{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,13]],"date-time":"2026-10-13T13:45:52Z","timestamp":1791899152846,"version":"4.3.4"},"reference-count":22,"publisher":"AIP Publishing","issue":"10","content-domain":{"domain":["pubs.aip.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2026,10,1]]},"abstract":"<jats:p>To expand our laboratory\u2019s capabilities in Extreme Ultraviolet (EUV) photoresist research, we developed an in-house EUV light source that provides lithography exposures at a cost feasible for a university setting. The system uses an Nd:YAG laser to produce plasma on a tin target, generating EUV radiation without the expensive infrastructure of commercial tools. A 150\u00a0nm zirconium transmission filter isolates the EUV, allowing direct exposure of photoresist, and the dose is monitored in real time with an EUV-sensitive photodiode. Using this setup, we demonstrate a clear contrast curve with exposure times typically under 120 seconds, showing that the system delivers controlled and repeatable EUV doses. During optimization, we adjusted laser power, focusing conditions, chamber pressure, and target motion to stabilize the dose and improve EUV output. Plasma debris remains the primary challenge, and we continue to refine target handling and filtering to extend the lifetime of internal components. Compared with commercial platforms costing several million dollars, this tool offers a practical and flexible option for research, enabling the study of new photoresist materials, dose-response behavior, and exposure strategies without depending on limited industrial access. The system thus provides a meaningful bridge that allows academic groups to work directly in the EUV regime.<\/jats:p>","DOI":"10.1063\/5.0314577","type":"journal-article","created":{"date-parts":[[2026,10,13]],"date-time":"2026-10-13T12:49:57Z","timestamp":1791895797000},"update-policy":"https:\/\/doi.org\/10.1063\/aip-crossmark-policy-page","source":"Crossref","is-referenced-by-count":0,"title":["Development and performance of a university-scale extreme ultraviolet (EUV) lithography source"],"prefix":"10.1063","volume":"97","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-7704-0792","authenticated-orcid":false,"given":"D.","family":"Qerimi","sequence":"first","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"M.","family":"Miles","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9355-849X","authenticated-orcid":false,"given":"N.","family":"Bartlett","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"J.","family":"Uhlig","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"D.","family":"O\u2019Dea","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"S.","family":"Rojas","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-4912-4649","authenticated-orcid":false,"given":"E.","family":"Kaderli","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-6799-0862","authenticated-orcid":false,"given":"A.","family":"Doganer","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"T.","family":"Tohara","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9501-1439","authenticated-orcid":false,"given":"D. N.","family":"Ruzic","sequence":"additional","affiliation":[{"name":"Illinois Plasma Institute, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois Urbana-Champaign , Urbana-Champaign, Illinois 61820,","place":["USA"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"317","published-online":{"date-parts":[[2026,10,13]]},"reference":[{"issue":"25","key":"2026101308495407900_c1","doi-asserted-by":"publisher","first-page":"253001","DOI":"10.1088\/0022-3727\/44\/25\/253001","article-title":"Physical processes in EUV sources for microlithography","volume":"44","year":"2011","journal-title":"J.\u00a0Phys. D: Appl. Phys."},{"key":"2026101308495407900_c2","doi-asserted-by":"publisher","first-page":"513","DOI":"10.1117\/3.2638242.ch18","article-title":"Tin mitigation in EUV sources","volume":"PM351","year":"2023","journal-title":"Proc. SPIE"},{"key":"2026101308495407900_c3"},{"issue":"3","key":"2026101308495407900_c4","doi-asserted-by":"publisher","first-page":"033109","DOI":"10.1063\/5.0269233","article-title":"Parametric study of extreme ultraviolet light source from 1-\u03bcm-wavelength lasers via a simulation approach","volume":"138","year":"2025","journal-title":"J.\u00a0Appl. Phys."},{"issue":"3\u20134","key":"2026101308495407900_c5","doi-asserted-by":"publisher","first-page":"173","DOI":"10.1515\/aot-2017-0029","article-title":"Light sources for high-volume manufacturing EUV lithography: technology, performance, and power scaling","volume":"6","year":"2017","journal-title":"Adv. Opt. Technol."},{"issue":"2","key":"2026101308495407900_c6","doi-asserted-by":"publisher","first-page":"021117","DOI":"10.1117\/1.JMM.11.2.021117","article-title":"Debris transport analysis at the intermediate focus of an extreme ultraviolet light source","volume":"11","year":"2012","journal-title":"J.\u00a0Micro\/Nanopatterning, Mater., Metrol."},{"issue":"4","key":"2026101308495407900_c7","doi-asserted-by":"publisher","first-page":"043304","DOI":"10.1063\/1.3176494","article-title":"Ionic debris measurement of three extreme ultraviolet sources","volume":"106","year":"2009","journal-title":"J.\u00a0Appl. Phys."},{"issue":"1","key":"2026101308495407900_c8","doi-asserted-by":"publisher","first-page":"013503","DOI":"10.1117\/1.JMM.15.1.013503","article-title":"Modeling and measuring the transport and scattering of energetic debris in an extreme ultraviolet plasma source","volume":"15","year":"2016","journal-title":"J.