{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,25]],"date-time":"2026-06-25T11:46:58Z","timestamp":1782388018749,"version":"3.54.5"},"reference-count":47,"publisher":"Oxford University Press (OUP)","issue":"6","license":[{"start":{"date-parts":[[2026,6,9]],"date-time":"2026-06-09T00:00:00Z","timestamp":1780963200000},"content-version":"vor","delay-in-days":8,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U2341245"],"award-info":[{"award-number":["U2341245"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62175050"],"award-info":[{"award-number":["62175050"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["HIT.OCEF.2024054"],"award-info":[{"award-number":["HIT.OCEF.2024054"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,6,4]]},"abstract":"<jats:title>Abstract<\/jats:title>\n                  <jats:p>System-in-Package (SiP), characterized by its compact structure and short design cycle, is widely used in wireless communication. As the critical components of SiP, radio frequency (RF) transmission lines are utilized to establish high-frequency signal circuits to connect the chip and external ports. With the increasing device power boosting, thermal management is a significant challenge for the SiP system. Therefore, a comprehensive analysis of complex multi-physics environments is the foundational step for thermal management. In this paper, we proposed an electro-thermo-mechanical bidirectional coupling method at the cross-scale interface level to investigate the thermal reliability of transmission lines in RF SiP. Firstly, we developed the theoretical model for the bidirectional electro-thermo-mechanical coupling. Secondly, a predictive numerical model for the multi-physics bidirectional coupling in RF systems, utilizing silicon as the semiconductor and copper as the metal, was constructed. The bidirectional coupling mechanisms were primarily introduced through material properties. Microscopic analytical equations for various material properties were modified by using experimentally measured data. Temperature and strain variables were simultaneously incorporated for equation fitting. Finally, the obtained microscopic analytical equations were substituted into the multi-physics numerical model for the iterative calculation. We analyzed the RF performance changes of microstrip lines, strip lines, and coplanar waveguides, over an ambient temperature range from 233.15 K to 398.15 K. In the bidirectional coupling framework, the impact of the stress feedback mechanism on system performance is closely associated with the boundary conditions, which is particularly evident during the warping process in actual packaging scenarios. The experimental validation in this study was based on S-parameters measured from fabricated coplanar waveguides at room temperature. Theoretical cross\u2013validation was performed for the electromagnetic loss model and the basic temperature rise analysis model. This study provides the foundation model for macroscopic control of RF performance through microscopic regulation of material properties.<\/jats:p>","DOI":"10.1093\/jcde\/qwag054","type":"journal-article","created":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T11:45:40Z","timestamp":1780659940000},"page":"159-179","source":"Crossref","is-referenced-by-count":0,"title":["Multi-physics investigation of the influence of thermal stress on RF systems based on the bidirectional coupling method"],"prefix":"10.1093","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-2840-1846","authenticated-orcid":false,"given":"Shengying","family":"Zou","sequence":"first","affiliation":[{"name":"School of Physics, Harbin Institute of Technology , Xidazhi Street, Harbin 150001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-5731-6200","authenticated-orcid":false,"given":"Yang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Instrumentation Science and Engineering, Harbin Institute of Technology , Xidazhi Street, Harbin 150001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-2895-1958","authenticated-orcid":false,"given":"Yuedong","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Physics, Harbin Institute of Technology , Xidazhi Street, Harbin 150001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-9458-5625","authenticated-orcid":false,"given":"Xuyao","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Instrumentation Science and Engineering, Harbin Institute of Technology , Xidazhi Street, Harbin 