{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,3]],"date-time":"2025-10-03T09:34:38Z","timestamp":1759484078177},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306552","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T13:42:09Z","timestamp":1257428529000},"page":"1-4","source":"Crossref","is-referenced-by-count":4,"title":["Etch, dielectrics and metal barrier-seed for low temperature through-silicon via processing"],"prefix":"10.1109","author":[{"given":"Keith","family":"Buchanan","sequence":"first","affiliation":[]},{"given":"Stephen","family":"Burgess","sequence":"additional","affiliation":[]},{"given":"Kathrine","family":"Giles","sequence":"additional","affiliation":[]},{"given":"Matthew","family":"Muggeridge","sequence":"additional","affiliation":[]},{"given":"Hao","family":"Zhao","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1016\/S0167-9317(02)00787-6"},{"key":"2","first-page":"88","author":"takahashi","year":"2006","journal-title":"Through silicon via and 3-D wafer\/chip stacking technology VLSI Circuits"},{"key":"1","article-title":"the promise of through silicon vias","author":"arkalgud","year":"2009","journal-title":"DATE 2009 Workshop on 3D integration"},{"year":"0","key":"5"},{"key":"4","doi-asserted-by":"crossref","DOI":"10.1088\/0960-1317\/18\/7\/075018","article-title":"a study of thermo-mechanical stress and its impact on throughsilicon vias","author":"ranganathan","year":"2008","journal-title":"J Micromech Microeng"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306552.pdf?arnumber=5306552","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T21:28:06Z","timestamp":1497821286000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306552\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306552","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}