{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,8]],"date-time":"2026-03-08T22:21:14Z","timestamp":1773008474148,"version":"3.50.1"},"reference-count":26,"publisher":"Institution of Engineering and Technology (IET)","issue":"1","license":[{"start":{"date-parts":[[2025,12,22]],"date-time":"2025-12-22T00:00:00Z","timestamp":1766361600000},"content-version":"vor","delay-in-days":355,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"content-domain":{"domain":["ietresearch.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["IET Circuits, Devices &amp; Systems"],"published-print":{"date-parts":[[2025,1]]},"abstract":"<jats:p>\n                    Both circuit performance and long\u2010term reliability are significantly impacted by the combined effects of temperature\u2010induced drive current fluctuations and self\u2010heating in FinFET devices. The performance of a three\u2010stage rail\u2010to\u2010rail dynamic comparator based on a 7\u2009nm FinFET is examined in this work, taking into account the effects of thermal changes caused by supply voltage and input voltage (\n                    <jats:italic>\u0394V<\/jats:italic>\n                    <jats:sub>in<\/jats:sub>\n                    ) as well as bias temperature instability (BTI) stress. When compared to traditional bulk CMOS comparators, FinFET\u2010based three\u2010stage rail\u2010to\u2010rail dynamic comparators show essentially different delay\u2013temperature characteristics, according to extensive HSPICE simulations. Even in the super\u2010threshold supply voltage domain, the 7\u2009nm FinFET\u2010based design shows decreased delay but increased power consumption as temperature rises, in contrast to CMOS comparators, where delay usually increases with temperature. However, at high temperatures, leakage power dissipation increases dramatically, resulting in a loss of performance. With immediate applications in ultralow\u2010power Internet of Things (IoT) nodes, sophisticated memory sense amplifiers, high\u2010frequency communication systems, and portable biomedical equipment, these insights are especially helpful in directing the design of next\u2010generation high\u2010speed and energy\u2010efficient mixed\u2010signal circuits.\n                  <\/jats:p>","DOI":"10.1049\/cds2\/6950438","type":"journal-article","created":{"date-parts":[[2025,12,22]],"date-time":"2025-12-22T15:57:12Z","timestamp":1766419032000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Temperature\u2010Driven Performance and Reliability Trade\u2010Offs in 7\u2009nm FinFET\u2010Based Dynamic Comparators"],"prefix":"10.1049","volume":"2025","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-1989-3033","authenticated-orcid":false,"given":"MD","family":"Badhesha","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2398-3690","authenticated-orcid":false,"given":"J.","family":"Ajayan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9491-5310","authenticated-orcid":false,"given":"Asisa Kumar","family":"Panigrahy","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8517-0775","authenticated-orcid":false,"given":"Amit Krishna","family":"Dwivedi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"265","published-online":{"date-parts":[[2025,12,22]]},"reference":[{"key":"e_1_2_9_1_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2025.3596708"},{"key":"e_1_2_9_2_2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2025.3596293"},{"key":"e_1_2_9_3_2","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2025.3565921"},{"key":"e_1_2_9_4_2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2025.3587799"},{"key":"e_1_2_9_5_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2025.3581335"},{"key":"e_1_2_9_6_2","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2025.3557862"},{"key":"e_1_2_9_7_2","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2025.3547475"},{"key":"e_1_2_9_8_2","first-page":"384","article-title":"A Flying-Capacitor-Based Reset Scheme for Low Power Dynamic Comparator","volume":"72","author":"Li K. C.","year":"2025","journal-title":"IEEE Transactions on Circuits and Systems II: Express Briefs"},{"key":"e_1_2_9_9_2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3510883"},{"key":"e_1_2_9_10_2","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2024.3510389"},{"key":"e_1_2_9_11_2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3446175"},{"key":"e_1_2_9_12_2","doi-asserted-by":"publisher","DOI":"10.23919\/ICS.2024.3505092"},{"key":"e_1_2_9_13_2","first-page":"1","article-title":"Pulsed-Laser-Induced Single-Event Upset in Dynamic Comparator by Incorporating Experimental Parameters Into Simulations","volume":"73","author":"Yu S.-B.","year":"2024","journal-title":"IEEE Transactions on Instrumentation and Measurement"},{"key":"e_1_2_9_14_2","doi-asserted-by":"publisher","DOI":"10.1007\/s42341-023-00503-2"},{"key":"e_1_2_9_15_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2023.154651"},{"key":"e_1_2_9_16_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2019.05.040"},{"key":"e_1_2_9_17_2","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-021-01891-2"},{"key":"e_1_2_9_18_2","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-021-01950-8"},{"key":"e_1_2_9_19_2","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-022-02054-7"},{"key":"e_1_2_9_20_2","doi-asserted-by":"publisher","DOI":"10.1007\/s00034-025-03042-8"},{"key":"e_1_2_9_21_2","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-023-02157-9"},{"key":"e_1_2_9_22_2","doi-asserted-by":"publisher","DOI":"10.1007\/s41870-024-02070-y"},{"key":"e_1_2_9_23_2","doi-asserted-by":"publisher","DOI":"10.1007\/s00034-024-02818-8"},{"key":"e_1_2_9_24_2","doi-asserted-by":"publisher","DOI":"10.1007\/s00034-023-02375-6"},{"key":"e_1_2_9_25_2","doi-asserted-by":"crossref","unstructured":"SootkaneungW. HowimanpornS. andChookaewS. Thermal Effect on Performance Power and BTI Aging in FinFET-Based Designs 2017 Euromicro Conference on Digital System Design (DSD) 2017 IEEE 345\u2013351 https:\/\/doi.org\/10.1109\/DSD.2017.35 2-s2.0-85034423423.","DOI":"10.1109\/DSD.2017.35"},{"key":"e_1_2_9_26_2","doi-asserted-by":"crossref","unstructured":"LeeW. WangY. CuiT. NazarianS. andPedramM. Dynamic Thermal Management for FinFET-Based Circuits Exploiting the Temperature Effect Inversion Phenomenon 2014 IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED) 2014 IEEE 105\u2013110 https:\/\/doi.org\/10.1145\/2627369.2627608 2-s2.0-84953389983.","DOI":"10.1145\/2627369.2627608"}],"container-title":["IET Circuits, Devices &amp; Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/pdf\/10.1049\/cds2\/6950438","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/full-xml\/10.1049\/cds2\/6950438","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/pdf\/10.1049\/cds2\/6950438","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,8]],"date-time":"2026-03-08T20:24:07Z","timestamp":1773001447000},"score":1,"resource":{"primary":{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/10.1049\/cds2\/6950438"}},"subtitle":[],"editor":[{"given":"Ravi","family":"Gangwar","sequence":"additional","affiliation":[],"role":[{"role":"editor","vocabulary":"crossref"}]}],"short-title":[],"issued":{"date-parts":[[2025,1]]},"references-count":26,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2025,1]]}},"alternative-id":["10.1049\/cds2\/6950438"],"URL":"https:\/\/doi.org\/10.1049\/cds2\/6950438","archive":["Portico"],"relation":{},"ISSN":["1751-858X","1751-8598"],"issn-type":[{"value":"1751-858X","type":"print"},{"value":"1751-8598","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1]]},"assertion":[{"value":"2025-10-04","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-11-25","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-12-22","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"6950438"}}