{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,8]],"date-time":"2026-03-08T18:23:24Z","timestamp":1772994204995,"version":"3.50.1"},"reference-count":33,"publisher":"Institution of Engineering and Technology (IET)","issue":"1","license":[{"start":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T00:00:00Z","timestamp":1749168000000},"content-version":"vor","delay-in-days":156,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"content-domain":{"domain":["ietresearch.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["IET Computers &amp; Digital Techniques"],"published-print":{"date-parts":[[2025,1]]},"abstract":"<jats:p>This study presents an innovative temperature\u2010induced random noise correction method for complementary metal oxide semiconductor (CMOS) spatial cameras using an attention mechanism\u2010enhanced long short\u2010term memory (LSTM) model. The model, specifically designed to address pixel drift and random noise issues in CMOS space cameras due to temperature variations, incorporates a multilayer LSTM network with an attention mechanism. This study comprehensively examines the temperature\u2010induced variations in noise characteristics of CMOS cameras across diverse thermal conditions, encompassing in\u2010depth analyses of both dark\u2010field and light\u2010field scenarios. Through detailed pixel\u2010level analysis, the study quantifies the influence of temperature on pixel values and critical performance parameters such as internal nonuniformity within the camera. The experimental results show that under the dark field condition, the fitting variance between the predicted value and the measured value ranges from 0.29585 to 5.798307. After correction in light field conditions, the average variance of images decreases to 0.29, the mean signal\u2010to\u2010noise ratio (SNR) increases to 80, and the photo response nonuniformity (PRNU) mean drops to 0.0161%. Compared to precorrection levels, these key metrics show significant improvements, with an average 83.57\u2010fold reduction, 1.89\u2010fold increase, and 84.98\u2010fold decrease, respectively. These results confirm the effectiveness of the deep learning method in correcting temperature\u2010induced noise, highlighting the potential for practical engineering applications.<\/jats:p>","DOI":"10.1049\/cdt2\/6670185","type":"journal-article","created":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T03:04:39Z","timestamp":1749179079000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["A Temperature Noise Correction Method for CMOS Spatial Camera Using LSTM With Attention Mechanism"],"prefix":"10.1049","volume":"2025","author":[{"ORCID":"https:\/\/orcid.org\/0009-0005-9962-1097","authenticated-orcid":false,"given":"Long","family":"Cheng","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0229-0797","authenticated-orcid":false,"given":"Xueying","family":"Wang","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0009-0003-7255-3747","authenticated-orcid":false,"given":"Jing","family":"Xu","sequence":"additional","affiliation":[]}],"member":"265","published-online":{"date-parts":[[2025,6,6]]},"reference":[{"key":"e_1_2_11_1_2","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-08-102434-8.00009-X"},{"key":"e_1_2_11_2_2","doi-asserted-by":"publisher","DOI":"10.3390\/s22249991"},{"key":"e_1_2_11_3_2","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4614-7804-1_23"},{"key":"e_1_2_11_4_2","doi-asserted-by":"publisher","DOI":"10.3390\/s19071505"},{"key":"e_1_2_11_5_2","doi-asserted-by":"crossref","unstructured":"UdreaF. SantraS. andGardnerJ. W. CMOS Temperature Sensors\u2014Concepts State-of-the-Art and Prospects 1 2008 International Semiconductor Conference 2008 Sinaia Romania IEEE 31\u201340 https:\/\/doi.org\/10.1109\/SMICND.2008.4703322 2-s2.0-67249159308.","DOI":"10.1109\/SMICND.2008.4703322"},{"key":"e_1_2_11_6_2","doi-asserted-by":"crossref","unstructured":"ChenX. ElgabraH. ChenC.-H. BaughJ. andWeiL. Estimation of MOSFET Channel Noise and Noise Performance of CMOS LNAs at Cryogenic Temperatures 2021 IEEE International Symposium on Circuits and Systems (ISCAS) 2021 IEEE 1\u20135 https:\/\/doi.org\/10.1109\/ISCAS51556.2021.9401136.","DOI":"10.1109\/ISCAS51556.2021.9401136"},{"key":"e_1_2_11_7_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2702624"},{"key":"e_1_2_11_8_2","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3131732"},{"key":"e_1_2_11_9_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2037389"},{"key":"e_1_2_11_10_2","doi-asserted-by":"crossref","unstructured":"KamehamaH. YasutomiK. KagawaK. andKawahitoS. Thermal Analysis of a Cooling Module for An Image Sensor With Thermally Isolated Pixel Area 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) 2013 IEEE 