{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,3]],"date-time":"2026-08-03T16:44:24Z","timestamp":1785775464584,"version":"3.56.0"},"reference-count":89,"publisher":"Royal Society of Chemistry (RSC)","issue":"15","license":[{"start":{"date-parts":[[2027,6,11]],"date-time":"2027-06-11T00:00:00Z","timestamp":1812672000000},"content-version":"am","delay-in-days":526,"URL":"http:\/\/rsc.li\/journals-terms-of-use"}],"funder":[{"DOI":"10.13039\/100020595","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["NSTC 112-2622-E-002-035"],"award-info":[{"award-number":["NSTC 112-2622-E-002-035"]}],"id":[{"id":"10.13039\/100020595","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100020595","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["112-2221-E-002-202-MY2"],"award-info":[{"award-number":["112-2221-E-002-202-MY2"]}],"id":[{"id":"10.13039\/100020595","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100020595","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["114-2221-E-002-047"],"award-info":[{"award-number":["114-2221-E-002-047"]}],"id":[{"id":"10.13039\/100020595","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["rsc.org"],"crossmark-restriction":true},"short-container-title":["Mater. Horiz."],"abstract":"<jats:p>A hierarchical\u2013interfacial design enables ultralow-viscosity, low-CTE epoxy composites at extreme filler loadings, unlocking flowable, low-warpage encapsulation for advanced electronic packaging.<\/jats:p>","DOI":"10.1039\/d6mh00645k","type":"journal-article","created":{"date-parts":[[2026,6,11]],"date-time":"2026-06-11T12:01:56Z","timestamp":1781179316000},"page":"7642-7666","update-policy":"https:\/\/doi.org\/10.1039\/rsc_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Hierarchically packed liquid epoxy composites with ultralow CTE and viscosity for high-performance wafer-level packaging"],"prefix":"10.1039","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-9494-815X","authenticated-orcid":false,"given":"Cheng-Ti","family":"Hu","sequence":"first","affiliation":[{"name":"Department of Chemical Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Huai-Shu","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Materials Science and Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chiao-Yin","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chin-Yu","family":"Wu","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-3254-9757","authenticated-orcid":false,"given":"Po-Hsun","family":"Chiu","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chih-Chen","family":"Hsieh","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yi-Huan","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Molecular Science and Engineering, National Taipei University of Technology, Taipei, 106344, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chi-Yang","family":"Chao","sequence":"additional","affiliation":[{"name":"Department of Materials Science and Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2613-3373","authenticated-orcid":false,"given":"Chi-An","family":"Dai","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, National Taiwan University, Taipei, 10617, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"292","published-online":{"date-parts":[[2026]]},"reference":[{"key":"D6MH00645K\/cit1\/1","doi-asserted-by":"publisher","first-page":"163","DOI":"10.1016\/j.mattod.2014.04.003","volume":"17","author":"Moore","year":"2014","journal-title":"Mater. Today"},{"key":"D6MH00645K\/cit2\/1","doi-asserted-by":"publisher","first-page":"228","DOI":"10.1109\/TCPMT.2022.3144461","volume":"12","author":"Lau","year":"2022","journal-title":"IEEE Trans. Compon., Packag., Manuf. Technol."