{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,23]],"date-time":"2026-08-23T14:23:27Z","timestamp":1787495007073,"version":"build-2736575974"},"reference-count":38,"publisher":"SAGE Publications","issue":"3","license":[{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/journals.sagepub.com\/page\/policies\/text-and-data-mining-license"}],"content-domain":{"domain":["journals.sagepub.com"],"crossmark-restriction":true},"short-container-title":["Soft Robotics"],"published-print":{"date-parts":[[2023,6,1]]},"abstract":"<jats:p>\n                    Electrostatic adhesion (EA) clutches are widely applied in robots, wearable devices, and virtual reality, due to their compliance, lightweight, ultrathin profile, and low power consumption. Higher force density has been constantly perpetuated in the past decades since EA was initially proposed. In this study, by composing terpolymer poly(vinylidene fluoride\u2013trifluoroethylene\u2013chlorotrifluoroethylene) [P(VDF-TrFE-CTFE)] and two-dimensional Ti\n                    <jats:sub>3<\/jats:sub>\n                    C\n                    <jats:sub>2<\/jats:sub>\n                    T\n                    <jats:sub>\n                      <jats:italic toggle=\"yes\">x<\/jats:italic>\n                    <\/jats:sub>\n                    nanosheets (MXene), nanocomposite films with high dielectric constant (\n                    <jats:inline-formula>\n                      <mml:math xmlns:mml=\"http:\/\/www.w3.org\/1998\/Math\/MathML\" display=\"inline\" overflow=\"scroll\">\n                        <mml:msubsup>\n                          <mml:mrow>\n                            <mml:mi>\u03b4<\/mml:mi>\n                          <\/mml:mrow>\n                          <mml:mrow>\n                            <mml:mi>r<\/mml:mi>\n                          <\/mml:mrow>\n                          <mml:mrow>\n                            <mml:mstyle mathvariant=\"normal\">\n                              <mml:mi>\u2032<\/mml:mi>\n                            <\/mml:mstyle>\n                          <\/mml:mrow>\n                        <\/mml:msubsup>\n                      <\/mml:math>\n                    <\/jats:inline-formula>\n                    &gt; 2300) and low loss tangent are achieved. The force representative index\n                    <jats:inline-formula>\n                      <mml:math xmlns:mml=\"http:\/\/www.w3.org\/1998\/Math\/MathML\" display=\"inline\" overflow=\"scroll\">\n                        <mml:msubsup>\n                          <mml:mrow>\n                            <mml:mi>\u03b4<\/mml:mi>\n                          <\/mml:mrow>\n                          <mml:mrow>\n                            <mml:mi>r<\/mml:mi>\n                          <\/mml:mrow>\n                          <mml:mrow>\n                            <mml:mstyle mathvariant=\"normal\">\n                              <mml:mi>\u2032<\/mml:mi>\n                            <\/mml:mstyle>\n                          <\/mml:mrow>\n                        <\/mml:msubsup>\n                        <mml:msubsup>\n                          <mml:mrow>\n                            <mml:mi>E<\/mml:mi>\n                          <\/mml:mrow>\n                          <mml:mrow>\n                            <mml:mi>b<\/mml:mi>\n                            <mml:mi>d<\/mml:mi>\n                          <\/mml:mrow>\n                          <mml:mrow>\n                            <mml:mn>2<\/mml:mn>\n                          <\/mml:mrow>\n                        <\/mml:msubsup>\n                      <\/mml:math>\n                    <\/jats:inline-formula>\n                    (the relative dielectric constant times the square of breakdown electric field) is enhanced by 5.91 times due to the charge accumulation at matrix\u2013filler interfaces. Superhigh shear stress (85.61\u2009N cm\n                    <jats:sup>\u22122<\/jats:sup>\n                    ) is generated, 408% higher than the previous maximum value. One of the EA clutches fabricated in this study is only 160\u2009\u03bcm thin and 0.4\u2009g heavy. Owing to the low current (&lt;1\u2009\u03bcA), the power consumption is &lt;60\u2009mW\/cm\n                    <jats:sup>2<\/jats:sup>\n                    . It can hold a 2.5\u2009kg weight by only 0.32\u2009cm\n                    <jats:sup>2<\/jats:sup>\n                    area and support an adult (45\u2009kg) (Clinical Trial Registration number: 20210090). With this technology, a dexterous robotic hand is displayed to grasp and release a ball, showing extensive applications of this technique.