{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T17:26:29Z","timestamp":1754155589214,"version":"3.41.2"},"reference-count":22,"publisher":"Emerald","issue":"1","license":[{"start":{"date-parts":[[2021,6,7]],"date-time":"2021-06-07T00:00:00Z","timestamp":1623024000000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.emerald.com\/insight\/site-policies"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["SSMT"],"published-print":{"date-parts":[[2022,1,3]]},"abstract":"<jats:sec>\n<jats:title content-type=\"abstract-subheading\">Purpose<\/jats:title>\n<jats:p>This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures.<\/jats:p>\n<\/jats:sec>\n<jats:sec>\n<jats:title content-type=\"abstract-subheading\">Design\/methodology\/approach<\/jats:title>\n<jats:p>An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process.<\/jats:p>\n<\/jats:sec>\n<jats:sec>\n<jats:title content-type=\"abstract-subheading\">Findings<\/jats:title>\n<jats:p>The results showed that the pullout force is approximately 0.4\u2009N. Comparing this value with the simulated force exerted by the solder wave on the component (<jats:inline-formula id=\"ieq1\">\n<jats:inline-graphic xmlns:xlink=\"http:\/\/www.w3.org\/1999\/xlink\" xlink:href=\"SSMT-12-2020-005701.tif\"\/>\n<m:math xmlns:m=\"http:\/\/www.w3.org\/1998\/Math\/MathML\" display=\"inline\"><m:mo>\u2245<\/m:mo><\/m:math><\/jats:inline-formula> 0.001158\u2009N), it can be concluded that the solder wave does not exert sufficient force to remove a component.<\/jats:p>\n<\/jats:sec>\n<jats:sec>\n<jats:title content-type=\"abstract-subheading\">Originality\/value<\/jats:title>\n<jats:p>This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.<\/jats:p>\n<\/jats:sec>","DOI":"10.1108\/ssmt-12-2020-0057","type":"journal-article","created":{"date-parts":[[2021,6,9]],"date-time":"2021-06-09T09:03:31Z","timestamp":1623229411000},"page":"16-23","source":"Crossref","is-referenced-by-count":2,"title":["Experimental measurements of the shear force on surface mount components simulating the wave soldering process"],"prefix":"10.1108","volume":"34","author":[{"given":"Violeta","family":"Carvalho","sequence":"first","affiliation":[]},{"given":"Bruno","family":"Arcipreste","sequence":"additional","affiliation":[]},{"given":"Delfim","family":"Soares","sequence":"additional","affiliation":[]},{"given":"Lu\u00eds","family":"Ribas","sequence":"additional","affiliation":[]},{"given":"Nelson","family":"Rodrigues","sequence":"additional","affiliation":[]},{"given":"Senhorinha","family":"Teixeira","sequence":"additional","affiliation":[]},{"given":"Jos\u00e9 C.","family":"Teixeira","sequence":"additional","affiliation":[]}],"member":"140","published-online":{"date-parts":[[2021,6,7]]},"reference":[{"year":"2014","first-page":"1","article-title":"Numerical modeling of wave soldering in PCB","key":"key2021123009005066800_ref001"},{"issue":"4","key":"key2021123009005066800_ref002","doi-asserted-by":"crossref","first-page":"289","DOI":"10.1109\/TEPM.2002.807731","article-title":"Development of lead-free wave soldering process","volume":"25","year":"2002","journal-title":"IEEE Transactions on Electronics Packaging Manufacturing"},{"key":"key2021123009005066800_ref003","first-page":"13","article-title":"Effects of solder temperature on pin through-hole during wave soldering: thermal-Fluid structure interaction analysis","volume":"2014","year":"2014","journal-title":"The Scientific World Journal"},{"issue":"1","key":"key2021123009005066800_ref004","doi-asserted-by":"crossref","first-page":"31","DOI":"10.1108\/SSMT-07-2014-0013","article-title":"Thermal fluid-structure interaction of PCB configurations during the wave soldering process","volume":"27","year":"2015","journal-title":"Soldering & Surface Mount Technology"},{"key":"key2021123009005066800_ref005","doi-asserted-by":"crossref","first-page":"45","DOI":"10.1016\/j.simpat.2015.06.001","article-title":"Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology","volume":"57","year":"2015","journal-title":"Simulation Modelling Practice and Theory"},{"key":"key2021123009005066800_ref006","article-title":"Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering","volume":"6","year":"2014","journal-title":"Advances in Mechanical Engineering"},{"issue":"1","key":"key2021123009005066800_ref007","doi-asserted-by":"crossref","first-page":"31","DOI":"10.1109\/34.3865","article-title":"Automatic solder joint inspection","volume":"10","year":"1988","journal-title":"IEEE Transactions on Pattern Analysis and Machine Intelligence"},{"volume-title":"Lead-Free Soldering Development and Reliability, Analisis Pendapatan Dan Tingkat Kesejahteraan Rumah Tangga Petani","year":"2020","key":"key2021123009005066800_ref008"},{"key":"key2021123009005066800_ref08a","doi-asserted-by":"publisher","DOI":"10.1115\/1.4050981","article-title":"Numerical