},{"key":"D6MH00645K\/cit3\/1","doi-asserted-by":"publisher","first-page":"2205120","DOI":"10.1002\/adma.202205120","volume":"34","author":"He","year":"2022","journal-title":"Adv. Mater."},{"key":"D6MH00645K\/cit4\/1","doi-asserted-by":"publisher","first-page":"2200734","DOI":"10.1002\/adma.202200734","volume":"34","author":"Liu","year":"2022","journal-title":"Adv. Mater."},{"key":"D6MH00645K\/cit5\/1","doi-asserted-by":"publisher","first-page":"204","DOI":"10.1016\/j.vlsi.2017.09.008","volume":"60","author":"Lancaster","year":"2018","journal-title":"Integration"},{"key":"D6MH00645K\/cit6\/1","doi-asserted-by":"publisher","first-page":"1068","DOI":"10.1109\/ECTC.2012.6248968","author":"Knickerbocker","year":"2012","unstructured":"J. U.Knickerbocker ,  P. S.Andry ,  E.Colgan ,  B.Dang ,  T.Dickson ,  X.Gu ,  C.Haymes ,  C.Jahnes ,  Y.Liu ,  J.Maria ,  R. J.Polastre ,  C. K.Tsang ,  L.Turlapati ,  B. C.Webb ,  L.Wiggins  and  S. L.Wright , IEEE 62nd Electronic Components and Technology Conference,  2012 ,  10681076 10.1109\/ECTC.2012.6248968"},{"key":"D6MH00645K\/cit7\/1","doi-asserted-by":"publisher","first-page":"637","DOI":"10.1109\/ISVLSI.2016.133","author":"Stow","year":"2016","unstructured":"D.Stow ,  I.Akgun ,  R.Barnes ,  P.Gu  and  Y.Xie , IEEE Computer Society Annual Symposium on VLSI (ISVLSI),  2016 ,  637642 10.1109\/ISVLSI.2016.133"},{"key":"D6MH00645K\/cit8\/1","doi-asserted-by":"publisher","first-page":"13855","DOI":"10.1007\/s10854-019-01790-3","volume":"30","author":"Zhang","year":"2019","journal-title":"J. Mater. Sci.: Mater. Electron."},{"key":"D6MH00645K\/cit9\/1","doi-asserted-by":"publisher","first-page":"183","DOI":"10.1186\/1556-276X-7-183","volume":"7","author":"Tan","year":"2012","journal-title":"Nanoscale Res. Lett."},{"key":"D6MH00645K\/cit10\/1","doi-asserted-by":"publisher","first-page":"4734","DOI":"10.1002\/app.25000","volume":"102","author":"Hsieh","year":"2006","journal-title":"J. Appl. Polym. Sci."},{"key":"D6MH00645K\/cit11\/1","doi-asserted-by":"publisher","first-page":"682","DOI":"10.1109\/ECTC.2018.00108","author":"Hong","year":"2018","unstructured":"J.Hong ,  K.Choi ,  D.Oh ,  S. B.Park ,  S.Shao ,  H.Wang ,  Y.Niu  and  V. L.Pham , IEEE 68th Electronic Components and Technology Conference (ECTC),  2018 ,  682692 10.1109\/ECTC.2018.00108"},{"key":"D6MH00645K\/cit12\/1","doi-asserted-by":"publisher","first-page":"537","DOI":"10.1080\/01495739.2013.784119","volume":"36","author":"Suhir","year":"2013","journal-title":"J. Therm. Stress."},{"key":"D6MH00645K\/cit13\/1","doi-asserted-by":"publisher","first-page":"1","DOI":"10.23919\/IWLPC.2018.8573294","author":"Kim","year":"2018","unstructured":"J.Kim ,  J.Kim ,  K. H.Kwon ,  Y. S.Yong ,  J. H.Kim ,  D. H.Lee ,  S. K.Kim  and  D.Park , International Wafer Level Packaging Conference (IWLPC),  2018 ,  15 10.23919\/IWLPC.2018.8573294"},{"key":"D6MH00645K\/cit14\/1","doi-asserted-by":"publisher","first-page":"113265","DOI":"10.1016\/j.matdes.2024.113265","volume":"245","author":"Um","year":"2024","journal-title":"Mater. Des."},{"key":"D6MH00645K\/cit15\/1","doi-asserted-by":"publisher","first-page":"1672","DOI":"10.1016\/j.microrel.2005.07.075","author":"Braun","year":"2005","journal-title":"Microelectron. Reliab."