150001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6286-3125","authenticated-orcid":false,"given":"Jie","family":"Lin","sequence":"additional","affiliation":[{"name":"School of Physics, Harbin Institute of Technology , Xidazhi Street, Harbin 150001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2228-131X","authenticated-orcid":false,"given":"Peng","family":"Jin","sequence":"additional","affiliation":[{"name":"School of Instrumentation Science and Engineering, Harbin Institute of Technology , Xidazhi Street, Harbin 150001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"286","published-online":{"date-parts":[[2026,6,9]]},"reference":[{"key":"2026062506564072200_bib1","doi-asserted-by":"publisher","first-page":"385","DOI":"10.1002\/mmce.1046","article-title":"Average power handling capability of multilayer microstrip lines","volume":"11,","author":"Bahl","year":"2001","journal-title":"International Journal of RF and Microwave Computer-Aided Engineering"},{"key":"2026062506564072200_bib2","doi-asserted-by":"publisher","first-page":"2100436","DOI":"10.1002\/masy.202100436","article-title":"Accurate closed form expressions for conductor loss and dielectric loss in thin film microstrip line","volume":"407,","author":"Bansal","year":"2023","journal-title":"Macromolecular Symposia"},{"key":"2026062506564072200_bib3","doi-asserted-by":"publisher","first-page":"118293","DOI":"10.1016\/j.cma.2025.118293","article-title":"Multiphysics modeling of hydrogels with a maximum-entropy-based meshless framework","volume":"446,","author":"Castillo-Acuna","year":"2025","journal-title":"Computer Methods in Applied Mechanics and Engineering"},{"key":"2026062506564072200_bib4","doi-asserted-by":"publisher","first-page":"51","DOI":"10.1080\/02533839.2017.1410449","article-title":"Thermal-fluid and electromagnetic coupling analysis and test of a traction motor for electric vehicles","volume":"41,","author":"Chang","year":"2018","journal-title":"Journal of the Chinese Institute of Engineers"},{"key":"2026062506564072200_bib5","doi-asserted-by":"publisher","first-page":"513","DOI":"10.1016\/j.apm.2023.03.009","article-title":"Nonlinear dynamics and thermal bidirectional coupling characteristics of a rotor-ball bearing system","volume":"119","author":"Chang","year":"2023","journal-title":"Applied Mathematical Modelling"},{"key":"2026062506564072200_bib6","doi-asserted-by":"publisher","first-page":"38","DOI":"10.1016\/j.microrel.2017.10.003","article-title":"Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate","volume":"79","author":"Chen","year":"2017","journal-title":"Microelectronics Reliability"},{"key":"2026062506564072200_bib7","doi-asserted-by":"publisher","first-page":"241","DOI":"10.1109\/TDMR.2023.3249771","article-title":"Reliability of VO2-based mmWave switches under 100 million thermal cycles","volume":"23,","author":"Chen","year":"2023","journal-title":"IEEE Transactions on Device and Materials Reliability"},{"key":"2026062506564072200_bib8","doi-asserted-by":"publisher","first-page":"283","DOI":"10.1093\/jcde\/qwae104","article-title":"Electromagnetic-thermal-mechanical coupling analysis of bent rotor straightening via electromagnetic induction heating","volume":"11,","author":"Cho","year":"2024","journal-title":"Journal of Computational Design and Engineering"},{"key":"2026062506564072200_bib9","doi-asserted-by":"publisher","first-page":"335","DOI":"10.1109\/TTHZ.2019.2910511","article-title":"A transmitter system-in-package at 300 GHz with an off-chip antenna and GaAs-based MMICs","volume":"9,","author":"Dyck","year":"2019","journal-title":"IEEE Transactions on Terahertz Science and Technology"},{"key":"2026062506564072200_bib10","doi-asserted-by":"publisher","first-page":"Article 114851","DOI":"10.1016\/j.sna.2023.114851","article-title":"Thermal characteristics analysis of a new compound electromagnetic linear actuator based on multi-physical coupling method","volume":"365","author":"Fan","year":"2024","journal-title":"Sensors and Actuators A-Physical"},{"key":"2026062506564072200_bib11","doi-asserted-by":"publisher","first-page":"306","DOI":"10.3233\/JAE-230428","article-title":"Collaborative optimization of multi-physical fields for composite electromagnetic linear actuators","volume":"76,","author":"Fan","year":"2024","journal-title":"International Journal of Applied Electromagnetics and Mechanics"},{"key":"2026062506564072200_bib12","doi-asserted-by":"publisher","first-page":"1087","DOI":"10.1007\/s00466-021-02131-0","article-title":"An FE-DMN method