{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T14:04:20Z","timestamp":1777644260733,"version":"3.51.4"},"reference-count":49,"publisher":"IOP Publishing","issue":"17","license":[{"start":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T00:00:00Z","timestamp":1777420800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/publishingsupport.iopscience.iop.org\/iop-standard\/v1"},{"start":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T00:00:00Z","timestamp":1777420800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/iopscience.iop.org\/info\/page\/text-and-data-mining"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key R&D Program of China","doi-asserted-by":"crossref","award":["2024YFE0109100"],"award-info":[{"award-number":["2024YFE0109100"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"crossref"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["52201007"],"award-info":[{"award-number":["52201007"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Evaluation Project of Guangdong Provincial Key Laboratory","award":["2023B1212060043"],"award-info":[{"award-number":["2023B1212060043"]}]},{"name":"Institute of New Materials Guangdong Academy of Sciences","award":["2023GINMZX-202301040102"],"award-info":[{"award-number":["2023GINMZX-202301040102"]}]}],"content-domain":{"domain":["iopscience.iop.org"],"crossmark-restriction":false},"short-container-title":["Nanotechnology"],"published-print":{"date-parts":[[2026,5,1]]},"abstract":"Abstract<\/jats:title>\n \n This study investigates the coupling effect of interface orientation and loading direction on the interface structure and evolution of Cu\/Ag nanolayered composites by employing molecular dynamics simulations. Four distinct interface configurations Cu(001)\/Ag(001), Cu(\n \n \n \n <\/jats:tex-math>\n \n \n 1<\/mml:mn>\n \n \n 1<\/mml:mn>\n \u00af<\/mml:mo>\n <\/mml:mover>\n <\/mml:mrow>\n 0<\/mml:mn>\n <\/mml:mrow>\n <\/mml:math>\n <\/jats:inline-formula>\n )\/Ag(\n \n \n \n <\/jats:tex-math>\n \n \n 1<\/mml:mn>\n \n \n 1<\/mml:mn>\n \u00af<\/mml:mo>\n <\/mml:mover>\n <\/mml:mrow>\n 0<\/mml:mn>\n <\/mml:mrow>\n <\/mml:math>\n <\/jats:inline-formula>\n ), Cu(111)\/Ag(111) and Cu(\n \n \n \n <\/jats:tex-math>\n \n \n 11<\/mml:mn>\n \n \n 2<\/mml:mn>\n \u00af<\/mml:mo>\n <\/mml:mover>\n <\/mml:mrow>\n <\/mml:mrow>\n <\/mml:math>\n <\/jats:inline-formula>\n )\/Ag(\n \n \n \n <\/jats:tex-math>\n \n \n 11<\/mml:mn>\n \n \n 2<\/mml:mn>\n \u00af<\/mml:mo>\n <\/mml:mover>\n <\/mml:mrow>\n <\/mml:mrow>\n <\/mml:math>\n <\/jats:inline-formula>\n ) were subjected to tensile loading both perpendicular and parallel to the interface. Results show that the initial lattice mismatch leads to the formation of characteristic dislocation networks (square, triangular, and rectangular) at the interfaces, whose morphology is dictated by the specific orientation combination. The loading direction critically governs the subsequent defect nucleation and propagation pathways. Under perpendicular loading, dislocation nucleation preferentially initiates in the softer Ag layer before transmitting into the Cu layer. In contrast, parallel loading promotes dislocation emission directly from the interface into both adjacent layers, with the Cu side often exhibiting more rapid plastic development. The mechanical response and the evolution of dislocation density, including the formation of sessile stair-rod dislocations, are strongly dependent on both the interface type and the loading axis. Furthermore, the implications of varying dislocation densities on electrical resistivity are discussed. This work provides atomic-scale insights into the coupling effect of interface structure and loading condition, offering guidance for the interfacial design and processing of high-strength, high-conductivity layered composites.\n <\/jats:p>","DOI":"10.1088\/1361-6528\/ae5aa7","type":"journal-article","created":{"date-parts":[[2026,4,2]],"date-time":"2026-04-02T22:48:19Z","timestamp":1775170099000},"page":"175701","update-policy":"https:\/\/doi.org\/10.1088\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Coupling effect between interface orientation and loading direction on the interface structure and evolution of Cu\/Ag nanolayered composites: a molecular dynamics