},{"key":"D6MH00645K\/cit16\/1","doi-asserted-by":"publisher","first-page":"1967","DOI":"10.1177\/0021998310393297","volume":"45","author":"Wattanakul","year":"2011","journal-title":"J. Compos. Mater."},{"key":"D6MH00645K\/cit17\/1","doi-asserted-by":"publisher","first-page":"261","DOI":"10.1002\/9781119313991.ch13","volume-title":"Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies","author":"Kan","year":"2019","unstructured":"K.Kan ,  M.Sugahara  and  M.Cichon ,  Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies ,  2019 ,  pp. 261\u2013270 10.1002\/9781119313991.ch13"},{"key":"D6MH00645K\/cit18\/1","doi-asserted-by":"publisher","first-page":"2162","DOI":"10.1109\/ECTC.2019.00-23","author":"Ueno","year":"2019","unstructured":"K.Ueno ,  K.Dohi ,  Y.Suzuki  and  M.Hirose , IEEE 69th Electronic Components and Technology Conference (ECTC),  2019 ,  21622167 10.1109\/ECTC.2019.00-23"},{"key":"D6MH00645K\/cit19\/1","doi-asserted-by":"publisher","first-page":"1077","DOI":"10.1109\/ECTC.2015.7159728","author":"Braun","year":"2015","unstructured":"T.Braun ,  S.Raatz ,  S.Voges ,  R.Kahle ,  V.Bader ,  J.Bauer ,  K. F.Becker ,  T.Thomas ,  R.Aschenbrenner  and  K. D.Lang , IEEE 65th Electronic Components and Technology Conference (ECTC),  2015 ,  10771083 10.1109\/ECTC.2015.7159728"},{"key":"D6MH00645K\/cit20\/1","doi-asserted-by":"publisher","first-page":"12034","DOI":"10.1021\/acs.chemmater.4c02920","volume":"36","author":"Jiang","year":"2024","journal-title":"Chem. Mater."},{"key":"D6MH00645K\/cit21\/1","doi-asserted-by":"publisher","first-page":"7263","DOI":"10.1039\/D3RA08390J","volume":"14","author":"Han","year":"2024","journal-title":"RSC Adv."},{"key":"D6MH00645K\/cit22\/1","doi-asserted-by":"publisher","first-page":"2013","DOI":"10.1109\/ECTC32862.2020.00313","author":"Kim","year":"2020","unstructured":"J.Kim ,  W. C.Na ,  J.Kim ,  S.Im ,  D. H.Lee ,  S.Lim  and  S. K.Kim , IEEE 70th Electronic Components and Technology Conference (ECTC),  2020 ,  20132018 10.1109\/ECTC32862.2020.00313"},{"key":"D6MH00645K\/cit23\/1","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/ICEPT52650.2021.9568026","author":"Deng","year":"2021","unstructured":"Y. K.Deng ,  B. X.Yang ,  W. L.Hu  and  X. P.Zhang , 22nd International Conference on Electronic Packaging Technology (ICEPT),  2021 ,  15 10.1109\/ICEPT52650.2021.9568026"},{"key":"D6MH00645K\/cit24\/1","doi-asserted-by":"publisher","first-page":"479","DOI":"10.1016\/0955-2219(95)00001-B","volume":"15","author":"Zheng","year":"1995","journal-title":"J. Eur. Ceram. Soc."},{"key":"D6MH00645K\/cit25\/1","doi-asserted-by":"publisher","first-page":"2012","DOI":"10.1016\/j.compositesb.2012.02.004","volume":"43","author":"Mizuuchi","year":"2012","journal-title":"Composites, Part B"},{"key":"D6MH00645K\/cit26\/1","doi-asserted-by":"publisher","first-page":"360","DOI":"10.1016\/j.conbuildmat.2018.07.215","volume":"187","author":"Ozeren Ozgul","year":"2018","journal-title":"Constr. Build. Mater."},{"key":"D6MH00645K\/cit27\/1","doi-asserted-by":"publisher","first-page":"E1959","DOI":"10.1002\/pc.24789","volume":"39","author":"Jayan","year":"2018","journal-title":"Polym. Compos."},{"key":"D6MH00645K\/cit28\/1","doi-asserted-by":"publisher","first-page":"267","DOI":"10.1016\/S0014-3057(00)00115-4","volume":"37","author":"Ho","year":"2001","journal-title":"Eur. Polym. J."},{"key":"D6MH00645K\/cit29\/1","doi-asserted-by":"publisher","first-page":"114933","DOI":"10.1016\/j.microrel.2023.114933","volume":"143","author":"Ishikawa","year":"2023","journal-title":"Microelectron. Reliab."