{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T13:49:48Z","timestamp":1725630588000},"reference-count":3,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306547","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T13:42:09Z","timestamp":1257428529000},"page":"1-6","source":"Crossref","is-referenced-by-count":9,"title":["Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking"],"prefix":"10.1109","author":[{"given":"E.","family":"Eid","sequence":"first","affiliation":[]},{"given":"T.","family":"Lacrevaz","sequence":"additional","affiliation":[]},{"given":"S.","family":"de Rivaz","sequence":"additional","affiliation":[]},{"given":"C.","family":"Bermond","sequence":"additional","affiliation":[]},{"given":"B.","family":"Flechet","sequence":"additional","affiliation":[]},{"given":"F.","family":"Calmon","sequence":"additional","affiliation":[]},{"given":"C.","family":"Gontrand","sequence":"additional","affiliation":[]},{"given":"A.","family":"Farcy","sequence":"additional","affiliation":[]},{"given":"L.","family":"Cadix","sequence":"additional","affiliation":[]},{"given":"P.","family":"Ancey","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"year":"0","key":"3"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2002.1033789"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.504.0491"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306547.pdf?arnumber=5306547","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T00:38:05Z","timestamp":1489883885000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306547\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":3,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306547","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}