{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,6]],"date-time":"2026-04-06T05:51:49Z","timestamp":1775454709283,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306543","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-9","source":"Crossref","is-referenced-by-count":25,"title":["Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration"],"prefix":"10.1109","author":[{"given":"Zheng","family":"Xu","sequence":"first","affiliation":[]},{"given":"Adam","family":"Beece","sequence":"additional","affiliation":[]},{"given":"Kenneth","family":"Rose","sequence":"additional","affiliation":[]},{"given":"Tong","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Jian-Qiang","family":"Lu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","author":"bakir","year":"2009","journal-title":"Integrated Interconnect Technologies for 3D Nanoelectronic Systems"},{"key":"2","first-page":"44","article-title":"3-d ics enter commercialization","author":"garrou","year":"2008","journal-title":"Semicond Int Mag"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007458"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1557\/PROC-0970-Y01-01"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007473"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.852782"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1557\/PROC-0970-Y02-04"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550027"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2009,9,28]]},"end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306543.pdf?arnumber=5306543","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T04:11:01Z","timestamp":1489896661000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306543\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306543","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}