for the multiscale analysis of thermomechanical composites","volume":"69,","author":"Gajek","year":"2022","journal-title":"Computational Mechanics"},{"key":"2026062506564072200_bib13","doi-asserted-by":"publisher","first-page":"60","DOI":"10.1093\/jcde\/qwae066","article-title":"Automated design and optimization of distributed filter circuits using reinforcement learning","volume":"11","author":"Gao","year":"2024","journal-title":"Journal of Computational Design and Engineering"},{"key":"2026062506564072200_bib14","doi-asserted-by":"publisher","first-page":"Article 120165","DOI":"10.1016\/j.ijheatmasstransfer.2020.120165","article-title":"Thermal conductivity of silicon at elevated temperature: Role of four-phonon scattering and electronic heat conduction","volume":"160","author":"Gu","year":"2020","journal-title":"International Journal of Heat and Mass Transfer"},{"key":"2026062506564072200_bib15","volume-title":"Physical Properties of Inorganic Materials","author":"Guan","year":"2011","edition":"2nd ed."},{"key":"2026062506564072200_bib16","doi-asserted-by":"publisher","first-page":"1217","DOI":"10.1109\/PIERS59004.2023.10221539","article-title":"Electromagnetic-thermal-stress multiphysics simulation of microwave filter","volume-title":"Proceedings of the 2023 Photonics & Electromagnetics Research Symposium (PIERS)","author":"Jia","year":"2023"},{"key":"2026062506564072200_bib17","doi-asserted-by":"publisher","first-page":"Article 8102705","DOI":"10.1109\/TMAG.2017.2760928","article-title":"Electromagnetic-thermal-fluidic analysis of permanent magnet synchronous machine by bidirectional method","volume":"54,","author":"Jiang","year":"2018","journal-title":"IEEE Transactions on Magnetics"},{"key":"2026062506564072200_bib18","doi-asserted-by":"publisher","first-page":"3995","DOI":"10.1109\/TMTT.2006.883655","article-title":"Measurements of permittivity, dieletric loss tangent, and resistivity of float-zone silicon at microwave frequencies","volume":"54,","author":"Krupka","year":"2006","journal-title":"IEEE Transactions on Microwave Theory and Techniques"},{"key":"2026062506564072200_bib19","doi-asserted-by":"publisher","first-page":"51","DOI":"10.1093\/jcde\/qwaf094","article-title":"Imbalance-aware deep surrogate modeling in structural and thermal response prediction","volume":"12,","author":"Lee","year":"2025","journal-title":"Journal of Computational Design and Engineering"},{"key":"2026062506564072200_bib20","doi-asserted-by":"publisher","first-page":"Article 115345","DOI":"10.1016\/j.microrel.2024.115345","article-title":"Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors","volume":"154","author":"Li","year":"2024","journal-title":"Microelectronics Reliability"},{"key":"2026062506564072200_bib21","doi-asserted-by":"publisher","first-page":"128386","DOI":"10.1016\/j.applthermaleng.2025.128386","article-title":"Coordinative multiphysical field variation of titanium alloy melt processed by electromagnetic levitation coupled with die casting","volume":"280,","author":"Li","year":"2025","journal-title":"Applied Thermal Engineering"},{"key":"2026062506564072200_bib22","doi-asserted-by":"publisher","first-page":"263","DOI":"10.1109\/TUFFC.2024.3522109","article-title":"Generalized multiphysical fields coupled model of SAW resonators: From methodology to applications","volume":"72,","author":"Li","year":"2025","journal-title":"IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control"},{"key":"2026062506564072200_bib23","doi-asserted-by":"publisher","first-page":"541","DOI":"10.1139\/tcsme-2022-0010","article-title":"Bidirectional electromagnetic-thermal coupling analysis for permanent magnet traction motors under complex operating conditions","volume":"46,","author":"Li","year":"2022","journal-title":"Transactions of the Canadian Society for Mechanical Engineering"},{"key":"2026062506564072200_bib24","doi-asserted-by":"publisher","first-page":"Article 022017","DOI":"10.1063\/5.0253246","article-title":"Non-fourier electrothermal fully coupled analysis of a 5 nm gate-all-around field-effect transistor based on density gradient theory","volume":"37","author":"Liu","year":"2025","journal-title":"Physics of Fluids"},{"key":"2026062506564072200_bib25","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/ICEPT63120.2024.10668486","article-title":"Thermo-mechanical reliability of micro-joints in a RF packaging with through glass via (TGV) interposer","volume-title":"Proceedings of the 2024 25th International Conference on Electronic