},{"key":"D6MH00645K\/cit30\/1","doi-asserted-by":"publisher","first-page":"67","DOI":"10.1016\/j.compositesa.2018.12.019","volume":"118","author":"Chen","year":"2019","journal-title":"Composites, Part A"},{"key":"D6MH00645K\/cit31\/1","doi-asserted-by":"publisher","first-page":"64","DOI":"10.4028\/www.scientific.net\/MSF.848.64","volume":"848","author":"Wang","year":"2016","journal-title":"Mater. Sci. Forum"},{"key":"D6MH00645K\/cit32\/1","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/ICEPT59018.2023.10492101","author":"Wei","year":"2023","unstructured":"C.Wei ,  M.Liu ,  X.Liu ,  Y.Luo ,  P.Zhu  and  W.Ai , 24th International Conference on Electronic Packaging Technology (ICEPT),  2023 ,  14 10.1109\/ICEPT59018.2023.10492101"},{"key":"D6MH00645K\/cit33\/1","doi-asserted-by":"publisher","first-page":"108757","DOI":"10.1016\/j.compositesa.2025.108757","volume":"192","author":"Chao","year":"2025","journal-title":"Composites, Part A"},{"key":"D6MH00645K\/cit34\/1","doi-asserted-by":"publisher","first-page":"351","DOI":"10.1016\/j.polymer.2015.06.038","volume":"70","author":"Masoumi","year":"2015","journal-title":"Polymer"},{"key":"D6MH00645K\/cit35\/1","doi-asserted-by":"publisher","first-page":"97","DOI":"10.1016\/j.dental.2019.10.012","volume":"36","author":"Bouss\u00e8s","year":"2020","journal-title":"Dent. Mater."},{"key":"D6MH00645K\/cit36\/1","doi-asserted-by":"publisher","first-page":"3376","DOI":"10.3390\/ma14123376","volume":"14","author":"Derban","year":"2021","journal-title":"Materials"},{"key":"D6MH00645K\/cit37\/1","doi-asserted-by":"publisher","first-page":"233","DOI":"10.1364\/josa.11.000233","volume":"11","author":"Timoshenko","year":"1925","journal-title":"J. Opt. Soc. Am."},{"key":"D6MH00645K\/cit38\/1","doi-asserted-by":"publisher","first-page":"109744","DOI":"10.1016\/j.ijmecsci.2024.109744","volume":"284","author":"Lee","year":"2024","journal-title":"Int. J. Mech. Sci."},{"key":"D6MH00645K\/cit39\/1","doi-asserted-by":"publisher","first-page":"3482","DOI":"10.3390\/ma16093482","volume":"16","author":"Chuang","year":"2023","journal-title":"Materials"},{"key":"D6MH00645K\/cit40\/1","doi-asserted-by":"publisher","first-page":"1962","DOI":"10.3390\/app9091962","volume":"9","author":"Luo","year":"2019","journal-title":"Appl. Sci."},{"key":"D6MH00645K\/cit41\/1","doi-asserted-by":"publisher","first-page":"6224","DOI":"10.1007\/s10854-019-00925-w","volume":"30","author":"Jiang","year":"2019","journal-title":"J. Mater. Sci.: Mater. Electron."},{"key":"D6MH00645K\/cit42\/1","doi-asserted-by":"publisher","first-page":"000025","DOI":"10.4071\/isom-2017-TP14_157","volume":"2017","author":"Kamimura","year":"2017","journal-title":"Int. Symp. Microelectron."},{"key":"D6MH00645K\/cit43\/1","doi-asserted-by":"publisher","first-page":"012088","DOI":"10.1088\/1742-6596\/901\/1\/012088","volume":"901","author":"Peanpunga","year":"2017","journal-title":"J. Phys.: Conf. Ser."},{"key":"D6MH00645K\/cit44\/1","doi-asserted-by":"publisher","first-page":"105","DOI":"10.1007\/s13367-011-0013-7","volume":"23","author":"Qi","year":"2011","journal-title":"Korea-Aust. Rheol. J."},{"key":"D6MH00645K\/cit45\/1","doi-asserted-by":"publisher","first-page":"37","DOI":"10.1002\/app.1993.070480105","volume":"48","author":"Sudduth","year":"1993","journal-title":"J. Appl. Polym. Sci."