{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,18]],"date-time":"2026-01-18T12:43:32Z","timestamp":1768740212778,"version":"3.49.0"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306545","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-5","source":"Crossref","is-referenced-by-count":16,"title":["Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation"],"prefix":"10.1109","author":[{"given":"Dau Fatt","family":"Lim","sequence":"first","affiliation":[]},{"given":"Shiv Govind","family":"Singh","sequence":"additional","affiliation":[]},{"given":"Xiao Fang","family":"Ang","sequence":"additional","affiliation":[]},{"given":"Jun","family":"Wei","sequence":"additional","affiliation":[]},{"given":"Chee Mang","family":"Ng","sequence":"additional","affiliation":[]},{"given":"Chuan Seng","family":"Tan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","article-title":"sun s. lee, yunsoo kim thermal decomposition of octanethiolate self-assembled monolayers on cu(111) in uhv","volume":"24","author":"myung","year":"2003","journal-title":"Bull Korean Chem Soc"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1021\/cr0300789"},{"key":"1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1007\/978-0-387-76534-1_1","article-title":"overview of wafer- level 3d ics","author":"tan","year":"2008","journal-title":"Wafer Level 3-D ICs Process Technology"},{"key":"7","doi-asserted-by":"crossref","first-page":"400","DOI":"10.1016\/j.apsusc.2005.01.019","article-title":"oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol","volume":"252","author":"hutt","year":"2005","journal-title":"Applied Surface Science"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1021\/la980333y"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1149\/1.2404781"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1021\/jp992995h"},{"key":"9","first-page":"149","author":"carbonell","year":"2004","journal-title":"A thermal stability study of alkane and aromatic thiolate selfassembled monolayers on copper surfaces"},{"key":"8","doi-asserted-by":"crossref","first-page":"1508","DOI":"10.2320\/matertrans.MF200804","article-title":"effect of surface contamination on solid-state bondability of sn-ag-cu bumps in ambient air","volume":"49","author":"ying-hui","year":"2008","journal-title":"Materials Transactions"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2009,9,28]]},"end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306545.pdf?arnumber=5306545","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T01:28:06Z","timestamp":1497835686000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306545\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306545","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}