\n                  <\/jats:p>","DOI":"10.1089\/soro.2022.0013","type":"journal-article","created":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T17:23:00Z","timestamp":1667323380000},"page":"482-492","update-policy":"https:\/\/doi.org\/10.1177\/sage-journals-update-policy","source":"Crossref","is-referenced-by-count":31,"title":["Electrostatic Adhesion Clutch with Superhigh Force Density Achieved by MXene-Poly(Vinylidene Fluoride\u2013Trifluoroethylene\u2013Chlorotrifluoroethylene) Composites"],"prefix":"10.1177","volume":"10","author":[{"given":"Daiyue","family":"Wei","sequence":"first","affiliation":[{"name":"Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou), Guangzhou, China."},{"name":"Shenzhen Key Laboratory of Biomimetic Robotics and Intelligent Systems, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Quan","family":"Xiong","sequence":"additional","affiliation":[{"name":"Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou), Guangzhou, China."},{"name":"Shenzhen Key Laboratory of Biomimetic Robotics and Intelligent Systems, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiufeng","family":"Dong","sequence":"additional","affiliation":[{"name":"Shenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China."},{"name":"State Key Laboratory for Mechanical Behavior of Materials, School of Electronic and Information Engineering, Xi'an Jiaotong University, Xi'an, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Huacen","family":"Wang","sequence":"additional","affiliation":[{"name":"Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou), Guangzhou, China."},{"name":"Shenzhen Key Laboratory of Biomimetic Robotics and Intelligent Systems, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xuanquan","family":"Liang","sequence":"additional","affiliation":[{"name":"Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou), Guangzhou, China."},{"name":"Shenzhen Key Laboratory of Biomimetic Robotics and Intelligent Systems, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shiyu","family":"Tang","sequence":"additional","affiliation":[{"name":"Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou), Guangzhou, China."},{"name":"Shenzhen Key Laboratory of Biomimetic Robotics and Intelligent Systems, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinwei","family":"Xu","sequence":"additional","affiliation":[{"name":"Shenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7286-7514","authenticated-orcid":false,"given":"Hongqiang","family":"Wang","sequence":"additional","affiliation":[{"name":"Southern Marine Science and Engineering Guangdong Laboratory (Guangzhou), Guangzhou, China."},{"name":"Shenzhen Key Laboratory of Biomimetic Robotics and Intelligent Systems, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, China."},{"name":"Guangdong Provincial Key Laboratory of Human-Augmentation and Rehabilitation Robotics in Universities, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3791-786X","authenticated-orcid":false,"given":"Hong","family":"Wang","sequence":"additional","affiliation":[{"name":"Shenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China."}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"179","published-online":{"date-parts":[[2022,11,1]]},"reference":[{"key":"e_1_3_4_2_2","first-page":"713","article-title":"A physical phenomenon and its applications to telegraphy, telephony, etc","volume":"61","author":"Johnsen A","year":"1923","unstructured":"Johnsen A, , Rahbek K. A physical phenomenon and its applications to telegraphy, telephony, etc. J Inst Electr Eng, 1923; 61:713\u2013725.","journal-title":"J Inst Electr Eng"},{"key":"e_1_3_4_3_2","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201504264"},{"key":"e_1_3_4_4_2","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.0c17096"},{"key":"e_1_3_4_5_2","doi-asserted-by":"publisher","DOI":"10.5772\/59118"},{"key":"e_1_3_4_6_2","doi-asserted-by":"publisher","DOI":"10.1109\/TRO.2017.2690302"},{"key":"e_1_3_4_7_2","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.aaz5796"},{"key":"e_1_3_4_8_2","doi-asserted-by":"publisher","DOI":"10.1002\/admt.201900895"},{"key":"e_1_3_4_9_2","first-page":"901","article-title":"Dextres: Wearable haptic feedback for grasping in VR via a thin form-factor electrostatic brake. In: UIST 2018-Proceedings of the 31st Annual ACM Symposium on User Interface Software Technology","author":"Hinchet R","year":"2018","unstructured":"Hinchet R, , Vechev V, , Shea H, et al. Dextres: Wearable haptic feedback for grasping in VR via a thin form-factor electrostatic brake. In: UIST 2018-Proceedings of the 31st Annual ACM Symposium on User Interface Software Technology. New York, NY, United States: Association for Computing Machinery,, 2018; 901\u2013912.","journal-title":"New York, NY, United States: Association for Computing Machinery,"},{"key":"e_1_3_4_10_2","doi-asserted-by":"publisher","DOI":"10.1088\/1361-665X\/ab3a77"},{"key":"e_1_3_4_11_2","doi-asserted-by":"crossref","unstructured":"Diller S Majidi C Collins SH. A lightweight low-power