{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,23]],"date-time":"2025-10-23T11:01:40Z","timestamp":1761217300677,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306561","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-7","source":"Crossref","is-referenced-by-count":16,"title":["3D integration technology for set-top box application"],"prefix":"10.1109","author":[{"given":"D.","family":"Henry","sequence":"first","affiliation":[]},{"given":"S.","family":"Cheramy","sequence":"additional","affiliation":[]},{"given":"J.","family":"Charbonnier","sequence":"additional","affiliation":[]},{"given":"P.","family":"Chausse","sequence":"additional","affiliation":[]},{"given":"M.","family":"Neyret","sequence":"additional","affiliation":[]},{"given":"C.","family":"Brunet-Manquat","sequence":"additional","affiliation":[]},{"given":"S.","family":"Verrun","sequence":"additional","affiliation":[]},{"given":"N.","family":"Sillon","sequence":"additional","affiliation":[]},{"given":"L.","family":"Bonnot","sequence":"additional","affiliation":[]},{"given":"X.","family":"Gagnard","sequence":"additional","affiliation":[]},{"given":"E.","family":"Saugier","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074114"},{"year":"0","key":"2"},{"key":"1","article-title":"3d integration program overview","author":"bonnot","year":"2009","journal-title":"DATE 2009"},{"key":"7","article-title":"3d integration by through-silicon-via (tsv) processing enabled by temporary bonding and debonding technology","author":"pargfrieder","year":"2009","journal-title":"Advanced Packaging"},{"key":"6","first-page":"9","volume":"eptc 2008","author":"henry","year":"2008","journal-title":"Through silicon vias technology for cmos image sensors packaging Presentation of technology and electrical results"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4549951"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373900"},{"year":"0","key":"8"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306561.pdf?arnumber=5306561","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T06:27:11Z","timestamp":1489818431000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306561\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306561","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}