},{"key":"D6MH00645K\/cit46\/1","doi-asserted-by":"publisher","first-page":"513","DOI":"10.1111\/j.1151-2916.1961.tb13716.x","volume":"44","author":"McGeary","year":"1961","journal-title":"J. Am. Ceram. Soc."},{"key":"D6MH00645K\/cit47\/1","doi-asserted-by":"publisher","first-page":"000051","DOI":"10.4071\/2380-4505-2020.1.000051","volume":"2020","author":"Iwai","year":"2021","journal-title":"Int. Symp. Microelectron."},{"key":"D6MH00645K\/cit48\/1","doi-asserted-by":"publisher","first-page":"342","DOI":"10.3390\/mi10050342","volume":"10","author":"Braun","year":"2019","journal-title":"Micromachines"},{"key":"D6MH00645K\/cit49\/1","doi-asserted-by":"publisher","first-page":"98","DOI":"10.3390\/electronics10020098","volume":"10","author":"Chao","year":"2021","journal-title":"Electronics"},{"key":"D6MH00645K\/cit50\/1","doi-asserted-by":"publisher","first-page":"3148","DOI":"10.1021\/acsapm.0c00349","volume":"2","author":"Mahtabani","year":"2020","journal-title":"ACS Appl. Polym. Mater."},{"key":"D6MH00645K\/cit51\/1","doi-asserted-by":"publisher","first-page":"1767","DOI":"10.1007\/s00396-018-4399-3","volume":"296","author":"Yu","year":"2018","journal-title":"Colloid Polym. Sci."},{"key":"D6MH00645K\/cit52\/1","doi-asserted-by":"publisher","first-page":"1","DOI":"10.3390\/polym10010001","volume":"10","author":"Zheng","year":"2018","journal-title":"Polymers"},{"key":"D6MH00645K\/cit53\/1","doi-asserted-by":"publisher","first-page":"52","DOI":"10.1016\/j.compositesa.2014.03.007","volume":"62","author":"Li","year":"2014","journal-title":"Composites, Part A"},{"key":"D6MH00645K\/cit54\/1","doi-asserted-by":"publisher","first-page":"2394","DOI":"10.3390\/polym14122394","volume":"14","author":"Liu","year":"2022","journal-title":"Polymers"},{"key":"D6MH00645K\/cit55\/1","doi-asserted-by":"publisher","first-page":"1395","DOI":"10.1002\/app.21896","volume":"97","author":"Morita","year":"2005","journal-title":"J. Appl. Polym. Sci."},{"key":"D6MH00645K\/cit56\/1","doi-asserted-by":"publisher","first-page":"18345","DOI":"10.1007\/s10853-021-06329-8","volume":"56","author":"Mousavi","year":"2021","journal-title":"J. Mater. Sci."},{"key":"D6MH00645K\/cit57\/1","doi-asserted-by":"publisher","first-page":"327","DOI":"10.1007\/s10853-010-4816-6","volume":"46","author":"Giannakopoulos","year":"2011","journal-title":"J. Mater. Sci."},{"key":"D6MH00645K\/cit58\/1","doi-asserted-by":"publisher","first-page":"703","DOI":"10.1122\/1.549987","volume":"32","author":"Poslinski","year":"1988","journal-title":"J. Rheol."},{"key":"D6MH00645K\/cit59\/1","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1016\/j.cis.2011.12.005","volume":"171\u2013172","author":"Genovese","year":"2012","journal-title":"Adv. Colloid Interface Sci."},{"key":"D6MH00645K\/cit60\/1","doi-asserted-by":"publisher","first-page":"855","DOI":"10.1109\/ECTC51529.2024.00137","author":"Sugiura","year":"2024","unstructured":"Y.Sugiura ,  D.Mori ,  Y.Fujii ,  K.Imamura ,  I.Yamai ,  T.Yagihashi  and  E.Nomura , IEEE 74th Electronic Components and Technology Conference (ECTC),  2024 ,  855859 10.1109\/ECTC51529.2024.00137"},{"key":"D6MH00645K\/cit61\/1","doi-asserted-by":"publisher","first-page":"557","DOI":"10.1109\/ICEP.2016.7486889","author":"Kan","year":"2016","unstructured":"K.Kan ,  Y.Oi ,  Y.Fujii ,  M.Miwa  and  M.Sugahara , International Conference on Electronics Packaging (ICEP),  2016 ,  557561 10.1109\/ICEP.2016.7486889"},{"key":"D6MH00645K\/cit62\/1","doi-asserted-by":"publisher","first-page":"102887","DOI":"10.1016\/j.cis.2023.102887","volume":"315","author":"Rosenholm","year":"2023","journal-title":"Adv. Colloid Interface Sci."