study"],"prefix":"10.1088","volume":"37","author":[{"given":"Yiran","family":"Chi","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yongnan","family":"Xiong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xing","family":"Luo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chunlei","family":"Gan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Defeng","family":"Guo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pengjiang","family":"He","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2745-5382","authenticated-orcid":true,"given":"Zhibo","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"266","published-online":{"date-parts":[[2026,4,29]]},"reference":[{"key":"nanoae5aa7bib1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2021.160522","type":"journal-article","article-title":"Properties of nanocrystalline CuAg foil prepared via electrodeposition","volume":"881","author":"Lee","year":"2021","journal-title":"J. Alloys Compd."},{"key":"nanoae5aa7bib2","doi-asserted-by":"publisher","DOI":"10.1063\/1.5030297","type":"journal-article","article-title":"The effect of silver (Ag) addition to mechanical and electrical properties of copper alloy (Cu) casting product","volume":"1945","author":"Felicia","year":"2018","journal-title":"AIP Conf. Proc."},{"key":"nanoae5aa7bib3","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/TASC.2020.2978466","type":"journal-article","article-title":"High strength and conductivity CuAg micro-composites by ADB process","volume":"30","author":"Liang","year":"2020","journal-title":"IEEE Trans. Appl. Supercond."},{"key":"nanoae5aa7bib4","doi-asserted-by":"publisher","first-page":"2285","DOI":"10.1016\/j.jallcom.2016.11.085","type":"journal-article","article-title":"Deformation mechanisms during severe plastic deformation of a CuAg composite","volume":"695","author":"Kormout","year":"2017","journal-title":"J. Alloys Compd."},{"key":"nanoae5aa7bib5","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2023.144997","type":"journal-article","article-title":"Reforming nanostructured CuAg alloy to improve ductility and electrical conductivity","volume":"872","author":"Zhang","year":"2023","journal-title":"Sci. Eng. A"},{"key":"nanoae5aa7bib6","doi-asserted-by":"publisher","first-page":"103","DOI":"10.7494\/jcme.2021.5.4.103","type":"journal-article","article-title":"Research on mechanical and electrical properties of Cu-Ag alloys designed for the construction of high magnetic field generators","volume":"5","author":"Kawecki","year":"2021","journal-title":"J. Cast. Mater. Eng."},{"key":"nanoae5aa7bib7","doi-asserted-by":"publisher","DOI":"10.1016\/j.jnoncrysol.2021.121270","type":"journal-article","article-title":"Key factors of deformation mechanism of Cu-Ag alloy","volume":"576","author":"Sengul","year":"2022","journal-title":"J. Non-Cryst. Solids."},{"key":"nanoae5aa7bib8","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/TASC.2024.3368396","type":"journal-article","article-title":"Internal stress in high-strength CuAg conductor","volume":"34","author":"Han","year":"2024","journal-title":"IEEE Trans. Appl. Supercond."},{"key":"nanoae5aa7bib9","doi-asserted-by":"publisher","first-page":"542","DOI":"10.1016\/j.scriptamat.2012.12.014","type":"journal-article","article-title":"Stability of interfaces in a multilayered Ag\u2013Cu composite during cold rolling","volume":"68","author":"Tian","year":"2013","journal-title":"Scr. Mater."},{"key":"nanoae5aa7bib10","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2021.109455","type":"journal-article","article-title":"High strength, high electrical conductivity and thermally stable bulk Cu\/Ag nanolayered composites prepared by cross accumulative roll bonding","volume":"200","author":"You","year":"2021","journal-title":"Mater. Des."},{"key":"nanoae5aa7bib11","doi-asserted-by":"publisher","first-page":"211","DOI":"10.1016\/j.actamat.2018.09.003","type":"journal-article","article-title":"Defect-interface interactions in irradiated Cu\/Ag nanocomposites","volume":"160","author":"Wang","year":"2018","journal-title":"Acta Mater."},{"key":"nanoae5aa7bib12","doi-asserted-by":"publisher","DOI":"10.1063\/1.5008886","type":"journal-article","article-title":"Dislocations penetrating an Al\/Si interface","volume":"7","author":"Zhang","year":"2017","journal-title":"AIP Adv."},{"key":"nanoae5aa7bib13","doi-asserted-by":"publisher","first-page":"109","DOI":"10.1016\/j.commatsci.2017.12.063","type":"journal-article","article-title":"Dislocation-based strengthening mechanisms in metal-matrix nanocomposites: a molecular dynamics study of the influence of reinforcement shape in the Al-Si system","volume":"145","author":"Zhang","year":"2018","journal-title":"Comput. Mater. Sci."