{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T11:38:05Z","timestamp":1770896285169,"version":"3.50.1"},"reference-count":29,"publisher":"Informa UK Limited","issue":"2","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["International Journal of Systems Science"],"published-print":{"date-parts":[[2005,2,10]]},"DOI":"10.1080\/0020772042000325970","type":"journal-article","created":{"date-parts":[[2005,2,15]],"date-time":"2005-02-15T13:30:51Z","timestamp":1108474251000},"page":"89-101","source":"Crossref","is-referenced-by-count":2,"title":["Neurofuzzy modelling of the reflow thermal profile for surface mount assembly"],"prefix":"10.1080","volume":"36","author":[{"given":"Tsung-Nan","family":"Tsai","sequence":"first","affiliation":[{"name":"Shu-Te University","place":["Taiwan"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Taho","family":"Yang *","sequence":"additional","affiliation":[{"name":"National Cheng Kung University","place":["Taiwan"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pao-An","family":"Hou","sequence":"additional","affiliation":[{"name":"VeriFone Taiwan Ltd.","place":["Taiwan"]}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"301","published-online":{"date-parts":[[2007,2,23]]},"reference":[{"key":"e_1_3_3_2_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/5326.777072"},{"key":"e_1_3_3_2_3_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0888-613X(99)00023-7"},{"key":"e_1_3_3_2_4_1","doi-asserted-by":"crossref","first-page":"27","DOI":"10.1016\/S0952-1976(00)00032-4","article-title":"\u201cIntelligent materials processing by hyperspace data mining\u201d","volume":"13","author":"Chen N","year":"2000","unstructured":"Chen , N , Zhu , DD and Wang , W . 2000 . \u201cIntelligent materials processing by hyperspace data mining\u201d . Engineering Applications of Artificial Intelligence , 13 : 27 \u2013 532 .","journal-title":"Engineering Applications of Artificial Intelligence"},{"key":"e_1_3_3_2_5_1","doi-asserted-by":"publisher","DOI":"10.1080\/002075498192229"},{"key":"e_1_3_3_2_6_1","doi-asserted-by":"publisher","DOI":"10.1142\/S0960313102000217"},{"key":"e_1_3_3_2_7_1","volume-title":"Printed Circuits Handbook\n                  McGraw Hill","author":"Coombs CF","year":"1995","unstructured":"Coombs CF Printed Circuits Handbook New York McGraw Hill 1995"},{"key":"e_1_3_3_2_8_1","doi-asserted-by":"publisher","DOI":"10.1080\/00401706.1984.10487959"},{"key":"e_1_3_3_2_9_1","volume-title":"FuzzyTECH User's Manual, Inform Software Corporation","year":"1998","unstructured":"FuzzyTECH User's Manual, Inform Software Corporation Aachen Germany 1998"},{"key":"e_1_3_3_2_10_1","doi-asserted-by":"crossref","first-page":"675","DOI":"10.1007\/s001700070038","article-title":"\u201cWetting analysis of leadless chips in surface mount technology\u201d","volume":"16","author":"Hui IK","year":"2000","unstructured":"Hui , IK and Ipyn , WLR . 2000 . \u201cWetting analysis of leadless chips in surface mount technology\u201d . International Journal of Advanced Manufacturing Technology , 16 : 675 \u2013 680 .","journal-title":"International Journal of Advanced Manufacturing Technology"},{"key":"e_1_3_3_2_11_1","doi-asserted-by":"publisher","DOI":"10.1109\/21.256541"},{"key":"e_1_3_3_2_12_1","volume-title":"Solder Paste Technology\u2014Principles and Applications\n                  Tab Books","author":"Johnson CC","year":"1989","unstructured":"Johnson CC Kevra J Solder Paste Technology\u2014Principles and Applications Pennsylvania Tab Books 1989"},{"key":"e_1_3_3_2_13_1","first-page":"23","article-title":"\u201cConsistent thermal profiling\u201d","volume":"7","author":"Kazmierowics P","year":"1993","unstructured":"Kazmierowics , P . 