},{"key":"D6MH00645K\/cit63\/1","doi-asserted-by":"publisher","first-page":"550","DOI":"10.3390\/w11030550","volume":"11","author":"Bui","year":"2019","journal-title":"Water"},{"key":"D6MH00645K\/cit64\/1","doi-asserted-by":"publisher","first-page":"908","DOI":"10.1038\/188908a0","volume":"188","author":"Scott","year":"1960","journal-title":"Nature"},{"key":"D6MH00645K\/cit65\/1","doi-asserted-by":"publisher","first-page":"767","DOI":"10.1111\/j.1151-2916.1930.tb16222.x","volume":"13","author":"Westman","year":"1930","journal-title":"J. Am. Ceram. Soc."},{"key":"D6MH00645K\/cit66\/1","doi-asserted-by":"publisher","first-page":"2313","DOI":"10.1002\/(SICI)1097-4628(19981219)70:12<2313::AID-APP2>3.0.CO;2-P","volume":"70","author":"Lin","year":"1998","journal-title":"J. Appl. Polym. Sci."},{"key":"D6MH00645K\/cit67\/1","doi-asserted-by":"publisher","first-page":"16","DOI":"10.1016\/j.polymer.2015.04.002","volume":"66","author":"Quan","year":"2015","journal-title":"Polymer"},{"key":"D6MH00645K\/cit68\/1","doi-asserted-by":"publisher","first-page":"39","DOI":"10.1016\/j.adna.2023.10.001","volume":"1","author":"La","year":"2024","journal-title":"Adv. Nanocompos."},{"key":"D6MH00645K\/cit69\/1","doi-asserted-by":"publisher","first-page":"298","DOI":"10.1016\/j.adna.2026.03.002","volume":"3","author":"Hou","year":"2026","journal-title":"Adv. Nanocompos."},{"key":"D6MH00645K\/cit70\/1","doi-asserted-by":"publisher","first-page":"339","DOI":"10.1016\/j.adna.2026.03.001","volume":"3","author":"Zhu","year":"2026","journal-title":"Adv. Nanocompos."},{"key":"D6MH00645K\/cit71\/1","doi-asserted-by":"publisher","first-page":"89","DOI":"10.4071\/001c.88421","volume":"20","author":"Lyon","year":"2023","journal-title":"J. Microelectron. Electron. Packag."},{"key":"D6MH00645K\/cit72\/1","doi-asserted-by":"publisher","first-page":"189","DOI":"10.1016\/B978-0-08-054819-7.00007-8","volume-title":"Properties of Polymers","author":"Van Krevelen","year":"2009","unstructured":"D. W.Van Krevelen  and  K.Te Nijenhuis ,  Properties of Polymers ,  Elsevier ,  Amsterdam , 4th edn,  2009 ,  pp. 189\u2013227 10.1016\/B978-0-08-054819-7.00007-8"},{"key":"D6MH00645K\/cit73\/1","doi-asserted-by":"publisher","first-page":"6253","DOI":"10.1021\/ie0497184","volume":"43","author":"Stefanis","year":"2004","journal-title":"Ind. Eng. Chem. Res."},{"key":"D6MH00645K\/cit74\/1","doi-asserted-by":"publisher","first-page":"177","DOI":"10.1109\/ICSJ47124.2019.8998644","author":"Kikuchi","year":"2019","unstructured":"K.Kikuchi ,  Y.Karasawa ,  Y.Watanabe ,  T.Sugino  and  T.Suetsugu , IEEE CPMT Symposium Japan (ICSJ),  2019 ,  177181 10.1109\/ICSJ47124.2019.8998644"},{"key":"D6MH00645K\/cit75\/1","doi-asserted-by":"publisher","first-page":"e57307","DOI":"10.1002\/app.57307","volume":"142","author":"Yue","year":"2025","journal-title":"J. Appl. Polym. Sci."},{"key":"D6MH00645K\/cit76\/1","doi-asserted-by":"publisher","first-page":"91","DOI":"10.1002\/adv.20033","volume":"24","author":"Prezzi","year":"2005","journal-title":"Adv. Polym. Technol."},{"key":"D6MH00645K\/cit77\/1","doi-asserted-by":"publisher","first-page":"616","DOI":"10.1002\/app.35015","volume":"124","author":"Piscitelli","year":"2012","journal-title":"J. Appl. Polym. Sci."},{"key":"D6MH00645K\/cit78\/1","doi-asserted-by":"publisher","first-page":"086001","DOI":"10.1103\/PhysRevLett.103.086001","volume":"103","author":"Brown","year":"2009","journal-title":"Phys. Rev. Lett."