Modeling of the Wave Soldering Process and Experimental Validation","year":"2021","journal-title":"ASME. J. Electron. Packag"},{"issue":"4","key":"key2021123009005066800_ref009","doi-asserted-by":"crossref","first-page":"194","DOI":"10.1108\/SSMT-03-2014-0007","article-title":"Contamination profile on typical printed circuit board assemblies vs soldering process","volume":"26","year":"2014","journal-title":"Soldering & Surface Mount Technology"},{"volume-title":"Printed Circuits Handbook","year":"2008","edition":"6th ed.","key":"key2021123009005066800_ref010"},{"issue":"3","key":"key2021123009005066800_ref011","doi-asserted-by":"crossref","first-page":"157","DOI":"10.1108\/SSMT-07-2019-0024","article-title":"Effect of flux functional group for solder paste formulation towards soldering quality of SAC305\/CNT\/Cu","volume":"32","year":"2020","journal-title":"Soldering & Surface Mount Technology"},{"year":"2002","article-title":"Reflow soldering processes and troubleshooting: SMT, BGA, CSP and, newnes","key":"key2021123009005066800_ref012"},{"issue":"3","key":"key2021123009005066800_ref013","doi-asserted-by":"crossref","first-page":"4604","DOI":"10.1016\/j.eswa.2008.05.016","article-title":"Application of self-organizing maps in analysis of wave soldering process","volume":"36","year":"2009","journal-title":"Expert Systems with Applications"},{"issue":"1","key":"key2021123009005066800_ref014","doi-asserted-by":"crossref","first-page":"214","DOI":"10.1016\/j.asoc.2009.11.011","article-title":"Quality-oriented optimization of wave soldering process by using self-organizing maps","volume":"11","year":"2011","journal-title":"Applied Soft Computing Journal"},{"key":"key2021123009005066800_ref015","doi-asserted-by":"crossref","first-page":"69","DOI":"10.1016\/j.microrel.2017.10.011","article-title":"Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering","volume":"79","year":"2017","journal-title":"Microelectronics Reliability"},{"key":"key2021123009005066800_ref016","first-page":"1","article-title":"A numerical study of solder paste rolling process for PCB printing","year":"2018","journal-title":"ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)"},{"issue":"3","key":"key2021123009005066800_ref017","doi-asserted-by":"crossref","first-page":"133","DOI":"10.1108\/SSMT-01-2017-0003","article-title":"Thermal decomposition of solder flux activators under simulated wave soldering conditions","volume":"29","year":"2017","journal-title":"Soldering & Surface Mount Technology"},{"key":"key2021123009005066800_ref018","first-page":"2006","article-title":"Experimental and numerical study of the effect of plastic ball grid array package placement on PWB warpage during convective solder reflow","volume-title":"IMECE","year":"2006"},{"key":"key2021123009005066800_ref019","first-page":"81","article-title":"Printed circuit board (PCB): design and test","year":"2019","journal-title":"Hardware Security: A Hands-On Learning Approach"},{"key":"key2021123009005066800_ref020","doi-asserted-by":"crossref","first-page":"308","DOI":"10.1016\/j.jhazmat.2011.12.030","article-title":"Identification and chemical characterization of particulate matter from wave soldering processes at a printed circuit board manufacturing company","volume":"203\/204","year":"2012","journal-title":"Journal of Hazardous Materials"},{"issue":"4","key":"key2021123009005066800_ref021","doi-asserted-by":"crossref","first-page":"150","DOI":"10.11648\/j.sr.20150304.13","article-title":"Optimisation of reflow profile of surface mount assembly using Taguchi design of experiments","volume":"3","year":"2015","journal-title":"Science Research"}],"container-title":["Soldering &amp; Surface Mount Technology"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.emerald.com\/insight\/content\/doi\/10.1108\/SSMT-12-2020-0057\/full\/xml","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.emerald.com\/insight\/content\/doi\/10.1108\/SSMT-12-2020-0057\/full\/html","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,24]],"date-time":"2025-07-24T21:47:38Z","timestamp":1753393658000},"score":1,"resource":{"primary":{"URL":"http:\/\/www.emerald.com\/ssmt\/article\/34\/1\/16-23\/373404"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,6,7]]},"references-count":22,"journal-issue":{"issue":"1","published-online":{"date-parts":[[2021,6,7]]},"published-print":{"date-parts":[[2022,1,3]]}},"alternative-id":["10.1108\/SSMT-12-2020-0057"],"URL":"https:\/\/doi.org\/10.1108\/ssmt-12-2020-0057","relation":{},"ISSN":["0954-0911","0954-0911"],"issn-type":[{"type":"print","value":"0954-0911"},{"type":"print","value":"0954-0911"}],"subject":[],"published":{"date-parts":[[2021,6,7]]}}}