first-page":"6016","volume":"5(13)","author":"H Keum","year":"2013","unstructured":"Keum, H., Chung, H.-J. & Kim, S. Electrical contact at the interface between silicon and transfer-printed gold films by eutectic bonding. ACS Appl. Mater. Interfaces 5(13), 6016\u20136065 (2013).","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"BFsrep29925_CR30","doi-asserted-by":"publisher","first-page":"839","DOI":"10.1038\/nature01939","volume":"424","author":"KJ Vahala","year":"2003","unstructured":"Vahala, K. J. Optical Cavities. Nature 424, 839\u2013846 (2003).","journal-title":"Nature"}],"container-title":["Scientific Reports"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.nature.com\/articles\/srep29925","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/srep29925.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.nature.com\/articles\/srep29925.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,1,4]],"date-time":"2023-01-04T19:30:17Z","timestamp":1672860617000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.nature.com\/articles\/srep29925"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,7,18]]},"references-count":30,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2016,9,30]]}},"alternative-id":["BFsrep29925"],"URL":"https:\/\/doi.org\/10.1038\/srep29925","relation":{},"ISSN":["2045-2322"],"issn-type":[{"value":"2045-2322","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,7,18]]},"assertion":[{"value":"29 March 2016","order":1,"name":"received","label":"Received","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"24 June 2016","order":2,"name":"accepted","label":"Accepted","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"18 July 2016","order":3,"name":"first_online","label":"First Online","group":{"name":"ArticleHistory","label":"Article History"}},{"value":"The authors declare no competing financial interests.","order":1,"name":"Ethics","group":{"name":"EthicsHeading","label":"Competing interests"}}],"article-number":"29925"}}