{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T09:52:24Z","timestamp":1740131544572,"version":"3.37.3"},"reference-count":26,"publisher":"International Union of Crystallography (IUCr)","issue":"5","license":[{"start":{"date-parts":[[2019,8,23]],"date-time":"2019-08-23T00:00:00Z","timestamp":1566518400000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/journals.iucr.org\/services\/copyrightpolicy.html"},{"start":{"date-parts":[[2019,8,23]],"date-time":"2019-08-23T00:00:00Z","timestamp":1566518400000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/journals.iucr.org\/services\/copyrightpolicy.html#TDM"}],"funder":[{"DOI":"10.13039\/501100002322","name":"Coordena\u00e7\u00e3o de Aperfei\u00e7oamento de Pessoal de N\u00edvel Superior","doi-asserted-by":"publisher","award":["88882.143464\/2017-01"],"award-info":[{"award-number":["88882.143464\/2017-01"]}],"id":[{"id":"10.13039\/501100002322","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["iucr.org","wiley.com","iucrj.org"],"crossmark-restriction":true},"short-container-title":["J Synchrotron Rad","J Synchrotron Radiat"],"accepted":{"date-parts":[[2019,6,6]]},"published-print":{"date-parts":[[2019,9,1]]},"abstract":"<jats:p>At the Brazilian Synchrotron Light Laboratory (LNLS), new double-crystal monochromators are under development for use at the new Brazilian fourth-generation synchrotron, Sirius. The soldering technique used for the double-crystal monochromators ensures the union of monocrystalline silicon with FeNi alloy, Invar36 (64Fe\u201336Ni) from Grupo Metal and Invar39 (61Fe\u201339Fe) from Scientific Alloys, through SnSb (92.8Sn\u20137.2Sb), SnCu (Sn\u20130.3Cu) and SnBiCu (Sn\u20131.4Bi\u20130.7Cu) alloys from Nihon Superior. Following soldering tests and quantitative analysis, the Invar39\/SnBiCu\/Si samples were selected using base materials coated with different depositions \u2013 gold and copper. X-ray diffraction identified the formation of intermetallic compounds, such as AuSn<jats:sub>2<\/jats:sub> and AuSn<jats:sub>4<\/jats:sub> in base materials coated with gold and Cu<jats:sub>3<\/jats:sub>Sn and Cu<jats:sub>6<\/jats:sub>Sn<jats:sub>5<\/jats:sub> with copper. Before thermal cycling, the average force obtained in shear tests was 1131\u2005N with copper deposition and 499\u2005N with gold deposition. After five consecutive thermal cycles from room temperature down to cryogenic temperature (\u2212196.15\u00b0C), specimens with gold deposition presented cracks in the interface region and those with copper deposition showed no defects. Based on this, qualitative and semi-quantitative analyses of specimens with copper deposition were carried out by scanning electron microscopy and energy-dispersive spectroscopy techniques to identify the composition, distribution and morphology of the elements.<\/jats:p>","DOI":"10.1107\/s1600577519008191","type":"journal-article","created":{"date-parts":[[2019,8,23]],"date-time":"2019-08-23T15:20:43Z","timestamp":1566573643000},"page":"1565-1571","update-policy":"https:\/\/doi.org\/10.1107\/cm_01","source":"Crossref","is-referenced-by-count":0,"title":["Soldering of silicon to Invar for double-crystal monochromators"],"prefix":"10.1107","volume":"26","author":[{"given":"Mayara Maria Beltani","family":"Auricchio","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6150-9674","authenticated-orcid":true,"given":"Paulo Roberto","family":"Mei","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Osmar Roberto","family":"Bagnato","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"329","published-online":{"date-parts":[[2019,8,23]]},"reference":[{"key":"ve5103_bb1","doi-asserted-by":"crossref","first-page":"1533","DOI":"10.1143\/JJAP.13.1533","volume":"13","author":"Akasaka","year":"1974","journal-title":"Jpn. 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ASTM International, West Conshohocken, PA, USA."},{"key":"ve5103_bb6","doi-asserted-by":"crossref","first-page":"176","DOI":"10.4028\/www.scientific.net\/DDF.389.176","volume":"389","author":"Auricchio","year":"2018","journal-title":"Defect Diffusion Forum"},{"key":"ve5103_bb7","doi-asserted-by":"crossref","first-page":"53","DOI":"10.1107\/S0909049500000650","volume":"7","author":"Bilderback","year":"2000","journal-title":"J. Synchrotron Rad."},{"key":"ve5103_bb8","unstructured":"Campen, D. G. V. (2001). Low Stress Soldering Invar to Silicon, pp. 1-16. Stanford Synchrotron Radiation Laboratory, Menlo Park, CA, USA."},{"key":"ve5103_bb9","unstructured":"Campen, D. G. V. (2011). Bonding Silicon to Invar for LN Cryogenic Manifold, pp. 1-12. Stanford Synchrotron Radiation Laboratory, Menlo Park, CA, USA."},{"key":"ve5103_bb10","unstructured":"Chakrabarti, D. J., Laughlin, D. E., Chen, S. W. & Chang, Y. A. (1991). Phase Diagrams of Binary Nickel Alloys, pp. 85-95. 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