{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:14:26Z","timestamp":1730193266972,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306558","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["Delay analysis and design exploration for 3D SRAM"],"prefix":"10.1109","author":[{"given":"Xi","family":"Chen","sequence":"first","affiliation":[]},{"given":"W. Rhett","family":"Davis","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"13","DOI":"10.1109\/4.823443"},{"year":"0","author":"rabaey","journal-title":"Digital Integrated Circuits A Design Perspective Second edition","key":"14"},{"year":"0","key":"11"},{"doi-asserted-by":"publisher","key":"12","DOI":"10.1109\/ASIC.2001.954688"},{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/5.929647"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1145\/337292.337394"},{"year":"2008","key":"1"},{"doi-asserted-by":"publisher","key":"10","DOI":"10.1109\/MDT.2005.136"},{"year":"2008","author":"thoziyoor","journal-title":"CACTI 5 1","key":"7"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1109\/MICRO.2006.18"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1145\/1148015.1148016"},{"key":"4","article-title":"mitigating memory wall effects in high-clock-rate and multicore cmos 3-d processor memory stacks","volume":"97","author":"philip jacob","year":"2009","journal-title":"Proceedings of the IEEE"},{"doi-asserted-by":"publisher","key":"9","DOI":"10.1109\/MDT.2005.138"},{"doi-asserted-by":"publisher","key":"8","DOI":"10.1109\/ICCD.2005.108"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306558.pdf?arnumber=5306558","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T06:16:46Z","timestamp":1489817806000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306558\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306558","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}