142\u2013145 https:\/\/doi.org\/10.1109\/EDAPS.2013.6724409 2-s2.0-84894128720.","DOI":"10.1109\/EDAPS.2013.6724409"},{"key":"e_1_2_11_11_2","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2548562"},{"key":"e_1_2_11_12_2","doi-asserted-by":"publisher","DOI":"10.1117\/12.873834"},{"key":"e_1_2_11_13_2","doi-asserted-by":"publisher","DOI":"10.3390\/electronics10030262"},{"key":"e_1_2_11_14_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.isprsjprs.2018.12.012"},{"key":"e_1_2_11_15_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2544814"},{"key":"e_1_2_11_16_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3056019"},{"key":"e_1_2_11_17_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2654515"},{"key":"e_1_2_11_18_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2947774"},{"key":"e_1_2_11_19_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2831719"},{"key":"e_1_2_11_20_2","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2023.3278307"},{"key":"e_1_2_11_21_2","doi-asserted-by":"crossref","unstructured":"BaekI. YooB. andYangK. In-Pixel Calibration of Temperature Dependent FPN for a Wide Dynamic-Range Dual-Capture CMOS Image Sensor The 18th IEEE International Symposium on Consumer Electronics (ISCE 2014) 2014 IEEE 1\u20133 https:\/\/doi.org\/10.1109\/ISCE.2014.6884407 2-s2.0-84907322874.","DOI":"10.1109\/ISCE.2014.6884407"},{"key":"e_1_2_11_22_2","doi-asserted-by":"crossref","unstructured":"RezaeiiA. B. NoruzpurF. andMahdaviS. A Novel APS Pixel Level Rearrangement to Increase the Fill Factor and SNR in 0.35\u03bcm CMOS Technology 2017 MIXDES-24th International Conference\u201d Mixed Design of Integrated Circuits and Systems 2017 IEEE 205\u2013210 https:\/\/doi.org\/10.23919\/MIXDES.2017.8005184 2-s2.0-85030232941.","DOI":"10.23919\/MIXDES.2017.8005184"},{"key":"e_1_2_11_23_2","doi-asserted-by":"crossref","unstructured":"ZimoucheH. AmhazH. andSicardG. Temperature Compensated Logarithmic CMOS Image Sensor Using CMOS Voltage Reference Bandgap Method 2011 IEEE 9th International New Circuits and systems conference 2011 Bydgoszcz Poland IEEE 382\u2013385 https:\/\/doi.org\/10.1109\/NEWCAS.2011.5981250 2-s2.0-80052540942.","DOI":"10.1109\/NEWCAS.2011.5981250"},{"key":"e_1_2_11_24_2","doi-asserted-by":"crossref","unstructured":"LabonneE. SicardG. andRenaudinM. An on-Pixel FPN Reduction Method for a High Dynamic Range CMOS Imager ESSCIRC 2007\u201433rd European Solid-State Circuits Conference 2007 IEEE 332\u2013335 https:\/\/doi.org\/10.1109\/ESSCIRC.2007.4430311 2-s2.0-44849085590.","DOI":"10.1109\/ESSCIRC.2007.4430311"},{"key":"e_1_2_11_25_2","doi-asserted-by":"publisher","DOI":"10.1109\/MCD.2005.1438751"},{"key":"e_1_2_11_26_2","doi-asserted-by":"publisher","DOI":"10.3390\/s23229109"},{"key":"e_1_2_11_27_2","doi-asserted-by":"publisher","DOI":"10.3390\/s19040870"},{"key":"e_1_2_11_28_2","doi-asserted-by":"publisher","DOI":"10.3390\/s19245459"},{"key":"e_1_2_11_29_2","doi-asserted-by":"publisher","DOI":"10.1364\/AOP.398263"},{"key":"e_1_2_11_30_2","doi-asserted-by":"publisher","DOI":"10.1080\/21681163.2021.1997646"},{"key":"e_1_2_11_31_2","doi-asserted-by":"publisher","DOI":"10.1109\/JTEHM.2021.3130494"},{"key":"e_1_2_11_32_2","doi-asserted-by":"publisher","DOI":"10.3390\/ijgi11060323"},{"key":"e_1_2_11_33_2","unstructured":"European Machine Vision Association EMVA. 1288 Standard [Online]. Available:https:\/\/www.emva.org\/standards-technology\/emva-1288\/emva-standard-1288-downloads-2\/."}],"container-title":["IET Computers &amp; Digital Techniques"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/pdf\/10.1049\/cdt2\/6670185","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/full-xml\/10.1049\/cdt2\/6670185","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/pdf\/10.1049\/cdt2\/6670185","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,8]],"date-time":"2026-03-08T15:08:10Z","timestamp":1772982490000},"score":1,"resource":{"primary":{"URL":"https:\/\/ietresearch.onlinelibrary.wiley.com\/doi\/10.1049\/cdt2\/6670185"}},"subtitle":[],"editor":[{"given":"Chao","family":"Wang","sequence":"additional","affiliation":[]}],"short-title":[],"issued":{"date-parts":[[2025,1]]},"references-count":33,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2025,1]]}},"alternative-id":["10.1049\/cdt2\/6670185"],"URL":"https:\/\/doi.org\/10.1049\/cdt2\/6670185","archive":["Portico"],"relation":{},"ISSN":["1751-8601","1751-861X"],"issn-type":[{"value":"1751-8601","type":"print"},{"value":"1751-861X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1]]},"assertion":[{"value":"2024-12-10","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-05-03","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-06-06","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"6670185"}}