Packaging Technology (ICEPT)","author":"Lu","year":"2024"},{"key":"2026062506564072200_bib26","doi-asserted-by":"publisher","first-page":"1769","DOI":"10.1109\/TVLSI.2024.3430498","article-title":"An electrical-thermal co-simulation model of chiplet heterogeneous integration systems","volume":"32,","author":"Ma","year":"2024","journal-title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems"},{"key":"2026062506564072200_bib27","doi-asserted-by":"publisher","first-page":"156","DOI":"10.1016\/j.ijsolstr.2017.09.003","article-title":"Effect of thermomechanical loading on fracture properties of brittle, materials: A fully-coupled transient thermoelastic analysis using a lattice approach","volume":"129","author":"Mohammadipour","year":"2017","journal-title":"International Journal of Solids and Structures"},{"key":"2026062506564072200_bib28","doi-asserted-by":"publisher","first-page":"Article 045202","DOI":"10.1103\/PhysRevB.106.045202","article-title":"Temperature-dependent dielectric function of intrinsic silicon: Analytic models and atom-surface potentials","volume":"106,","author":"Moore","year":"2022","journal-title":"Physical Review B"},{"key":"2026062506564072200_bib29","doi-asserted-by":"publisher","first-page":"618","DOI":"10.1016\/j.jmrt.2024.06.106","article-title":"Thermal-mechanical evolution behaviors of metal matrix diamond composite by powder bed fusion-laser beam","volume":"31","author":"Peng","year":"2024","journal-title":"Journal of Materials Research and Technology"},{"key":"2026062506564072200_bib30","volume-title":"Microwave Engineering","author":"Pozar","year":"2005","edition":"3rd ed."},{"key":"2026062506564072200_bib31","doi-asserted-by":"publisher","first-page":"Article 8401205","DOI":"10.1109\/TMAG.2021.3062365","article-title":"Field-circuit coupling and electromagnetic-thermal-mechanical coupling analysis of the single-stage fast linear transformer driver using time-domain finite integration technique","volume":"57","author":"Qiu","year":"2021","journal-title":"IEEE Transactions on Magnetics"},{"key":"2026062506564072200_bib32","doi-asserted-by":"publisher","first-page":"7988","DOI":"10.3390\/s91007988","article-title":"A coupled field multiphysics modeling approach to investigate RF MEMS switch failure modes under various operational conditions","volume":"9","author":"Sadek","year":"2009","journal-title":"Sensors"},{"key":"2026062506564072200_bib33","doi-asserted-by":"publisher","first-page":"1115","DOI":"10.1093\/jcde\/qwab035","article-title":"Novel welding distortion analysis method for large welded structures using orthotropic thermal expansion coefficients","volume":"8,","author":"Seo","year":"2021","journal-title":"Journal of Computational Design and Engineering"},{"key":"2026062506564072200_bib34","doi-asserted-by":"publisher","first-page":"297","DOI":"10.1109\/TCPMT.2022.3145377","article-title":"Thermal and mechanical characterization of 2.5-D and fan-out chip on substrate chip-first and chip-last packages","volume":"12,","author":"Shih","year":"2022","journal-title":"IEEE Transactions on Components, Packaging and Manufacturing Technology"},{"key":"2026062506564072200_bib35","doi-asserted-by":"publisher","first-page":"168928","DOI":"10.1016\/j.cej.2025.168928","article-title":"Multiphysics coupled modelling of a tube-plate-type packed-bed reactor for CaO\/Ca(OH)2 thermochemical energy storage operated in \u2018electricity-in-steam-out\u2019 mode","volume":"524","author":"Wang","year":"2025","journal-title":"Chemical Engineering Journal"},{"key":"2026062506564072200_bib36","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/ICEPT63120.2024.10668627","article-title":"Coupling characteristics of BGA solder balls at high frequencies: A simulation study on electromagnetic-thermal-mechanical interactions considering skin and proximity effects","volume-title":"Proceedings of the 2024 25th International Conference on Electronic Packaging Technology (ICEPT)","author":"Wang","year":"2024"},{"key":"2026062506564072200_bib37","doi-asserted-by":"publisher","first-page":"Article 121605","DOI":"10.1016\/j.applthermaleng.2023.121605","article-title":"An equivalent winding thermal model considering fill factor and void ratio for multiphysics coupling analysis of permanent magnet linear motors","volume-title":"Applied Thermal Engineering","author":"Wang","year":"2024"},{"key":"2026062506564072200_bib38","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1109\/ICEPT52650.2021.9567969","article-title":"Investigation