{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T17:24:15Z","timestamp":1754155455532,"version":"3.41.2"},"reference-count":13,"publisher":"Emerald","issue":"5","license":[{"start":{"date-parts":[[2013,8,16]],"date-time":"2013-08-16T00:00:00Z","timestamp":1376611200000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.emeraldinsight.com\/page\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Industrial Robot"],"published-print":{"date-parts":[[2013,8,16]]},"DOI":"10.1108\/ir-09-2012-414","type":"journal-article","created":{"date-parts":[[2013,8,14]],"date-time":"2013-08-14T11:11:23Z","timestamp":1376478683000},"page":"425-432","source":"Crossref","is-referenced-by-count":1,"title":["Improving wafer handling performance in semiconductor manufacturing"],"prefix":"10.1108","volume":"40","author":[{"given":"Heping","family":"Chen","sequence":"first","affiliation":[]},{"given":"Hongtai","family":"Cheng","sequence":"additional","affiliation":[]},{"given":"Ben","family":"Mooring","sequence":"additional","affiliation":[]}],"member":"140","reference":[{"key":"b12","unstructured":"Chen, Y.C., Chen, Y.P. and Lee, J.Y. (2011a), \u201cA novel method for real\u2010time wafer positioning during transfer process\u201d,SICE Annual Conference 2011, Tokyo, Japan, September 13\u201018, pp. 1933\u20101937."},{"key":"b15","unstructured":"Chen, Y.C., Chen, Y.P. and Lee, J.Y. (2011b), \u201cImplementation of a wafer positioning system\u201d,SICE Annual Conference 2011, Tokyo, Japan, September 13\u201018, pp. 1938\u20101943."},{"key":"b13","unstructured":"Chen, Y.C., Chen, Y.P. and Lee, J.Y. (2012), \u201cExperimental results of a wafer positioning system using machine vision after system calibration\u201d,SICE Annual Conference 2012, Akita, Japan, August 20\u201023, pp. 1014\u20101017."},{"key":"b10","doi-asserted-by":"publisher","DOI":"10.3923\/itj.2007.1245.1251"},{"key":"b7","doi-asserted-by":"crossref","unstructured":"Cong, M., Yu, X., Chen, B. and Liu, J. (2007b), \u201cResearch on a novel R\u2010\u03b8 wafer\u2010handling robot\u201d,International Conference on Automation and Logistics, Jinan, China, October, pp. 597\u2010602.","DOI":"10.1109\/ICAL.2007.4338634"},{"key":"b3","doi-asserted-by":"crossref","unstructured":"Cong, M., Zhou, Y., Jiang, Y., Kang, R. and Guo, D. (2005), \u201cAn automated wafer handling system based on the integrated circuit equipments\u201d,International Conf. on Robotics and Biomimetics, Hong Kong and Macau, China, July, pp. 240\u2010245.","DOI":"10.1109\/ROBIO.2005.246270"},{"key":"b17","doi-asserted-by":"publisher","DOI":"10.1115\/1.1830491"},{"key":"b5","unstructured":"Hu, R. (1997), \u201cSlice automated handling manipulator\u201d,Electronic Industries Special Equipment, January, p. 3942."},{"key":"b14","unstructured":"Lee, J., Chen, Y., Chen, J., Lee, Y. and Chen, Y. (2011), \u201cWafer positioning by laser scanning method\u201d,SICE Annual Conference 2011, Tokyo, Japan, September 13\u201018, pp. 1833\u20101837."},{"key":"b8","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-9317(00)00504-9"},{"key":"b9","unstructured":"Wang, J., Chung, H. and Wu, H. (2004), \u201cEvaluating the 300\u2009mm wafer\u2010handling task in semiconductor industry\u201d,International Journal of Industrial Ergonomics, Vol. 34 No. 459, p. 466."},{"key":"b4","unstructured":"Wang, X. and Zhan, Z. (2003), \u201cA new kind of wafer positioning method\u201d,Electronic Industries Special Equipment, March, pp. 8\u201011."},{"key":"b6","unstructured":"Yang, X. (2002), \u201cThe technology of the border detecting and the prealignment\u201d,Electronic Industries Special Equipment, December, p. 1620."}],"container-title":["Industrial Robot: An International Journal"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/www.emeraldinsight.com\/doi\/full-xml\/10.1108\/IR-09-2012-414","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/www.emeraldinsight.com\/doi\/full\/10.1108\/IR-09-2012-414","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,24]],"date-time":"2025-07-24T21:39:48Z","timestamp":1753393188000},"score":1,"resource":{"primary":{"URL":"http:\/\/www.emerald.com\/ir\/article\/40\/5\/425-432\/181325"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,8,16]]},"references-count":13,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2013,8,16]]}},"alternative-id":["10.1108\/IR-09-2012-414"],"URL":"https:\/\/doi.org\/10.1108\/ir-09-2012-414","relation":{},"ISSN":["0143-991X"],"issn-type":[{"type":"print","value":"0143-991X"}],"subject":[],"published":{"date-parts":[[2013,8,16]]}}}