1993 . \u201cConsistent thermal profiling\u201d . Surface Mount Technology , 7 : 23 \u2013 25 .","journal-title":"Surface Mount Technology"},{"key":"e_1_3_3_2_14_1","volume-title":"Neural Networks and Fuzzy Systems\n                  Prentice-Hall","author":"Kosko B","year":"1992","unstructured":"Kosko B Neural Networks and Fuzzy Systems Englewood Cliffs NJ Prentice-Hall 1992"},{"key":"e_1_3_3_2_15_1","volume-title":"Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies\n                  McGraw-Hill","author":"Lau JH","year":"1997","unstructured":"Lau JH Pao YH Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies New York McGraw-Hill 1997"},{"key":"e_1_3_3_2_16_1","doi-asserted-by":"crossref","first-page":"79","DOI":"10.1016\/S0924-0136(96)00045-3","article-title":"\u201cA hierarchical evaluation of the solder paste printing process\u201d","volume":"69","author":"Lau KH","year":"1997","unstructured":"Lau , KH and Yeung , WS . 1997 . \u201cA hierarchical evaluation of the solder paste printing process\u201d . Journal of Materials Processing Technology , 69 : 79 \u2013 89 .","journal-title":"Journal of Materials Processing Technology"},{"key":"e_1_3_3_2_17_1","doi-asserted-by":"publisher","DOI":"10.1108\/09540919910254642"},{"key":"e_1_3_3_2_18_1","volume-title":"Neural Fuzzy Systems\n                  Prentice-Hall","author":"Lin CT","year":"1996","unstructured":"Lin CT Lee CS Neural Fuzzy Systems Englewood Cliffs NJ Prentice-Hall 1996"},{"key":"e_1_3_3_2_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/3477.485884"},{"key":"e_1_3_3_2_20_1","doi-asserted-by":"crossref","first-page":"273","DOI":"10.1016\/S0020-0255(97)10053-6","article-title":"\u201cIndustrial application of fuzzy systems: Adaptively fuzzy control of solder stencil printing\u201d","volume":"107","author":"Lotfi A","year":"1998","unstructured":"Lotfi , A and Howarth , M . 1998 . \u201cIndustrial application of fuzzy systems: Adaptively fuzzy control of solder stencil printing\u201d . Information Sciences , 107 : 273 \u2013 285 .","journal-title":"Information Sciences"},{"key":"e_1_3_3_2_21_1","volume-title":"Soldering Handbook for Printed Circuits and Surface Mounting\n                  Van Nostrand Reinhold Company","author":"Manko HH","year":"1995","unstructured":"Manko HH Soldering Handbook for Printed Circuits and Surface Mounting New York Van Nostrand Reinhold Company 1995"},{"key":"e_1_3_3_2_22_1","volume-title":"Design and Analysis of Experimental Design\n                  Wiley","author":"Montgomery DC","year":"2001","unstructured":"Montgomery DC Design and Analysis of Experimental Design 5th edition New York Wiley 2001"},{"key":"e_1_3_3_2_23_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207720050197811"},{"key":"e_1_3_3_2_24_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0168-874X(98)00025-0"},{"key":"e_1_3_3_2_25_1","doi-asserted-by":"publisher","DOI":"10.1109\/3476.720413"},{"key":"e_1_3_3_2_26_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-9236(00)00123-8"},{"key":"e_1_3_3_2_27_1","doi-asserted-by":"publisher","DOI":"10.1109\/91.919254"},{"key":"e_1_3_3_2_28_1","volume-title":"Master thesis, University of Puerto Rico","author":"Soto HP","year":"1998","unstructured":"Soto HP \u201cStudy of the thermal behavior of a printed circuited board during the reflow process inside a surface mount technology oven\u201d Master thesis, University of Puerto Rico Puerto Rico 1998"},{"key":"e_1_3_3_2_29_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0360-8352(97)00116-2"},{"key":"e_1_3_3_2_30_1","volume-title":"Fuzzy and Neural Approaches in Engineering\n                  Wiley","author":"Tsoukalas LH","year":"1997","unstructured":"Tsoukalas LH Uhrig RE Fuzzy and Neural Approaches in Engineering New York Wiley 1997"}],"container-title":["International Journal of Systems Science"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.tandfonline.com\/doi\/pdf\/10.1080\/0020772042000325970","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T10:57:12Z","timestamp":1770893832000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.tandfonline.com\/doi\/full\/10.1080\/0020772042000325970"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2005,2,10]]},"references-count":29,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2005,2,10]]}},"alternative-id":["10.1080\/0020772042000325970"],"URL":"https:\/\/doi.org\/10.1080\/0020772042000325970","relation":{},"ISSN":["0020-7721","1464-5319"],"issn-type":[{"value":"0020-7721","type":"print"},{"value":"1464-5319","type":"electronic"}],"subject":[],"published":{"date-parts":[[2005,2,10]]}}}