},{"key":"nanoae5aa7bib14","doi-asserted-by":"publisher","first-page":"799","DOI":"10.1007\/s10853-017-1495-6","type":"journal-article","article-title":"Indentation into an Al\/Si composite: enhanced dislocation mobility at interface","volume":"53","author":"Zhang","year":"2018","journal-title":"J. Mater. Sci."},{"key":"nanoae5aa7bib15","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2022.153546","type":"journal-article","article-title":"Size effects of graphene sheets on the strengthening mechanism of Al-graphene composites: a molecular dynamics study","volume":"596","author":"Qiu","year":"2022","journal-title":"Appl. Surf. Sci."},{"key":"nanoae5aa7bib16","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2021.151533","type":"journal-article","article-title":"The near-surface microstructural evolution and the influence of Si particles during nanoscratching of nanocrystalline Al","volume":"573","author":"Luo","year":"2022","journal-title":"Appl. Surf. Sci."},{"key":"nanoae5aa7bib17","doi-asserted-by":"publisher","first-page":"1370","DOI":"10.1063\/1.329767","type":"journal-article","article-title":"Normal\u2010state resistivity of in\u2008situ\u2013formed ultrafine filamentary Cu\u2010Nb composites","volume":"52","author":"Karasek","year":"1981","journal-title":"J. Appl. Phys."},{"key":"nanoae5aa7bib18","doi-asserted-by":"publisher","first-page":"151","DOI":"10.1016\/S0921-5093(98)01097-1","type":"journal-article","article-title":"Mechanical stability and electrical conductivity of Cu\u2013Ag filamentary microcomposites","volume":"264","author":"Hong","year":"1999","journal-title":"Mater. Sci. Eng."},{"key":"nanoae5aa7bib19","doi-asserted-by":"publisher","first-page":"162","DOI":"10.1016\/j.commatsci.2019.02.017","type":"journal-article","article-title":"Temperature and crystal orientation dependence of dislocation slip and twin nucleation in bilayer Ni\/Ni3Al interface","volume":"162","author":"Yu","year":"2019","journal-title":"Comput. Mater. Sci."},{"key":"nanoae5aa7bib20","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtcomm.2022.105133","type":"journal-article","article-title":"The effect of interface orientation on deformation behavior of Cu\/Al multilayer during tensile process","volume":"34","author":"Pang","year":"2023","journal-title":"Mater. Today Commun."},{"key":"nanoae5aa7bib21","doi-asserted-by":"publisher","first-page":"1057","DOI":"10.1557\/s43578-024-01291-y","type":"journal-article","article-title":"The effect of interface structures on deformation behavior of Cu\/Ni multilayer by molecular dynamics","volume":"39","author":"Pang","year":"2024","journal-title":"J. Mater. Res."},{"key":"nanoae5aa7bib22","doi-asserted-by":"publisher","first-page":"107","DOI":"10.1016\/j.actamat.2017.10.012","type":"journal-article","article-title":"Effect of dynamic evolution of misfit dislocation pattern on dislocation nucleation and shear sliding at semi-coherent bimetal interfaces","volume":"143","author":"Chen","year":"2018","journal-title":"Acta Mater."},{"key":"nanoae5aa7bib23","doi-asserted-by":"publisher","first-page":"551","DOI":"10.1016\/j.commatsci.2010.02.022","type":"journal-article","article-title":"Molecular dynamics simulations of glide dislocations induced by misfit dislocations at the Ni\/Al interface","volume":"48","author":"Zheng","year":"2010","journal-title":"Comput. Mater. Sci."},{"key":"nanoae5aa7bib24","doi-asserted-by":"publisher","first-page":"450","DOI":"10.1016\/j.apsusc.2013.05.150","type":"journal-article","article-title":"Molecular dynamics study on the equal biaxial tension of Cu\/Ag bilayer films","volume":"282","author":"Yuan","year":"2013","journal-title":"Appl. Surf. Sci."},{"key":"nanoae5aa7bib25","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2021.158869","type":"journal-article","article-title":"Effects of pressure on the generalized stacking fault energy and twinning propensity of face-centered cubic metals","volume":"866","author":"Yan","year":"2021","journal-title":"J. Alloys Compd."},{"key":"nanoae5aa7bib26","doi-asserted-by":"publisher","first-page":"817","DOI":"10.1088\/0965-0393\/14\/5\/002","type":"journal-article","article-title":"An embedded-atom potential for the Cu\u2013Ag system","volume":"14","author":"Williams","year":"2006","journal-title":"Modelling Simul. Mater. Sci. Eng."},{"key":"nanoae5aa7bib27","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijplas.2022.103466","type":"journal-article","article-title":"Misorientation-dependent transition between grain boundary migration and sliding in FCC metals","volume":"159","author":"Huang","year":"2022","journal-title":"Int. J. Plast."