{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,16]],"date-time":"2026-04-16T08:51:28Z","timestamp":1776329488478,"version":"3.50.1"},"reference-count":52,"publisher":"Informa UK Limited","issue":"8","funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["2021R1A2C2005531"],"award-info":[{"award-number":["2021R1A2C2005531"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["www.tandfonline.com"],"crossmark-restriction":true},"short-container-title":["International Journal of Production Research"],"published-print":{"date-parts":[[2026,4,18]]},"DOI":"10.1080\/00207543.2025.2584726","type":"journal-article","created":{"date-parts":[[2025,11,6]],"date-time":"2025-11-06T21:20:07Z","timestamp":1762464007000},"page":"2900-2925","update-policy":"https:\/\/doi.org\/10.1080\/tandf_crossmark_01","source":"Crossref","is-referenced-by-count":0,"title":["An approximate dynamic programming approach to wafer-lot scheduling for parallel multi-chamber equipment in semiconductor fabrication lines"],"prefix":"10.1080","volume":"64","author":[{"given":"Sungwon","family":"Hong","sequence":"first","affiliation":[{"name":"Seoul National University","place":["Seoul, Republic of Korea"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Younsoo","family":"Lee","sequence":"additional","affiliation":[{"name":"Soongsil University","place":["Seoul, Republic of Korea"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kyungsik","family":"Lee","sequence":"additional","affiliation":[{"name":"Seoul National University","place":["Seoul, Republic of Korea"]}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"301","published-online":{"date-parts":[[2025,11,6]]},"reference":[{"key":"e_1_3_4_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2024.3386562"},{"key":"e_1_3_4_3_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ejor.2015.04.004"},{"key":"e_1_3_4_4_1","unstructured":"Applied Materials. 2023. \u201cVistara Platform.\u201d https:\/\/www.appliedmaterials.com\/us\/en\/product-library\/vistara.html."},{"key":"e_1_3_4_5_1","volume-title":"Wafer Fabrication: Factory Performance and Analysis","author":"Atherton Linda F.","year":"1995","unstructured":"Atherton, Linda F., and Robert W. Atherton. 1995. Wafer Fabrication: Factory Performance and Analysis. Vol. 339. New York: Springer Science & Business Media."},{"key":"e_1_3_4_6_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2022.2102948"},{"key":"e_1_3_4_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2017.2733559"},{"key":"e_1_3_4_8_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0305-0548(98)00054-9"},{"key":"e_1_3_4_9_1","unstructured":"D\u00fcmmler Mathias. 2004. \u201cModeling and Optimization of Cluster Tools in Semiconductor Manufacturing.\u201d PhD thesis University of W\u00fcrzburg."},{"key":"e_1_3_4_10_1","doi-asserted-by":"crossref","unstructured":"Edis Emrah B. and Ceyda Oguz. 2011. \u201cParallel Machine Scheduling with Additional Resources: A Lagrangian-Based Constraint Programming Approach.\u201d In Integration of AI and OR Techniques in Constraint Programming for Combinatorial Optimization Problems: 8th International Conference CPAIOR 2011 Berlin Germany May 23\u201327 2011. Proceedings 8 92\u201398. Springer.","DOI":"10.1007\/978-3-642-21311-3_10"},{"key":"e_1_3_4_11_1","unstructured":"Garey M. R. and D. S. Johnson. 1979. Computers and Intractability: A Guide to the Theory of NP-completeness. Mathematical Sciences Series. New York: Freeman."},{"key":"e_1_3_4_12_1","unstructured":"Gurobi Optimization LLC. 2024. \u201cGurobi Optimizer Reference Manual.\u201d https:\/\/www.gurobi.com."},{"key":"e_1_3_4_13_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ejor.2021.12.041"},{"key":"e_1_3_4_14_1","unstructured":"Hong Sungwon. 2024. \u201cSDMP: An Optimization Software Package for Approximate Dynamic Programming.\u201d October. https:\/\/github.com\/swonh\/SDMP."},{"key":"e_1_3_4_15_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apm.2018.07.035"},{"key":"e_1_3_4_16_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2018.04.053"},{"key":"e_1_3_4_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2023.3336909"},{"key":"e_1_3_4_18_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2020.105115"},{"key":"e_1_3_4_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2012.2220355"},{"key":"e_1_3_4_20_1","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2013.2293552"},{"key":"e_1_3_4_21_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2020.1781278"},{"key":"e_1_3_4_22_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207540410001720745"},{"key":"e_1_3_4_23_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2006.873402"},{"key":"e_1_3_4_24_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10696-020-09400-9"},{"key":"e_1_3_4_25_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2021.1887533"},{"key":"e_1_3_4_26_1","doi-asserted-by":"publisher","DOI":"10.1109\/WSC.2008.4736310"},{"key":"e_1_3_4_27_1","doi-asserted-by":"publisher","DOI":"10.1080\/01605682.2018.1500976"},{"key":"e_1_3_4_28_1","doi-asserted-by":"publisher","DOI":"10.1080\/07408170490279598"},{"key":"e_1_3_4_29_1","volume-title":"Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems","author":"M\u00f6nch