{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,30]],"date-time":"2025-07-30T10:55:13Z","timestamp":1753872913975,"version":"3.41.2"},"reference-count":15,"publisher":"AIP Publishing","issue":"6","content-domain":{"domain":["pubs.aip.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2010,6,1]]},"abstract":"<jats:p>We report a method for addressing gas leakage in micromachined valves. The valves used for evaluating the proposed concept utilize a silicon valve seat that is bonded to a glass substrate and actuated by a piezoelectric stack, all of which are assembled within a ceramic package. The sealing method uses the capillary forces of a liquid sealant on the valve seat to reduce gas leakage below measurable limits. The gas leak rates are compared in valves with and without the seal enhancement. For example, a valve closes against 13.5 kPa with 10 V actuation, compared to 40 V required without the enhancement. Leakage is also evaluated for liquid flow.<\/jats:p>","DOI":"10.1063\/1.3436642","type":"journal-article","created":{"date-parts":[[2010,6,24]],"date-time":"2010-06-24T22:09:43Z","timestamp":1277417383000},"update-policy":"https:\/\/doi.org\/10.1063\/aip-crossmark-policy-page","source":"Crossref","is-referenced-by-count":2,"title":["Note: A low leakage liquid seal for micromachined gas valves"],"prefix":"10.1063","volume":"81","author":[{"given":"Allan T.","family":"Evans","sequence":"first","affiliation":[{"name":"University of Michigan Department of Electrical Engineering and Computer Science, , Ann Arbor, Michigan 48109, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yogesh B.","family":"Gianchandani","sequence":"additional","affiliation":[{"name":"University of Michigan Department of Electrical Engineering and Computer Science, , Ann Arbor, Michigan 48109, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"317","published-online":{"date-parts":[[2010,6,24]]},"reference":[{"key":"2023070323402185400_c1","doi-asserted-by":"publisher","first-page":"R35","DOI":"10.1088\/0960-1317\/14\/6\/R01","volume":"14","year":"2004","journal-title":"J. Micromech. Microeng."},{"key":"2023070323402185400_c2","doi-asserted-by":"publisher","first-page":"R13","DOI":"10.1088\/0960-1317\/16\/5\/R01","volume":"16","year":"2006","journal-title":"J. Micromech. Microeng."},{"key":"2023070323402185400_c3","doi-asserted-by":"publisher","first-page":"188","DOI":"10.1016\/S0924-4247(99)00382-9","volume":"83","year":"2000","journal-title":"Sens. Actuators, A"},{"key":"2023070323402185400_c4","doi-asserted-by":"publisher","first-page":"38","DOI":"10.1109\/JMEMS.2009.2034322","volume":"19","year":"2010","journal-title":"J. Microelectromech. Syst."},{"year":"2004","first-page":"27","key":"2023070323402185400_c5"},{"key":"2023070323402185400_c6","doi-asserted-by":"publisher","first-page":"1039","DOI":"10.1109\/JMEMS.2005.856648","volume":"14","year":"2005","journal-title":"J. Microelectromech. Syst."},{"key":"2023070323402185400_c7","doi-asserted-by":"publisher","first-page":"84","DOI":"10.1016\/j.sna.2007.07.028","volume":"143","year":"2008","journal-title":"Sens. Actuators, A"},{"key":"2023070323402185400_c8","doi-asserted-by":"publisher","first-page":"393","DOI":"10.1109\/84.809053","volume":"8","year":"1999","journal-title":"J. Microelectromech. Syst."},{"volume-title":"Wettability. Surfactant Science Series","year":"1993","author":"Berg","key":"2023070323402185400_c9"},{"key":"2023070323402185400_c10","doi-asserted-by":"publisher","first-page":"484","DOI":"10.1126\/science.282.5388.484","volume":"282","year":"1998","journal-title":"Science"},{"key":"2023070323402185400_c11","doi-asserted-by":"publisher","first-page":"1023","DOI":"10.1126\/science.291.5506.1023","volume":"291","year":"2001","journal-title":"Science"},{"key":"2023070323402185400_c12","doi-asserted-by":"publisher","first-page":"215","DOI":"10.1023\/A:1019119925494","volume":"6","year":"1999","journal-title":"Tribol. Lett."},{"key":"2023070323402185400_c13","doi-asserted-by":"publisher","first-page":"015023","DOI":"10.1088\/0960-1317\/18\/1\/015023","volume":"18","year":"2008","journal-title":"J. Micromech. Microeng."},{"key":"2023070323402185400_c14","doi-asserted-by":"publisher","first-page":"868","DOI":"10.1109\/JMEMS.2009.2021097","volume":"18","year":"2009","journal-title":"J. Microelectromech. Syst."},{"volume-title":"Fluid Mechanics","year":"2004","edition":"3rd ed.","key":"2023070323402185400_c15"}],"container-title":["Review of Scientific Instruments"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/pubs.aip.org\/aip\/rsi\/article-pdf\/doi\/10.1063\/1.3436642\/16121599\/066105_1_online.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/pubs.aip.org\/aip\/rsi\/article-pdf\/doi\/10.1063\/1.3436642\/16121599\/066105_1_online.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,4]],"date-time":"2023-07-04T01:06:23Z","timestamp":1688432783000},"score":1,"resource":{"primary":{"URL":"https:\/\/pubs.aip.org\/rsi\/article\/81\/6\/066105\/352585\/Note-A-low-leakage-liquid-seal-for-micromachined"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,6,1]]},"references-count":15,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2010,6,1]]}},"URL":"https:\/\/doi.org\/10.1063\/1.3436642","relation":{},"ISSN":["0034-6748","1089-7623"],"issn-type":[{"type":"print","value":"0034-6748"},{"type":"electronic","value":"1089-7623"}],"subject":[],"published-other":{"date-parts":[[2010,6]]},"published":{"date-parts":[[2010,6,1]]},"article-number":"066105"}}