},{"key":"nanoae5aa7bib28","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtcomm.2024.110881","type":"journal-article","article-title":"The tensile behaviors of Ag-Cu alloys with different Cu contents: molecular dynamics simulations study","volume":"41","author":"Zhang","year":"2024","journal-title":"Mater. Today Commun."},{"key":"nanoae5aa7bib29","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2021.148957","type":"journal-article","article-title":"Nanoscale sliding friction behavior on Cu\/Ag bilayers influenced by water film","volume":"545","author":"Tian","year":"2021","journal-title":"Appl. Surf. Sci."},{"key":"nanoae5aa7bib30","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1006\/jcph.1995.1039","type":"journal-article","article-title":"Fast parallel algorithms for short-range molecular dynamics","volume":"117","author":"Plimpton","year":"1995","journal-title":"J. Comput. Phys."},{"key":"nanoae5aa7bib31","doi-asserted-by":"publisher","DOI":"10.1016\/j.cpc.2021.108171","type":"journal-article","article-title":"LAMMPS\u2014a flexible simulation tool for particle-based materials modeling at the atomic, meso, and continuum scales","volume":"271","author":"Thompson","year":"2022","journal-title":"Comput. Phys. Commun."},{"key":"nanoae5aa7bib32","doi-asserted-by":"publisher","DOI":"10.1088\/0965-0393\/18\/1\/015012","type":"journal-article","article-title":"Visualization and analysis of atomistic simulation data with OVITO\u2013the open visualization tool","volume":"18","author":"Stukowski","year":"2010","journal-title":"Modelling Simul. Mater. Sci. Eng."},{"key":"nanoae5aa7bib33","doi-asserted-by":"publisher","DOI":"10.1088\/0965-0393\/18\/8\/085001","type":"journal-article","article-title":"Extracting dislocations and non-dislocation crystal defects from atomistic simulation data","volume":"18","author":"Stukowski","year":"2010","journal-title":"Modelling Simul. Mater. Sci. Eng."},{"key":"nanoae5aa7bib34","doi-asserted-by":"publisher","DOI":"10.1063\/1.4967207","type":"journal-article","article-title":"Cooperative dissociations of misfit dislocations at bimetal interfaces","volume":"4","author":"Liu","year":"2016","journal-title":"APL Mater."},{"key":"nanoae5aa7bib35","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.86.134111","type":"journal-article","article-title":"Strain rate and orientation dependencies of the strength of single crystalline copper under compression","volume":"86","author":"Dupont","year":"2012","journal-title":"Phys. Rev. B"},{"key":"nanoae5aa7bib36","doi-asserted-by":"publisher","first-page":"481","DOI":"10.1016\/j.commatsci.2007.12.015","type":"journal-article","article-title":"Discrete dislocation dynamics study on interaction between prismatic dislocation loop and interfacial network dislocations","volume":"43","author":"Yashiro","year":"2008","journal-title":"Comput. Mater. Sci."},{"key":"nanoae5aa7bib37","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2022.165144","type":"journal-article","article-title":"Chemical short-range ordering regulated dislocation cross slip in high-entropy alloys","volume":"911","author":"Ma","year":"2022","journal-title":"J. Alloys Compd."},{"key":"nanoae5aa7bib38","doi-asserted-by":"publisher","first-page":"3698","DOI":"10.1016\/j.tsf.2006.10.001","type":"journal-article","article-title":"Misfit dislocation network in Cu\/Ni multilayers and its behaviors during scratching","volume":"515","author":"Cheng","year":"2007","journal-title":"Thin Solid Films"},{"key":"nanoae5aa7bib39","doi-asserted-by":"publisher","DOI":"10.1016\/j.physb.2023.414933","type":"journal-article","article-title":"Effect of interface structure and layer thickness on the mechanical properties and deformation behavior of Cu\/Ag nanolaminates","volume":"661","author":"Liang","year":"2023","journal-title":"Physica B"},{"key":"nanoae5aa7bib40","doi-asserted-by":"publisher","first-page":"231","DOI":"10.1016\/j.actamat.2018.12.051","type":"journal-article","article-title":"Stronger and more failure-resistant with three-dimensional serrated bimetal interfaces","volume":"166","author":"Kong","year":"2019","journal-title":"Acta Mater."},{"key":"nanoae5aa7bib41","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijplas.2024.104101","type":"journal-article","article-title":"Uncovering all possible dislocation locks in face-centered cubic materials","volume":"181","author":"Bajaj","year":"2024","journal-title":"Int. J. Plast."