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The platform exhibits low flip-chip bonding loss and low inter-channel crosstalk over a broad bandwidth up to 50\u00a0GHz. Leveraging this packaging platform, we demonstrate high-speed electrical interfacing with two proof-of-concept TFLN photonic circuits, namely a 2\u00a0\u00d7\u00a08 optical switch and an electro-optic comb-based transmitter. The switch achieves arbitrary 8-channel routing with \u223c3\u00a0dB insertion loss, &amp;lt;\u221220\u00a0dB crosstalk, and an equipment-limited switching time of \u226434\u00a0ps. The transmitter circuit includes a 50\u00a0GHz electro-optic comb generator with 2.8-dB flatness, a tunable microring to arbitrarily filter one comb line, and a modulator for data transmission at 20 Gbit\/s. The packaging platform could significantly advance large-scale TFLN circuits in optical communications, microwave photonics, and photonic computing.<\/jats:p>","DOI":"10.1093\/nsr\/nwag480","type":"journal-article","created":{"date-parts":[[2026,8,9]],"date-time":"2026-08-09T11:33:49Z","timestamp":1786275229000},"source":"Crossref","is-referenced-by-count":1,"title":["Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic 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