\u00a0Micro\/Nanopatterning, Mater., Metrol."},{"issue":"1","key":"2026101308495407900_c9","doi-asserted-by":"publisher","first-page":"223","DOI":"10.1007\/s11090-017-9852-4","article-title":"Removal of tin from extreme ultraviolet collector optics by in-situ hydrogen plasma etching","volume":"38","year":"2018","journal-title":"Plasma Chem. Plasma Process."},{"issue":"1","key":"2026101308495407900_c10","doi-asserted-by":"publisher","first-page":"99","DOI":"10.1016\/j.mee.2008.10.009","article-title":"Reflectivity degradation of grazing-incident EUV mirrors by EUV exposure and carbon contamination","volume":"86","year":"2009","journal-title":"Microelectron. Eng."},{"issue":"5","key":"2026101308495407900_c11","doi-asserted-by":"publisher","first-page":"052601","DOI":"10.1116\/6.0000200","article-title":"Study of a linear surface wave plasma source for tin removal in an extreme ultraviolet source","volume":"38","year":"2020","journal-title":"J.\u00a0Vac. Sci. Technol., B:Nanotechnol. Microelectron.: Mater., Process., Meas., Phenom."},{"key":"2026101308495407900_c12","doi-asserted-by":"publisher","first-page":"116","DOI":"10.1117\/3.2638242","article-title":"Design and realization of an industrial stand-alone EUV resist qualification setup","volume":"11517","year":"2020","journal-title":"Proc. SPIE"},{"key":"2026101308495407900_c13","unstructured":"E.\n            Flores\n          , \u201cAdvancing nanoscale patterning: Photoresist characterization and colloidal assembly for EUV lithography,\u201d Master of Science in Engineering, The University of Texas at Austin, Austin, 2025, available online: https:\/\/repositories.lib.utexas.edu\/server\/api\/core\/bitstreams\/0de70ce5-1d91-4c37-b2bc-1e9436cb589e\/content#:\u223c:text=%5BPDF%5D%20Master%20Document%20Template%20,can%20be%20used%20for."},{"issue":"1","key":"2026101308495407900_c14","doi-asserted-by":"publisher","first-page":"3","DOI":"10.1109\/TNANO.2005.858599","article-title":"Nanopatterning with interferometric lithography using a compact\/spl lambda\/=46.9-nm laser","volume":"5","year":"2006","journal-title":"IEEE Trans. Nanotechnol."},{"key":"2026101308495407900_c15","doi-asserted-by":"publisher","first-page":"e64","DOI":"10.1017\/hpl.2023.53","article-title":"Spectral purity systems applied for laser-produced plasma extreme ultraviolet lithography sources: A review","volume":"11","year":"2023","journal-title":"High Power Laser Sci. Eng."},{"issue":"3","key":"2026101308495407900_c16","doi-asserted-by":"publisher","first-page":"227","DOI":"10.1364\/JOSA.71.000227","article-title":"4d\u20134f emission resonances in laser-produced plasmas","volume":"71","year":"1981","journal-title":"J.\u00a0Opt. Soc. Am."},{"issue":"2","key":"2026101308495407900_c17","doi-asserted-by":"publisher","first-page":"785","DOI":"10.1116\/1.1667511","article-title":"High conversion efficiency mass-limited Sn-based laser plasma source for extreme ultraviolet lithography","volume":"22","year":"2004","journal-title":"J.\u00a0Vac. Sci. Technol., B: Nanotechnol. Microelectron.:Mater., Process., Meas., Phenom."},{"issue":"9","key":"2026101308495407900_c18","doi-asserted-by":"publisher","first-page":"093302","DOI":"10.1063\/1.2191477","article-title":"13.5\u00a0nm extreme ultraviolet emission from tin based laser-produced plasma sources","volume":"99","year":"2006","journal-title":"J.\u00a0Appl. Phys."},{"issue":"4","key":"2026101308495407900_c19","doi-asserted-by":"publisher","first-page":"235","DOI":"10.1515\/aot-2015-0036","article-title":"ITRS lithography roadmap: 2015 challenges","volume":"4","year":"2015","journal-title":"Adv. Opt. Technol."},{"issue":"3","key":"2026101308495407900_c20","doi-asserted-by":"publisher","first-page":"033501","DOI":"10.1117\/1.JMM.18.3.033501","article-title":"Extreme UV secondary electron yield measurements of Ru, Sn, and Hf oxide thin films","volume":"18","year":"2019","journal-title":"J.\u00a0Micro\/Nanopatterning, Mater., Metrol."},{"key":"2026101308495407900_c21","volume-title":"Principles of Plasma Discharges and Materials Processing","year":"2005","edition":"2"},{"key":"2026101308495407900_c22","doi-asserted-by":"crossref","unstructured":"E. G.\n            Rasmussen\n          , B.Wilthan, and B.Simonds, \u201cReport from the extreme ultraviolet (EUV) lithography working group meeting: Current state, needs, and path forward,\u201d Technical Report No. NIST SP 1500-208, National Institute of Standards and Technology, Gaithersburg, MD, 2023.","DOI":"10.6028\/NIST.SP.1500-208"}],"container-title":["Review of Scientific Instruments"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/pubs.aip.org\/aip\/rsi\/article-pdf\/doi\/10.1063\/5.0314577\/21168973\/103527_1_5.0314577.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/pubs.aip.org\/aip\/rsi\/article-pdf\/doi\/10.1063\/5.0314577\/21168973\/103527_1_5.0314577.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,10,13]],"date-time":"2026-10-13T12:49:59Z","timestamp":1791895799000},"score":1,"resource":{"primary":{"URL":"https:\/\/pubs.aip.org\/rsi\/article\/97\/10\/103527\/3406412\/Development-and-performance-of-a-university-scale"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,10,1]]},"references-count":22,"journal-issue":{"issue":"10","published-print":{"date-parts":[[2026,10,1]]}},"URL":"https:\/\/doi.org\/10.1063\/5.0314577","relation":{},"ISSN":["0034-6748","1089-7623"],"issn-type":[{"value":"0034-6748","type":"print"},{"value":"1089-7623","type":"electronic"}],"subject":[],"published-other":{"date-parts":[[2026,10]]},"published":{"date-parts":[[2026,10,1]]},"article-number":"103527"}}