of the RDL reliability based on RF characterization","volume-title":"Proceedings of the 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)","author":"Wang","year":"2021"},{"key":"2026062506564072200_bib39","doi-asserted-by":"publisher","first-page":"Article 3079","DOI":"10.3390\/en13123079","article-title":"Bidirectional coupling model of electromagnetic field and thermal field applied to the thermal analysis of the FSPM machine","volume":"13,","author":"Wang","year":"2020","journal-title":"Energies"},{"key":"2026062506564072200_bib40","doi-asserted-by":"publisher","first-page":"269","DOI":"10.1093\/jcde\/qwae024","article-title":"GPU parallel computation strategy for electrothermal coupling problems using improved assembly-free FEM","volume":"11,","author":"Wu","year":"2024","journal-title":"Journal of Computational Design and Engineering"},{"key":"2026062506564072200_bib41","doi-asserted-by":"publisher","first-page":"1","DOI":"10.23919\/ACES-China60289.2023.10249452","article-title":"Electromagnetic-thermal-stress multiphysics simulation of microwave amplifier","volume-title":"Proceedings of the 2023 International Applied Computational Electromagnetics Society Symposium (ACES-China)","author":"Wu","year":"2023"},{"key":"2026062506564072200_bib42","doi-asserted-by":"publisher","first-page":"760","DOI":"10.1109\/TCPMT.2022.3171548","article-title":"Average power handling capability of microstrip lines considering heat convection and self-heating effects with temperature-dependent resistivity","volume":"12,","author":"Xiao","year":"2022","journal-title":"IEEE Transactions on Components, Packaging and Manufacturing Technology"},{"key":"2026062506564072200_bib43","doi-asserted-by":"publisher","first-page":"Article 172689","DOI":"10.1016\/j.jmmm.2024.172689","article-title":"Loss calculation and temperature prediction method for high-speed amorphous alloy PMSM considering the coupling effect of multi-physical field factors","volume":"614","author":"Xu","year":"2025","journal-title":"Journal of Magnetism and Magnetic Materials"},{"key":"2026062506564072200_bib44","doi-asserted-by":"publisher","first-page":"Article 104012","DOI":"10.1016\/j.csite.2024.104012","article-title":"Research on magnetic-fluid-thermal-stress multi-field bidirectional coupling of high speed permanent magnet synchronous motors","volume":"54","author":"Xu","year":"2024","journal-title":"Case Studies in Thermal Engineering"},{"key":"2026062506564072200_bib45","doi-asserted-by":"publisher","first-page":"475","DOI":"10.1007\/s12239-024-00155-y","article-title":"Multi-physical field coupling analysis of flat wire motor","volume":"26,","author":"Yan","year":"2025","journal-title":"International Journal of Automotive Technology"},{"key":"2026062506564072200_bib46","doi-asserted-by":"publisher","first-page":"Article 166","DOI":"10.3390\/mi13020166","article-title":"Modeling and measurement of thermal-mechanical-stress-creep effect for RF MEMS switch up to 200\u00b0C","volume":"13,","author":"Zhang","year":"2022","journal-title":"Micromachines"},{"key":"2026062506564072200_bib47","doi-asserted-by":"publisher","first-page":"1703","DOI":"10.1109\/TCPMT.2023.3304888","article-title":"Compact modeling for average power handling capabilities of symmetric and asymmetric striplines","volume":"13,","author":"Zheng","year":"2023","journal-title":"IEEE Transactions on Components, Packaging and Manufacturing Technology"}],"container-title":["Journal of Computational Design and Engineering"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/academic.oup.com\/jcde\/advance-article-pdf\/doi\/10.1093\/jcde\/qwag054\/68494934\/qwag054.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"https:\/\/academic.oup.com\/jcde\/article-pdf\/13\/6\/159\/68494934\/qwag054.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/academic.oup.com\/jcde\/article-pdf\/13\/6\/159\/68494934\/qwag054.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,25]],"date-time":"2026-06-25T10:56:50Z","timestamp":1782385010000},"score":1,"resource":{"primary":{"URL":"https:\/\/academic.oup.com\/jcde\/article\/13\/6\/159\/8704493"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,6]]},"references-count":47,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2026,6,4]]}},"URL":"https:\/\/doi.org\/10.1093\/jcde\/qwag054","relation":{},"ISSN":["2288-5048"],"issn-type":[{"value":"2288-5048","type":"electronic"}],"subject":[],"published-other":{"date-parts":[[2026,6]]},"published":{"date-parts":[[2026,6]]}}}