},{"key":"D6MH00645K\/cit79\/1","doi-asserted-by":"publisher","first-page":"27","DOI":"10.1063\/1.3248476","volume":"62","author":"Wagner","year":"2009","journal-title":"Phys. Today"},{"key":"D6MH00645K\/cit80\/1","doi-asserted-by":"publisher","first-page":"046602","DOI":"10.1088\/0034-4885\/77\/4\/046602","volume":"77","author":"Brown","year":"2014","journal-title":"Rep. Prog. Phys."},{"key":"D6MH00645K\/cit81\/1","doi-asserted-by":"publisher","first-page":"031007","DOI":"10.1115\/1.4037145","volume":"139","author":"Liaw","year":"2017","journal-title":"J. Electron. Packag."},{"key":"D6MH00645K\/cit82\/1","doi-asserted-by":"publisher","first-page":"227","DOI":"10.1007\/s11029-020-09875-5","volume":"56","author":"Startsev","year":"2020","journal-title":"Mech. Compos. Mater."},{"key":"D6MH00645K\/cit83\/1","doi-asserted-by":"publisher","first-page":"2067","DOI":"10.1016\/S0032-3861(03)00059-4","volume":"44","author":"Ramis","year":"2003","journal-title":"Polymer"},{"key":"D6MH00645K\/cit84\/1","doi-asserted-by":"publisher","first-page":"000345","DOI":"10.4071\/isom-2016-WP45","volume":"2016","author":"Thomas","year":"2016","journal-title":"Int. Symp. Microelectron."},{"key":"D6MH00645K\/cit85\/1","doi-asserted-by":"publisher","first-page":"1107","DOI":"10.1109\/ECTC51687.2025.00192","author":"Sugiura","year":"2025","unstructured":"Y.Sugiura ,  D.Mori  and  K.Kan , IEEE 75th Electronic Components and Technology Conference (ECTC),  2025 ,  11071112 10.1109\/ECTC51687.2025.00192"},{"key":"D6MH00645K\/cit86\/1","doi-asserted-by":"publisher","first-page":"967","DOI":"10.1109\/ECTC.2018.00148","author":"Oi","year":"2018","unstructured":"Y.Oi ,  Y.Fujii ,  T.Hiraoka ,  Y.Yada  and  K.Kan , IEEE 68th Electronic Components and Technology Conference (ECTC),  2018 ,  967972 10.1109\/ECTC.2018.00148"},{"key":"D6MH00645K\/cit87\/1","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/ICEPT56209.2022.9873223","author":"Zou","year":"2022","unstructured":"Q.Zou ,  G.Xie ,  G.Lei ,  Q.Ding  and  W.Zhan , 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022 ,  16 10.1109\/ICEPT56209.2022.9873223"},{"key":"D6MH00645K\/cit88\/1","doi-asserted-by":"publisher","first-page":"4191","DOI":"10.1021\/acs.iecr.2c00048","volume":"61","author":"Li","year":"2022","journal-title":"Ind. Eng. Chem. Res."},{"key":"D6MH00645K\/cit89\/1","doi-asserted-by":"publisher","first-page":"187","DOI":"10.1109\/ESTC.2008.4684347","author":"Hong","year":"2008","unstructured":"J.Hong ,  S.Gao ,  S.Park ,  S.Moon ,  J.Baek ,  S.Choi  and  S.Yi , 2nd Electronics System-Integration Technology Conference,  2008 ,  187192 10.1109\/ESTC.2008.4684347"}],"container-title":["Materials Horizons"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/pubs.rsc.org\/MH\/article-pdf\/doi\/10.1039\/D6MH00645K\/0\/D6MH00645K.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,3]],"date-time":"2026-08-03T15:44:37Z","timestamp":1785771877000},"score":1,"resource":{"primary":{"URL":"http:\/\/pubs.rsc.org\/MH\/article-lookup\/doi\/10.1039\/D6MH00645K"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":89,"journal-issue":{"issue":"15","published-print":{"date-parts":[[2026,8,3]]}},"URL":"https:\/\/doi.org\/10.1039\/d6mh00645k","relation":{},"ISSN":["2051-6347","2051-6355"],"issn-type":[{"value":"2051-6347","type":"print"},{"value":"2051-6355","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}