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Phys."],"abstract":"<jats:p>\n                    A multimodal switchable terahertz metamaterial absorber is designed based on electromagnetic coupling between VO\n                    <jats:sub>2<\/jats:sub>\n                    and graphene to achieve dynamic switching between the coexistence state and the multi-peak absorption state.\n                  <\/jats:p>","DOI":"10.1039\/d6cp03169b","type":"journal-article","created":{"date-parts":[[2026,9,28]],"date-time":"2026-09-28T13:04:29Z","timestamp":1790600669000},"update-policy":"https:\/\/doi.org\/10.1039\/rsc_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["A multimodal switchable terahertz metamaterial absorber based on the coupling of VO\n                    <sub>2<\/sub>\n                    and graphene"],"prefix":"10.1039","author":[{"given":"Si-Rui","family":"Zhao","sequence":"first","affiliation":[{"name":"School of Automation and Information Engineering, Xi'an University of Technology, Xi'an 710048, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6041-9813","authenticated-orcid":false,"given":"Jun-Liang","family":"Yao","sequence":"additional","affiliation":[{"name":"School of Automation and Information Engineering, Xi'an University of Technology, Xi'an 710048, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shao-Kun","family":"Hu","sequence":"additional","affiliation":[{"name":"School of Automation and Information Engineering, Xi'an University of Technology, Xi'an 710048, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6639-153X","authenticated-orcid":false,"given":"Zhen","family":"Cui","sequence":"additional","affiliation":[{"name":"School of Automation and Information Engineering, Xi'an University of Technology, Xi'an 710048, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"292","published-online":{"date-parts":[[2026]]},"reference":[{"key":"D6CP03169B\/cit1\/1","doi-asserted-by":"crossref","first-page":"967","DOI":"10.1109\/COMST.2022.3143454","volume":"24","author":"Chaccour","year":"2022","journal-title":"IEEE Commun. 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