{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,22]],"date-time":"2026-08-22T13:23:12Z","timestamp":1787404992143,"version":"3.56.0"},"reference-count":0,"publisher":"Oxford University Press (OUP)","license":[{"start":{"date-parts":[[2026,8,22]],"date-time":"2026-08-22T00:00:00Z","timestamp":1787356800000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"abstract":"<jats:title>Abstract<\/jats:title>\n                  <jats:p>Temperature-control materials, notably composite phase-change materials (CPCMs), show great potential for the thermal management of next-generation power electronics. However, the synergistic optimization of multiple performance metrics still relies heavily on Edisonian trial-and-error experimentation. Herein, we present an artificial intelligence framework that incorporates a physics-constrained inverse-design system (PHICS) built upon a directed acyclic graph (DAG) architecture for CPCMs, integrating interface, phase, and carrier engineering. By encoding structural hierarchies and physical causality through DAG, PHICS framework couples forward predictive modeling with a diversity-enhanced NSGA-II optimizer to efficiently map Pareto-optimal design boundaries. Guided by these predictions, we successfully fabricate a high-performance CPCM composed of an oriented graphite fiber skeleton and an n-octacosane matrix with amorphous alumina (am-Al2O3) interfacial transition layers. Benefiting from the bifunctional role of the am-Al2O3 interlayer as both an interfacial phonon bridge and electron barrier, the resulting CPCMs achieve a superior balance of thermal conduction, thermal storage, and electrical insulation. These results demonstrate the accuracy of PHICS-guided multifunctional composite design, establishing a closed-loop platform that combines physics-constrained machine learning with experimental validation to solve key thermal\u2013electrical trade-offs.<\/jats:p>","DOI":"10.1093\/nsr\/nwag503","type":"journal-article","created":{"date-parts":[[2026,8,22]],"date-time":"2026-08-22T11:44:42Z","timestamp":1787399082000},"source":"Crossref","is-referenced-by-count":0,"title":["Multi-objective and cross-scale inverse design of temperature-control materials\n                    <i>via<\/i>\n                    physics-constrained machine learning"],"prefix":"10.1093","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-9546-4265","authenticated-orcid":false,"given":"Dongliang","family":"Ding","sequence":"first","affiliation":[{"name":"The Chinese University of Hong Kong Department of Electronics Engineering, , Hong Kong 999077 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Minhao","family":"Zou","sequence":"additional","affiliation":[{"name":"Advanced Institute of Information Technology, School of Computer Science, Peking University , Beijing 100871 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ruoyu","family":"Huang","sequence":"additional","affiliation":[{"name":"College of Physical Science and Technology, Xiamen University , Xiamen 361000 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ting","family":"Liang","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong Department of Electronics Engineering, , Hong Kong 999077 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hang","family":"Shi","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ke","family":"Xu","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong Department of Electronics Engineering, , Hong Kong 999077 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chunyu","family":"Wong","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong Department of Electronics Engineering, , Hong Kong 999077 ,","place":["China"]},{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanhui","family":"Chen","sequence":"additional","affiliation":[{"name":"Ningbo Institute of Northwestern Polytechnical University , Ningbo 315103 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Meng","family":"Han","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Linfeng","family":"Yu","sequence":"additional","affiliation":[{"name":"College of Mechanical and Vehicle Engineering, Hunan University , Changsha 410082 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guoxian","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Shaanxi University of Technology , Hanzhong 723001 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yangbo","family":"Chen","sequence":"additional","affiliation":[{"name":"College of Physical Science and Technology, Xiamen University , Xiamen 361000 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yimin","family":"Yao","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xueao","family":"Zhang","sequence":"additional","affiliation":[{"name":"College of Physical Science and Technology, Xiamen University , Xiamen 361000 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanguang","family":"Zhou","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology Department of Mechanical and Aerospace Engineering, , Hong Kong 999077 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chengyi","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Metal Matrix, Composites School of Materials Science and Engineering, Shanghai Jiao Tong University , Shanghai 200240 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoliang","family":"Zeng","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055 ,","place":["China"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yijie","family":"Peng","sequence":"additional","affiliation":[{"name":"Advanced Institute of Information Technology, School of Computer Science, Peking University , Beijing 100871 ,","place":["China"]},{"name":"Institute for Artificial Intelligence, Peking University , Beijing 100871 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