electroadhesive clutch and spring for exoskeleton actuation. In: IEEE International Conference on Robotics and Automation. Stockholm Sweden: IEEE 2016.","DOI":"10.1109\/ICRA.2016.7487194"},{"key":"e_1_3_4_12_2","doi-asserted-by":"publisher","DOI":"10.1063\/1.1565180"},{"key":"e_1_3_4_13_2","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2002.806800"},{"key":"e_1_3_4_14_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.mattod.2019.04.015"},{"key":"e_1_3_4_15_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.matchemphys.2012.01.004"},{"key":"e_1_3_4_16_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.progpolymsci.2020.101254"},{"key":"e_1_3_4_17_2","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201102306"},{"key":"e_1_3_4_18_2","doi-asserted-by":"publisher","DOI":"10.1021\/acsnano.7b08895"},{"key":"e_1_3_4_19_2","doi-asserted-by":"publisher","DOI":"10.1021\/jp1117163"},{"key":"e_1_3_4_20_2","doi-asserted-by":"crossref","unstructured":"Xie G Wang W Zhao X et al. Low-voltage electroadhesive pad with thin insulation layer fabricated by parylene deposition. In 2019 IEEE 9th Annual International Conference on CYBER Technology in Automation Control and Intelligent Systems. Suzhou China: IEEE 2019.","DOI":"10.1109\/CYBER46603.2019.9066611"},{"key":"e_1_3_4_21_2","doi-asserted-by":"publisher","DOI":"10.1002\/etep.4450090506"},{"key":"e_1_3_4_22_2","doi-asserted-by":"publisher","DOI":"10.1002\/app.49197"},{"key":"e_1_3_4_23_2","doi-asserted-by":"publisher","DOI":"10.1021\/ma501852x"},{"key":"e_1_3_4_24_2","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202102644"},{"key":"e_1_3_4_25_2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-019-09874-8"},{"key":"e_1_3_4_26_2","doi-asserted-by":"publisher","DOI":"10.1039\/C8NJ03246G"},{"key":"e_1_3_4_27_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2021.08.192"},{"key":"e_1_3_4_28_2","doi-asserted-by":"publisher","DOI":"10.1039\/C9TC02715G"},{"key":"e_1_3_4_29_2","doi-asserted-by":"publisher","DOI":"10.1002\/app.47551"},{"key":"e_1_3_4_30_2","first-page":"1","article-title":"The influence of nanoparticles in the epoxy resin on dielectric parameters and partial discharges. In 2018 ELEKTRO","author":"Jahoda E","year":"2018","unstructured":"Jahoda E, , Kudelcik J, , Hornak J, et al. The influence of nanoparticles in the epoxy resin on dielectric parameters and partial discharges. In 2018 ELEKTRO. Mikulov, Czech Republic: IEEE,, 2018; 1\u20135.","journal-title":"Mikulov, Czech Republic: IEEE,"},{"key":"e_1_3_4_31_2","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2011.5976079"},{"key":"e_1_3_4_32_2","doi-asserted-by":"publisher","DOI":"10.1002\/admt.201800313"},{"key":"e_1_3_4_33_2","doi-asserted-by":"publisher","DOI":"10.1088\/1361-665X\/aa5484"},{"key":"e_1_3_4_34_2","doi-asserted-by":"publisher","DOI":"10.1177\/1045389X18799474"},{"key":"e_1_3_4_35_2","doi-asserted-by":"crossref","unstructured":"Karagozler ME Campbell J Fedder GK et al. Electrostatic latching for inter-module adhesion power transfer and communication in modular robots. In: IEEE\/RSJ International Conference on Intelligent Robots and Systems. San Diego CA USA: IEEE 2007.","DOI":"10.1109\/IROS.2007.4399492"},{"key":"e_1_3_4_36_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ensm.2019.06.013"},{"key":"e_1_3_4_37_2","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.aat2874"},{"key":"e_1_3_4_38_2","doi-asserted-by":"publisher","DOI":"10.1088\/1367-2630\/10\/12\/123022"},{"key":"e_1_3_4_39_2","first-page":"e44","article-title":"Conduction of electrical current to and through the human body: A review","volume":"9","author":"Fish RM","year":"2009","unstructured":"Fish RM, , Geddes LA. Conduction of electrical current to and through the human body: A review. Eplasty, 2009; 9:e44.","journal-title":"Eplasty"}],"container-title":["Soft Robotics"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/journals.sagepub.com\/doi\/full-xml\/10.1089\/soro.2022.0013","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/journals.sagepub.com\/doi\/pdf\/10.1089\/soro.2022.0013","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/journals.sagepub.com\/doi\/pdf\/10.1089\/soro.2022.0013","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,15]],"date-time":"2026-06-15T21:47:28Z","timestamp":1781560048000},"score":1,"resource":{"primary":{"URL":"https:\/\/journals.sagepub.com\/doi\/10.1089\/soro.2022.0013"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,11,1]]},"references-count":38,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2023,6,1]]}},"alternative-id":["10.1089\/soro.2022.0013"],"URL":"https:\/\/doi.org\/10.1089\/soro.2022.0013","relation":{},"ISSN":["2169-5172","2169-5180"],"issn-type":[{"value":"2169-5172","type":"print"},{"value":"2169-5180","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,11,1]]}}}