{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,22]],"date-time":"2026-09-22T04:44:25Z","timestamp":1790052265199,"version":"4.0.1"},"reference-count":42,"publisher":"Royal Society of Chemistry (RSC)","issue":"29","license":[{"start":{"date-parts":[[2018,5,1]],"date-time":"2018-05-01T00:00:00Z","timestamp":1525132800000},"content-version":"vor","delay-in-days":120,"URL":"http:\/\/creativecommons.org\/licenses\/by-nc\/3.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["51706236"],"award-info":[{"award-number":["51706236"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]},{"DOI":"10.13039\/501100009592","name":"Beijing Municipal Science and Technology Commission","doi-asserted-by":"crossref","award":["Z171100000417004"],"award-info":[{"award-number":["Z171100000417004"]}],"id":[{"id":"10.13039\/501100009592","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":["rsc.org"],"crossmark-restriction":true},"short-container-title":["RSC Adv."],"abstract":"<p>Compared to liquid metal (LM) microdroplets based thermally conductive materials (micro-LM-THEMs), nano LM-THEMs (nLM-THEMs) presents a more stable electric insulating property even upon stress, achieving ~50-fold thermal conductivity over base polymer.<\/p>","DOI":"10.1039\/c8ra00262b","type":"journal-article","created":{"date-parts":[[2018,5,1]],"date-time":"2018-05-01T04:23:59Z","timestamp":1525148639000},"page":"16232-16242","update-policy":"https:\/\/doi.org\/10.1039\/rsc_crossmark_policy","source":"Crossref","is-referenced-by-count":83,"title":["Nano liquid metal for the preparation of a thermally conductive and electrically insulating material with high stability"],"prefix":"10.1039","volume":"8","author":[{"given":"P.","family":"Fan","sequence":"first","affiliation":[{"name":"Beijing Engineering Research Center of Sustainable Energy and Buildings"},{"name":"Beijing University of Civil Engineering and Architecture"},{"name":"Beijing"},{"name":"China"},{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Z.","family":"Sun","sequence":"additional","affiliation":[{"name":"Beijing Engineering Research Center of Sustainable Energy and Buildings"},{"name":"Beijing University of Civil Engineering and Architecture"},{"name":"Beijing"},{"name":"China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Y.","family":"Wang","sequence":"additional","affiliation":[{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"},{"name":"Technical Institute of Physics and Chemistry"},{"name":"Chinese Academy of Sciences"},{"name":"Beijing"},{"name":"P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"H.","family":"Chang","sequence":"additional","affiliation":[{"name":"Beijing Engineering Research Center of Sustainable Energy and Buildings"},{"name":"Beijing University of Civil Engineering and Architecture"},{"name":"Beijing"},{"name":"China"},{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"P.","family":"Zhang","sequence":"additional","affiliation":[{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"},{"name":"Technical Institute of Physics and Chemistry"},{"name":"Chinese Academy of Sciences"},{"name":"Beijing"},{"name":"P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"S.","family":"Yao","sequence":"additional","affiliation":[{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"},{"name":"Technical Institute of Physics and Chemistry"},{"name":"Chinese Academy of Sciences"},{"name":"Beijing"},{"name":"P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"C.","family":"Lu","sequence":"additional","affiliation":[{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"},{"name":"Technical Institute of Physics and Chemistry"},{"name":"Chinese Academy of Sciences"},{"name":"Beijing"},{"name":"P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4168-0298","authenticated-orcid":false,"given":"W.","family":"Rao","sequence":"additional","affiliation":[{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"},{"name":"Technical Institute of Physics and Chemistry"},{"name":"Chinese Academy of Sciences"},{"name":"Beijing"},{"name":"P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"J.","family":"Liu","sequence":"additional","affiliation":[{"name":"Beijing Key Lab of CryoBiomedical Engineering and Key Lab of Cryogenics"},{"name":"Technical Institute of Physics and Chemistry"},{"name":"Chinese Academy of Sciences"},{"name":"Beijing"},{"name":"P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"292","published-online":{"date-parts":[[2018]]},"reference":[{"key":"C8RA00262B-(cit1)\/*[position()=1]","first-page":"40","author":"Chuan","year":"2002","journal-title":"J. Mater. Eng."},{"key":"C8RA00262B-(cit2)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"527","DOI":"10.1109\/95.335037","volume":"17","author":"Bujard","year":"1994","journal-title":"IEEE Trans. Compon., Packag., Manuf. Technol., Part A"},{"key":"C8RA00262B-(cit3)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"708","DOI":"10.1109\/33.105121","volume":"14","author":"Procter","year":"1991","journal-title":"IEEE Trans. Compon., Hybrids, Manuf. Technol."