},{"key":"nanoae5aa7bib42","doi-asserted-by":"publisher","DOI":"10.1016\/j.vacuum.2025.114144","type":"journal-article","article-title":"Deformation mechanisms of interfacial dislocation networks in Ni\/Ni3Al\/Ni alloy under differentdirections based on molecular dynamics simulation","volume":"235","author":"Tang","year":"2025","journal-title":"Vacuum"},{"key":"nanoae5aa7bib43","doi-asserted-by":"publisher","DOI":"10.1016\/j.matchemphys.2021.124270","type":"journal-article","article-title":"Mechanical properties and dislocation evolution of Cu\u2013Fe interfaces from molecular dynamics simulation","volume":"262","author":"Shen","year":"2021","journal-title":"Chem. Phys."},{"key":"nanoae5aa7bib44","doi-asserted-by":"publisher","first-page":"296","DOI":"10.1016\/j.msea.2015.11.067","type":"journal-article","article-title":"Simultaneously increasing strength and electrical conductivity in nanostructured Cu\u2013Ag composite","volume":"652","author":"Zhao","year":"2016","journal-title":"Sci. Eng. A"},{"key":"nanoae5aa7bib45","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2024.146219","type":"journal-article","article-title":"Preparation and mechanisms of Cu\u2013Ag alloy fibers with high strength and high conductivity","volume":"895","author":"Kong","year":"2024","journal-title":"Mater. Sci. Eng."},{"key":"nanoae5aa7bib46","author":"Meaden","year":"2013","type":"book"},{"key":"nanoae5aa7bib47","doi-asserted-by":"publisher","first-page":"315","DOI":"10.1016\/0304-3991(89)90060-0","type":"journal-article","article-title":"Problems in evaluating the dislocation densities in heavily deformed Cu-Nb composites","volume":"30","author":"Trybus","year":"1989","journal-title":"Ultramicroscopy"},{"key":"nanoae5aa7bib48","doi-asserted-by":"publisher","first-page":"3280","DOI":"10.1016\/j.matdes.2011.02.032","type":"journal-article","article-title":"The effect of constrained groove pressing on grain size, dislocation density and electrical resistivity of low carbon steel","volume":"32","author":"Khodabakhshi","year":"2011","journal-title":"Mater. Des."},{"key":"nanoae5aa7bib49","doi-asserted-by":"publisher","first-page":"492","DOI":"10.1038\/nature23472","type":"journal-article","article-title":"Probing the limits of metal plasticity with molecular dynamics simulations","volume":"550","author":"Zepeda-Ruiz","year":"2017","journal-title":"Nature"}],"container-title":["Nanotechnology"],"original-title":[],"link":[{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7","content-type":"text\/html","content-version":"am","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7\/pdf","content-type":"application\/pdf","content-version":"am","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7\/pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7\/pdf","content-type":"application\/pdf","content-version":"am","intended-application":"similarity-checking"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T06:28:47Z","timestamp":1777444127000},"score":1,"resource":{"primary":{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/1361-6528\/ae5aa7"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,29]]},"references-count":49,"journal-issue":{"issue":"17","published-online":{"date-parts":[[2026,4,29]]},"published-print":{"date-parts":[[2026,5,1]]}},"URL":"https:\/\/doi.org\/10.1088\/1361-6528\/ae5aa7","relation":{},"ISSN":["0957-4484","1361-6528"],"issn-type":[{"value":"0957-4484","type":"print"},{"value":"1361-6528","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,4,29]]},"assertion":[{"value":"Coupling effect between interface orientation and loading direction on the interface structure and evolution of Cu\/Ag nanolayered composites: a molecular dynamics study","name":"article_title","label":"Article Title"},{"value":"Nanotechnology","name":"journal_title","label":"Journal Title"},{"value":"paper","name":"article_type","label":"Article Type"},{"value":"\u00a9 2026 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.","name":"copyright_information","label":"Copyright Information"},{"value":"2026-01-23","name":"date_received","label":"Date Received","group":{"name":"publication_dates","label":"Publication dates"}},{"value":"2026-04-02","name":"date_accepted","label":"Date Accepted","group":{"name":"publication_dates","label":"Publication dates"}},{"value":"2026-04-29","name":"date_epub","label":"Online publication date","group":{"name":"publication_dates","label":"Publication dates"}}]}}