{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,25]],"date-time":"2026-01-25T12:30:20Z","timestamp":1769344220290,"version":"3.49.0"},"reference-count":9,"publisher":"Emerald","issue":"6","license":[{"start":{"date-parts":[[2008,10,17]],"date-time":"2008-10-17T00:00:00Z","timestamp":1224201600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.emerald.com\/insight\/site-policies"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,10,17]]},"abstract":"Purpose<\/jats:title>The aim of this paper is to provide a new wafer prealigning robot for the photo\u2010etching facility during the manufacturing of IC products.<\/jats:p><\/jats:sec>Design\/methodology\/approach<\/jats:title>The shape center is measured by a reflection\u2010style laser sensor in the wafer's radial direction, and the position is measured by a penetration\u2010style laser sensor. A dynamic error compensation is applied to eliminate the radial runout and wobble of the rotary stage, which have effects on the measurement of the wafer's shape center.<\/jats:p><\/jats:sec>Findings<\/jats:title>It is found that the new wafer prealigning robot can satisfy the accuracy requirement.<\/jats:p><\/jats:sec>Research limitations\/implications<\/jats:title>The robot requires that the shape center can be accurately calculated.<\/jats:p><\/jats:sec>Practical implications<\/jats:title>The robot is applicable to wafer prealigning for the photo\u2010etching facility.<\/jats:p><\/jats:sec>Originality\/value<\/jats:title>A wafer prealigning robot based on the shape center calculation method has been developed and is described in the paper.<\/jats:p><\/jats:sec>","DOI":"10.1108\/01439910810909538","type":"journal-article","created":{"date-parts":[[2008,11,1]],"date-time":"2008-11-01T08:08:01Z","timestamp":1225526881000},"page":"536-540","source":"Crossref","is-referenced-by-count":4,"title":["Wafer prealigning robot based on shape center calculation"],"prefix":"10.1108","volume":"35","author":[{"given":"Z.","family":"Fu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.X.","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.Q.","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.Z.","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Q.X.","family":"Cao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"140","reference":[{"key":"key2022020920293516900_b8","doi-asserted-by":"crossref","unstructured":"Beaulieu, D.R. (1987), \u201cDark field technology a practical approach to local alignment\u201d, SPIE, Vol. 7 No. 72, pp. 100\u201042.","DOI":"10.1117\/12.967043"},{"key":"key2022020920293516900_b2","unstructured":"Blaine, R., William, A. and James, V. (2004), \u201cHigh precision substrate prealigner\u201d, United States Patent, US6836690, 10\/199, p. 278."},{"key":"key2022020920293516900_b9","doi-asserted-by":"crossref","unstructured":"Fu, Z., Huang, C.X., Liu, R.Q., Chen, Z.P., Zhao, Y.Z. and Cao, Q.X. (2007), \u201cA new wafer prealigner\u201d, Lecture Notes in Control and Information Sciences, Springer, New York, NY, pp. 501\u20108.","DOI":"10.1007\/978-3-540-73374-4_59"},{"key":"key2022020920293516900_b3","unstructured":"Kung, C. (2005), \u201cWafer aligner\u201d, United States Patent, US6932558, 10\/190, p. 111."},{"key":"key2022020920293516900_b4","doi-asserted-by":"crossref","unstructured":"Lee, H\u2010S., Jeon, J.W. and Kimb, J\u2010W. (2003), \u201cA 12\u2010inch wafer prealigner\u201d, Microprocessors and Microsystems, Vol. 27 No. 4, pp. 151\u20108.","DOI":"10.1016\/S0141-9331(02)00105-9"},{"key":"key2022020920293516900_b6","unstructured":"Song, Y.X., Li, S.C. and Zhao, Y.N. (2006), \u201cThe pre\u2010align control method of a wafer\u201d, Patent of China, 200510116695.06."},{"key":"key2022020920293516900_b1","unstructured":"Yang, X.P. (2003), \u201cThe edge detection and prealignment technology in the wafer loader system\u201d, Equipment for Electronic Products Manufacturing, Vol. 3 No. 112, pp. 34\u201047."},{"key":"key2022020920293516900_b5","unstructured":"Zhang, Q., Hu, S., Yao, H. and Liu, Y.Y. (2002), \u201cCurrent progress of optical lithography in ASML\u201d, Microfabrication Technology, Vol. 9 No. 3, pp. 8\u201011."},{"key":"key2022020920293516900_b7","doi-asserted-by":"crossref","unstructured":"Ziger, D.H. (2002), \u201cPeroux linear alignment correction algorithm for deep submicron lithography\u201d, SPIE, Vol. 468, pp. 1057\u201069.","DOI":"10.1117\/12.473434"}],"container-title":["Industrial Robot: An International Journal"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.emerald.com\/insight\/content\/doi\/10.1108\/01439910810909538\/full\/xml","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.emerald.com\/insight\/content\/doi\/10.1108\/01439910810909538\/full\/html","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,24]],"date-time":"2025-07-24T23:50:21Z","timestamp":1753401021000},"score":1,"resource":{"primary":{"URL":"http:\/\/www.emerald.com\/ir\/article\/35\/6\/536-540\/184622"}},"subtitle":[],"editor":[{"given":"David","family":"Sanders","sequence":"first","affiliation":[],"role":[{"role":"editor","vocabulary":"crossref"}]}],"short-title":[],"issued":{"date-parts":[[2008,10,17]]},"references-count":9,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2008,10,17]]}},"alternative-id":["10.1108\/01439910810909538"],"URL":"https:\/\/doi.org\/10.1108\/01439910810909538","relation":{},"ISSN":["0143-991X"],"issn-type":[{"value":"0143-991X","type":"print"}],"subject":[],"published":{"date-parts":[[2008,10,17]]}}}