},{"key":"C8RA00262B-(cit4)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"155","DOI":"10.1016\/0032-3861(78)90032-0","volume":"19","author":"Choy","year":"1978","journal-title":"Polymer"},{"key":"C8RA00262B-(cit5)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"157","DOI":"10.4028\/www.scientific.net\/AMR.427.157","volume":"427","author":"Wang","year":"2012","journal-title":"Adv. Mater. Res."},{"key":"C8RA00262B-(cit6)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"041015","DOI":"10.1115\/1.4003002","volume":"132","author":"Chou","year":"2010","journal-title":"J. Electron. Packag."},{"key":"C8RA00262B-(cit7)\/*[position()=1]","volume-title":"International Conference on Condition Monitoring and Diagnosis","author":"Wang","year":"2012","unstructured":"Q.Wang ,  Z.Li ,  J.Wu  and  Y.Yin ,  International Conference on Condition Monitoring and Diagnosis ,  2012 ,  pp. 1110\u20131113"},{"key":"C8RA00262B-(cit8)\/*[position()=1]","first-page":"51","volume-title":"ASME\/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference","volume":"vol. 3","author":"Tomimura","year":"2007","unstructured":"T.Tomimura ,  S.Nomura  and  M.Okuyama ,  ASME\/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference ,  2007 ,  vol. 3 ,  p. 51"},{"key":"C8RA00262B-(cit9)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"23","DOI":"10.1002\/pc.20296","volume":"28","author":"Zhou","year":"2007","journal-title":"Polym. Compos."},{"key":"C8RA00262B-(cit10)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"669","DOI":"10.1002\/app.35016","volume":"124","author":"Yu","year":"2012","journal-title":"J. Appl. Polym. Sci."},{"key":"C8RA00262B-(cit11)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"727","DOI":"10.1016\/j.compositesa.2005.07.006","volume":"37","author":"Lee","year":"2006","journal-title":"Composites, Part A"},{"key":"C8RA00262B-(cit12)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"1201","DOI":"10.1016\/j.compositesa.2010.05.002","volume":"41","author":"Peng","year":"2010","journal-title":"Composites, Part A"},{"key":"C8RA00262B-(cit13)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"265","DOI":"10.1016\/j.compositesb.2011.05.027","volume":"43","author":"Teng","year":"2012","journal-title":"Composites, Part B"},{"key":"C8RA00262B-(cit14)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"S569","DOI":"10.1016\/j.ceramint.2012.10.137","volume":"39","author":"Shin","year":"2013","journal-title":"Ceram. Int."},{"key":"C8RA00262B-(cit15)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"125","DOI":"10.1002\/pc.20276","volume":"28","author":"Mu","year":"2007","journal-title":"Polym. Compos."},{"key":"C8RA00262B-(cit16)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"257","DOI":"10.1016\/j.matdes.2013.03.076","volume":"51","author":"Li","year":"2013","journal-title":"Mater. Des."},{"key":"C8RA00262B-(cit17)\/*[position()=1]","first-page":"1994","volume":"3","author":"Wereszczak","year":"2013","journal-title":"IEEE T. Comp. Pack. Man."},{"key":"C8RA00262B-(cit18)\/*[position()=1]","first-page":"S388","volume":"19","author":"Xu","year":"2015","journal-title":"Mater. Res. Innovations"},{"key":"C8RA00262B-(cit19)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"114503","DOI":"10.1063\/1.3266173","volume":"106","author":"Xu","year":"2009","journal-title":"J. Appl. Phys."},{"key":"C8RA00262B-(cit20)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"6481","DOI":"10.1021\/am500009p","volume":"6","author":"Wang","year":"2014","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"C8RA00262B-(cit21)\/*[position()=1]","volume-title":"ASME\/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference","author":"Cola","year":"2007","unstructured":"B. A.Cola ,  X.Xu  and  T. S.Fisher ,  ASME\/JSME 2007 Thermal Engineering Heat Transfer Summer Conference collocated with the ASME 2007 InterPACK Conference ,  2007 ,  pp. 901\u2013903"},{"key":"C8RA00262B-(cit22)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"1629","DOI":"10.1016\/j.polymdegradstab.2005.09.014","volume":"91","author":"Luyt","year":"2006","journal-title":"Polym. Degrad. Stab."},{"key":"C8RA00262B-(cit23)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"5705","DOI":"10.1002\/app.1986.070320702","volume":"32","author":"Agari","year":"2010","journal-title":"J. Appl. Polym. Sci."},{"key":"C8RA00262B-(cit24)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"3797","DOI":"10.1016\/j.polymer.2009.05.038","volume":"50","author":"Kim","year":"2009","journal-title":"Polymer"},{"key":"C8RA00262B-(cit25)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"4434","DOI":"10.1016\/j.polymer.2006.04.008","volume":"47","author":"Sung","year":"2006","journal-title":"Polymer"},{"key":"C8RA00262B-(cit26)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"732","DOI":"10.1002\/pat.777","volume":"17","author":"Droval","year":"2006","journal-title":"Polym. Adv. Technol."