{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:27:57Z","timestamp":1781846877848,"version":"3.54.5"},"reference-count":16,"publisher":"The Royal Society","issue":"6","license":[{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/royalsociety.org\/journals\/ethics-policies\/data-sharing-mining\/"}],"content-domain":{"domain":["royalsocietypublishing.org"],"crossmark-restriction":true},"short-container-title":["R. Soc. open sci."],"published-print":{"date-parts":[[2023,6]]},"abstract":"<jats:p>\n            A nano-sized silver-coated tin (Sn@Ag) slurry was prepared by heterogeneous flocculation method by adjusting the pH value of solution and selecting different dispersants. The slurry improved the oxidation resistance of tin and its dispersibility in silver matrix. The sintering strength of nanometre Sn@Ag slurry increases with the increase of Sn content. When the Sn content reaches 5%, the shear strength of the joint reaches the highest 50 MPa, which is more than 10 MPa higher than that of the pure nanometre silver slurry sintered joint. The increase of shear strength is due to the fact that the equilibrium phase formed after sintering is Ag\u2013Sn replacement solid solution and intermetallic compound Ag\n            <jats:sub>3<\/jats:sub>\n            Sn, which have the effect of replacement solution strengthening and dispersion strengthening, respectively. It is proved by experiments and analysis that the application of nano-silver paste in chip interconnection is feasible. The research of this subject provides experimental reference and theoretical basis for the application of new generation interconnect materials in power devices and promotes the development of microelectronics packaging technology.\n          <\/jats:p>","DOI":"10.1098\/rsos.221492","type":"journal-article","created":{"date-parts":[[2023,6,7]],"date-time":"2023-06-07T07:28:37Z","timestamp":1686122917000},"update-policy":"https:\/\/doi.org\/10.1098\/crossmark-policy","source":"Crossref","is-referenced-by-count":5,"title":["Study on preparation and sintering properties of nano-silver-coated tin slurry"],"prefix":"10.1098","volume":"10","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6512-4045","authenticated-orcid":true,"given":"Hui","family":"Yang","sequence":"first","affiliation":[{"name":"Education Department of Guangxi Zhuang Autonomous Region, Key Laboratory of Advanced Manufacturing and Automation Technology (Guilin University of Technology), Guilin 541006, People's Republic of China"},{"name":"College of Mechanical and Control Engineering, Guilin University of Technology, Guilin 541006, People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Huan","family":"You","sequence":"additional","affiliation":[{"name":"College of Mechanical and Control Engineering, Guilin University of Technology, Guilin 541006, People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"175","published-online":{"date-parts":[[2023,6,7]]},"reference":[{"key":"e_1_3_5_2_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2019.138051"},{"key":"e_1_3_5_3_2","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-007-9373-7"},{"key":"e_1_3_5_4_2","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-017-5822-0"},{"key":"e_1_3_5_5_2","first-page":"317","article-title":"Study on low temperature non-pressure sintering bonding of nano-silver slurry for electronic packaging","volume":"11","author":"Wang S","year":"2012","unstructured":"Wang S, Ji HJ, Li MY et al. 2012 Study on low temperature non-pressure sintering bonding of nano-silver slurry for electronic packaging. Electron. Process Technol. 11, 317-319.","journal-title":"Electron. Process Technol."},{"key":"e_1_3_5_6_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2016.02.082"},{"key":"e_1_3_5_7_2","volume-title":"Application principle of surfactant","author":"Xiao JX","year":"2003","unstructured":"Xiao JX, Zhao ZG. 2003 Application principle of surfactant, p. 435. Beijing, China: Chemical Industry Press."},{"key":"e_1_3_5_8_2","doi-asserted-by":"publisher","DOI":"10.1039\/C9NR10980C"},{"key":"e_1_3_5_9_2","unstructured":"Liu ZH. 2019 Research on technology optimization of chip interconnection by silver slurry sintering. Master's thesis Central South University Changsha Hunan China."},{"key":"e_1_3_5_10_2","doi-asserted-by":"publisher","DOI":"10.1021\/acs.jpcc.1c02303"},{"key":"e_1_3_5_11_2","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevMaterials.3.074007"},{"key":"e_1_3_5_12_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.carbon.2020.01.057"},{"key":"e_1_3_5_13_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.isci.2022.103898"},{"key":"e_1_3_5_14_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2014.10.123"},{"key":"e_1_3_5_15_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2015.05.075"},{"key":"e_1_3_5_16_2","first-page":"363","article-title":"Effect of cooling rate on morphology and distribution of Ag3Sn intermetallic compounds in Sn-3.5Ag solder","volume":"3","author":"Cunji P","year":"2014","unstructured":"Cunji P, Xie M, Wenjia D, Liguang Z, Yang Y, Jiming Z. 2014 Effect of cooling rate on morphology and distribution of Ag3Sn intermetallic compounds in Sn-3.5Ag solder. Rare Met. 3, 363-370.","journal-title":"Rare Met."},{"key":"e_1_3_5_17_2","first-page":"28","article-title":"Function and mechanism of elements tin and indium in silver base filler metal","volume":"11","author":"Xue SB","year":"1998","unstructured":"Xue SB, Qian YY, Hu XP. 1998 Function and mechanism of elements tin and indium in silver base filler metal. Welding 11, 28-31.","journal-title":"Welding"}],"container-title":["Royal Society Open Science"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/royalsocietypublishing.org\/doi\/pdf\/10.1098\/rsos.221492","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/royalsocietypublishing.org\/doi\/full-xml\/10.1098\/rsos.221492","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/royalsocietypublishing.org\/doi\/pdf\/10.1098\/rsos.221492","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,7]],"date-time":"2023-06-07T07:28:44Z","timestamp":1686122924000},"score":1,"resource":{"primary":{"URL":"https:\/\/royalsocietypublishing.org\/doi\/10.1098\/rsos.221492"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6]]},"references-count":16,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2023,6]]}},"alternative-id":["10.1098\/rsos.221492"],"URL":"https:\/\/doi.org\/10.1098\/rsos.221492","relation":{},"ISSN":["2054-5703"],"issn-type":[{"value":"2054-5703","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,6]]},"assertion":[{"value":"2022-12-03","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2023-04-21","order":1,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2023-06-07","order":2,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"221492"}}