{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,5,15]],"date-time":"2024-05-15T23:22:59Z","timestamp":1715815379258},"reference-count":0,"publisher":"IOP Publishing","issue":"8","license":[{"start":{"date-parts":[[2016,7,22]],"date-time":"2016-07-22T00:00:00Z","timestamp":1469145600000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/iopscience.iop.org\/info\/page\/text-and-data-mining"},{"start":{"date-parts":[[2016,7,22]],"date-time":"2016-07-22T00:00:00Z","timestamp":1469145600000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/iopscience.iop.org\/page\/copyright"}],"content-domain":{"domain":["iopscience.iop.org"],"crossmark-restriction":true},"short-container-title":["J. Micromech. Microeng."],"published-print":{"date-parts":[[2016,8,1]]},"DOI":"10.1088\/0960-1317\/26\/8\/084001","type":"journal-article","created":{"date-parts":[[2016,7,22]],"date-time":"2016-07-22T13:13:38Z","timestamp":1469193218000},"page":"084001","update-policy":"http:\/\/dx.doi.org\/10.1088\/crossmark-policy","source":"Crossref","is-referenced-by-count":4,"title":["A 45\u00b0 saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography"],"prefix":"10.1088","volume":"26","author":[{"given":"M J","family":"Maciel","sequence":"first","affiliation":[]},{"given":"C G","family":"Costa","sequence":"additional","affiliation":[]},{"given":"M F","family":"Silva","sequence":"additional","affiliation":[]},{"given":"S B","family":"Gon\u00e7alves","sequence":"additional","affiliation":[]},{"given":"A C","family":"Peixoto","sequence":"additional","affiliation":[]},{"given":"A","family":"Fernando Ribeiro","sequence":"additional","affiliation":[]},{"given":"R F","family":"Wolffenbuttel","sequence":"additional","affiliation":[]},{"given":"J H","family":"Correia","sequence":"additional","affiliation":[]}],"member":"266","published-online":{"date-parts":[[2016,7,22]]},"container-title":["Journal of Micromechanics and Microengineering"],"original-title":[],"link":[{"URL":"http:\/\/stacks.iop.org\/0960-1317\/26\/i=8\/a=084001\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/stacks.iop.org\/0960-1317\/26\/i=8\/a=084001?key=crossref.cd64a7182ea3d382ad1d152b61ee86d1","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2020,4,11]],"date-time":"2020-04-11T07:56:34Z","timestamp":1586591794000},"score":1,"resource":{"primary":{"URL":"https:\/\/iopscience.iop.org\/article\/10.1088\/0960-1317\/26\/8\/084001"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,7,22]]},"references-count":0,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2016,8,1]]}},"URL":"https:\/\/doi.org\/10.1088\/0960-1317\/26\/8\/084001","relation":{},"ISSN":["0960-1317","1361-6439"],"issn-type":[{"value":"0960-1317","type":"print"},{"value":"1361-6439","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,7,22]]},"assertion":[{"value":"Journal of Micromechanics and Microengineering","name":"journal_title","label":"Journal title"},{"value":"paper","name":"article_type","label":"Article type"},{"value":"A 45\u00b0 saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography","name":"article_title","label":"Article title"},{"value":"\u00a9 2016 IOP Publishing Ltd","name":"copyright_information","label":"Copyright information"},{"value":"2015-12-26","name":"date_received","label":"Date received","group":{"name":"publication_dates","label":"Publication dates"}},{"value":"2016-01-28","name":"date_accepted","label":"Date accepted","group":{"name":"publication_dates","label":"Publication dates"}},{"value":"2016-07-22","name":"date_epub","label":"Online publication date","group":{"name":"publication_dates","label":"Publication dates"}}]}}