{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T16:21:21Z","timestamp":1783009281105,"version":"3.54.5"},"reference-count":32,"publisher":"Oxford University Press (OUP)","issue":"12","license":[{"start":{"date-parts":[[2026,5,20]],"date-time":"2026-05-20T00:00:00Z","timestamp":1779235200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003453","name":"Natural Science Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2024A1515012366"],"award-info":[{"award-number":["2024A1515012366"]}],"id":[{"id":"10.13039\/501100003453","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,6,11]]},"abstract":"<jats:title>ABSTRACT<\/jats:title>\n                  <jats:p>Implantable electronics often adopt non-planar electrodes to resolve the conflict between conductivity and deformability. Encapsulation of these electrodes becomes a critical challenge for conventional elastic seals due to the elastic-contact-induced interfacial voids and consequential fluid ingress. Here, we present a viscoplastic interlayer that can adapt to the three-dimensional structures of non-planar electrodes, resulting in intimate contact and hermetic encapsulation. This interlayer is a polymeric composite that consists of a long-chain polyisobutylene as the matrix, a short-chain polyisobutylene as the plasticizer, and maleic anhydride-grafted polypropylene as the foreign domains. Its viscoplasticity originates from the chain slippage and permanent disentanglement of the long-chain polyisobutylene, promoted by the plasticizers and confining domains, respectively. When synergized with covalent bonding, the interlayer derives defect-free interfaces between the sealing elastomer and various non-planar electrodes, such as microwires, micropillars, and serpentine electrodes. This intimate encapsulation stabilizes the signal-to-noise ratio of an electromechanical device for 50 weeks in acidic, neutral, and alkaline solutions and extends the in vivo duration of signal fidelity for stretchable bioelectronics to a record of 45 weeks. This viscoplastic interlayer provides fruitful implications for improving the long-term stability of implantable bioelectronics.<\/jats:p>","DOI":"10.1093\/nsr\/nwag297","type":"journal-article","created":{"date-parts":[[2026,5,19]],"date-time":"2026-05-19T11:38:14Z","timestamp":1779190694000},"source":"Crossref","is-referenced-by-count":0,"title":["Intimate encapsulation of non-planar electrodes via a viscoplastic interlayer"],"prefix":"10.1093","volume":"13","author":[{"given":"Liqian","family":"Liu","sequence":"first","affiliation":[{"name":"Southern University of Science and Technology Department of Materials Science and Engineering, , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinyue","family":"Xiang","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology Department of Materials Science and Engineering, , Shenzhen 518055 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Technology Department of Materials Science and Engineering, , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingjia","family":"Li","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology Department of Materials Science and Engineering, , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fuzeng","family":"Ren","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology Department of Materials Science and Engineering, , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shiming","family":"Zhang","sequence":"additional","affiliation":[{"name":"The University of Hong Kong Department of Electrical and Electronic Engineering, , Hong Kong 999077 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4513-3117","authenticated-orcid":false,"given":"Chuanfei","family":"Guo","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology Department of Materials Science and Engineering, , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2494-3006","authenticated-orcid":false,"given":"Yanhao","family":"Yu","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology Department of Materials Science and Engineering, , Shenzhen 518055 ,","place":["China"]},{"name":"Institute of Innovative Materials, Guangdong Provincial Key Laboratory of Sustainable Biomimetic Materials and Green Energy, Southern University of Science and Technology , Shenzhen 518055 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