Lars","year":"2012","unstructured":"M\u00f6nch, Lars, John W. Fowler, and Scott J. Mason. 2012. Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems. Vol. 52. New York: Springer Science & Business Media."},{"key":"e_1_3_4_30_1","doi-asserted-by":"publisher","DOI":"10.1287\/opre.24.4.611"},{"key":"e_1_3_4_31_1","unstructured":"NexGen Wafer Systems. 2024. \u201cSERENO: Semiconductor Equipment for Single Wafer Wet Etch and Clean Applications.\u201d https:\/\/www.nexgen-wafer-systems.com\/sereno\/."},{"key":"e_1_3_4_32_1","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2016.2642997"},{"key":"e_1_3_4_33_1","doi-asserted-by":"publisher","DOI":"10.1002\/9780470182963"},{"key":"e_1_3_4_34_1","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2013.2272702"},{"key":"e_1_3_4_35_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apm.2011.02.035"},{"key":"e_1_3_4_36_1","doi-asserted-by":"publisher","DOI":"10.1287\/opre.44.4.617"},{"key":"e_1_3_4_37_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2019.106095"},{"key":"e_1_3_4_38_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2006.04.006"},{"key":"e_1_3_4_39_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2004.12.007"},{"key":"e_1_3_4_40_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0377-2217(98)80011-8"},{"key":"e_1_3_4_41_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ejor.2011.01.011"},{"key":"e_1_3_4_42_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2022.2102449"},{"key":"e_1_3_4_43_1","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2023.3277410"},{"key":"e_1_3_4_44_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2016.05.001"},{"key":"e_1_3_4_45_1","doi-asserted-by":"publisher","DOI":"10.1057\/palgrave.jors.2601074"},{"key":"e_1_3_4_46_1","doi-asserted-by":"publisher","DOI":"10.1134\/S0005117910100103"},{"key":"e_1_3_4_47_1","doi-asserted-by":"publisher","DOI":"10.1109\/66.536105"},{"key":"e_1_3_4_48_1","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2010.2046736"},{"key":"e_1_3_4_49_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0166-218X(00)00176-1"},{"key":"e_1_3_4_50_1","doi-asserted-by":"publisher","DOI":"10.1080\/07408170304382"},{"key":"e_1_3_4_51_1","doi-asserted-by":"publisher","DOI":"10.1080\/29966892.2024.2444928"},{"key":"e_1_3_4_52_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2024.106709"},{"key":"e_1_3_4_53_1","doi-asserted-by":"publisher","DOI":"10.1109\/TEVC.2024.3359120"}],"container-title":["International Journal of Production Research"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.tandfonline.com\/doi\/pdf\/10.1080\/00207543.2025.2584726","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,16]],"date-time":"2026-04-16T07:51:00Z","timestamp":1776325860000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.tandfonline.com\/doi\/full\/10.1080\/00207543.2025.2584726"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,11,6]]},"references-count":52,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2026,4,18]]}},"alternative-id":["10.1080\/00207543.2025.2584726"],"URL":"https:\/\/doi.org\/10.1080\/00207543.2025.2584726","relation":{},"ISSN":["0020-7543","1366-588X"],"issn-type":[{"value":"0020-7543","type":"print"},{"value":"1366-588X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,11,6]]},"assertion":[{"value":"The publishing and review policy for this title is described in its Aims & Scope.","order":1,"name":"peerreview_statement","label":"Peer Review Statement"},{"value":"http:\/\/www.tandfonline.com\/action\/journalInformation?show=aimsScope&journalCode=tprs20","URL":"http:\/\/www.tandfonline.com\/action\/journalInformation?show=aimsScope&journalCode=tprs20","order":2,"name":"aims_and_scope_url","label":"Aim & Scope"},{"value":"2025-03-15","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-10-27","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-11-06","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}