},{"key":"C8RA00262B-(cit27)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"2029","DOI":"10.1002\/app.31443","volume":"116","author":"Wang","year":"2010","journal-title":"J. Appl. Polym. Sci."},{"key":"C8RA00262B-(cit28)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"801","DOI":"10.1016\/S0032-3861(96)00577-0","volume":"38","author":"Agari","year":"1997","journal-title":"Polymer"},{"key":"C8RA00262B-(cit29)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"881","DOI":"10.1023\/A:1020612123826","volume":"69","author":"Yan","year":"2002","journal-title":"J. Therm. Anal. Calorim."},{"key":"C8RA00262B-(cit30)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"21","DOI":"10.1002\/pat.1236","volume":"20","author":"Tu","year":"2009","journal-title":"Polym. Adv. Technol."},{"key":"C8RA00262B-(cit31)\/*[position()=1]","volume-title":"Heat Conduction","author":"jing","year":"1992","unstructured":"T. C.jing ,  Heat Conduction ,  Higher Education Press ,  1992"},{"key":"C8RA00262B-(cit32)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"701","DOI":"10.1007\/s00339-012-6887-5","volume":"107","author":"Gao","year":"2012","journal-title":"Appl. Phys. A: Mater. Sci. Process."},{"key":"C8RA00262B-(cit33)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"011009","DOI":"10.1115\/1.4026414","volume":"136","author":"Mei","year":"2014","journal-title":"J. Electron. Packag."},{"key":"C8RA00262B-(cit34)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"2143","DOI":"10.1073\/pnas.1616377114","volume":"114","author":"Bartlett","year":"2017","journal-title":"Proc. Natl. Acad. Sci. U. S. A."},{"key":"C8RA00262B-(cit35)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"2132","DOI":"10.1111\/j.1151-2916.2001.tb00973.x","volume":"84","author":"Suzuki","year":"2010","journal-title":"J. Am. Ceram. Soc."},{"key":"C8RA00262B-(cit36)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"2665","DOI":"10.1016\/S0017-9310(03)00016-4","volume":"46","author":"Wang","year":"2003","journal-title":"Int. J. Heat Mass Transfer"},{"key":"C8RA00262B-(cit37)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"907","DOI":"10.1007\/s00339-009-5098-1","volume":"95","author":"Deng","year":"2009","journal-title":"Appl. Phys. A: Mater. Sci. Process."},{"key":"C8RA00262B-(cit38)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"5104","DOI":"10.1021\/nl202728j","volume":"11","author":"Hohman","year":"2011","journal-title":"Nano Lett."},{"key":"C8RA00262B-(cit39)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"1928","DOI":"10.1002\/adma.201405256","volume":"27","author":"Fassler","year":"2015","journal-title":"Adv. Mater."},{"key":"C8RA00262B-(cit40)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"2355","DOI":"10.1002\/adma.201404790","volume":"27","author":"Boley","year":"2015","journal-title":"Adv. Mater."},{"key":"C8RA00262B-(cit41)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"6397","DOI":"10.1002\/smll.201502692","volume":"11","author":"Lin","year":"2015","journal-title":"Small"},{"key":"C8RA00262B-(cit42)\/*[position()=1]","doi-asserted-by":"crossref","first-page":"1305","DOI":"10.1122\/1.3236517","volume":"53","author":"Larsen","year":"2009","journal-title":"J. Rheol."}],"container-title":["RSC Advances"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/pubs.rsc.org\/en\/content\/articlepdf\/2018\/RA\/C8RA00262B","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T04:12:50Z","timestamp":1782879170000},"score":1,"resource":{"primary":{"URL":"https:\/\/pubs.rsc.org\/ra\/article\/8\/29\/16232-16242\/617057"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018]]},"references-count":42,"journal-issue":{"issue":"29","published-print":{"date-parts":[[2018]]}},"URL":"https:\/\/doi.org\/10.1039\/c8ra00262b","relation":{},"ISSN":["2046-2069"],"issn-type":[{"value":"2046-2069","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018]]},"assertion":[{"value":"This document is Similarity Check deposited","name":"similarity_check","explanation":{"URL":"https:\/\/www.crossref.org\/services\/similarity-check\/"},"group":{"name":"similarity_check","label":"SIMILARITY CHECK"}},{"value":"Supplementary Information","URL":"https:\/\/doi.org\/10.1039\/C8RA00262B","name":"related_data","group":{"name":"related_data","label":"RELATED DATA"}},{"value":"W. Rao (ORCID)","URL":"http:\/\/orcid.org\/0000-0002-4168-0298","name":"identifier","group":{"name":"author_identifiers","label":"IDENTIFIERS"}},{"value":"Single-blind","order":2,"name":"peer_review_method","group":{"name":"peer_review_method","label":"PEER REVIEW METHOD"}},{"value":"Received 10 January 2018; Accepted 9 April 2018;  Version of Record published 1 May 2018","order":1,"name":"history","group":{"name":"publication_history","label":"PUBLICATION HISTORY"}}]}}